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    • 9. 发明授权
    • Method of sputtering a carbon protective film on a magnetic disk by
superimposing an AC voltage on a DC bias voltage
    • 通过将AC电压叠加在DC偏置电压上来将碳保护膜溅射在磁盘上的方法
    • US5507930A
    • 1996-04-16
    • US299852
    • 1994-09-01
    • Tsutomu T. YamashitaKyou H. LeeRajiv Y. RanjanYuri Trachuk
    • Tsutomu T. YamashitaKyou H. LeeRajiv Y. RanjanYuri Trachuk
    • C23C14/06C23C14/34C23C14/35G11B5/72G11B5/84H01F41/18
    • C23C14/35C23C14/0605G11B5/722G11B5/8408
    • A carbon film for protecting a magnetic disk is sputtered by a DC magnetron sputtering method, with the addition of superimposed AC power on the DC power applied to the carbon target. When the carbon film is sputtered for extended period in a production sputtering machine, nodular growth occurs over the sputtering surface of the carbon target. Such nodules are variously called "warts" or "mushrooms" in the industry and they are detrimental to the productivity of the sputtering machine. The size and quantity of the nodules over the target surface increase as the target is sputtered longer, and because these region do not contribute to sputtering, the efficiency of the target decreases. As sputter efficiency decreases, power input must be increased to the target to make up for the loss in the effective sputtering area of the target. Eventually, the power input must be increased to a point where arcing occurs continuously and sputtering cannot be continued. By superimposing AC power onto the DC power applied to the target, virtually all arcing on the carbon target is eliminated, thereby significantly reducing the nodular growth and extending the use of the target.
    • 通过直流磁控溅射法溅射用于保护磁盘的碳膜,对施加到碳靶的DC电力加上叠加的AC电力。 当碳膜在生产溅射机中长时间溅射时,在碳靶的溅射表面上发生结核生长。 这种结节在工业中被称为“疣”或“蘑菇”,并且它们不利于溅射机的生产率。 目标表面上的结节的大小和数量随着靶溅射时间的延长而增加,并且由于这些区域对溅射没有贡献,因此靶的效率降低。 随着溅射效率的降低,必须将功率输入增加到目标,以弥补目标有效溅射区域的损耗。 最终,电源输入必须增加到连续发生电弧的点,溅射不能继续。 通过将AC电力叠加到施加到目标的DC电力上,实际上消除了碳靶上的所有电弧,从而显着降低了结节生长并延长了靶的使用。