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    • 3. 发明申请
    • REDUCTION OF CARROT DEFECTS IN SILICON CARBIDE EPITAXY
    • 减少碳化硅外壳中的卡扣缺陷
    • US20080054412A1
    • 2008-03-06
    • US11745817
    • 2007-05-08
    • Michael O'LoughlinJoseph Sumakeris
    • Michael O'LoughlinJoseph Sumakeris
    • H01L29/04H01L21/36
    • C30B25/02C03B23/02C30B29/36H01L21/02019H01L21/30621
    • Single crystal silicon carbide epitaxial layer on an off-axis substrate are manufactured by placing the substrate in an epitaxial growth reactor, growing a first layer of epitaxial silicon carbide on the substrate, interrupting the growth of the first layer of epitaxial silicon carbide, etching the first layer of epitaxial silicon carbide to reduce the thickness of the first layer, and regrowing a second layer of epitaxial silicon carbide on the first layer of epitaxial silicon carbide. Carrot defects may be terminated by the process of interrupting the epitaxial growth process, etching the grown layer and regrowing a second layer of epitaxial silicon carbide. The growth interruption/etching/regrowth may be repeated multiple times. A silicon carbide epitaxial layer has at least one carrot defect that is terminated within the epitaxial layer. A semiconductor stricture includes an epitaxial layer of silicon carbide on an off-axis silicon carbide substrate, and a carrot defect having a nucleation point in the vicinity of an interface between the substrate and the epitaxial layer and is terminated within the epitaxial layer.
    • 通过将衬底放置在外延生长反应器中,在衬底上生长第一层外延碳化硅,中断外延碳化硅的第一层的生长,蚀刻外延碳化硅的第一层,制造脱轴衬底上的单晶碳化硅外延层 第一层外延碳化硅以减小第一层的厚度,以及在第一层外延碳化硅上再生第二层外延碳化硅。 胡萝卜缺陷可以通过中断外延生长过程,蚀刻生长层和再生第二层外延碳化硅的过程来终止。 生长中断/蚀刻/再生长可以重复多次。 碳化硅外延层具有端接在外延层内的至少一个胡萝卜缺陷。 半导体狭缝包括在离轴碳化硅衬底上的碳化硅外延层和胡萝卜缺陷,其具有在衬底和外延层之间的界面附近的成核点并终止在外延层内。
    • 4. 发明申请
    • REDUCTION OF CARROT DEFECTS IN SILICON CARBIDE EPITAXY
    • 减少碳化硅外壳中的卡扣缺陷
    • US20070108450A1
    • 2007-05-17
    • US10790406
    • 2004-03-01
    • Michael O'LoughlinJoseph Sumakeris
    • Michael O'LoughlinJoseph Sumakeris
    • H01L31/0312H01L21/302H01L29/15
    • C30B25/02C03B23/02C30B29/36H01L21/02019H01L21/30621
    • Single crystal silicon carbide epitaxial layer on an off-axis substrate are manufactured by placing the substrate in an epitaxial growth reactor, growing a first layer of epitaxial silicon carbide on the substrate, interrupting the growth of the first layer of epitaxial silicon carbide, etching the first layer of epitaxial silicon carbide to reduce the thickness of the first layer, and regrowing a second layer of epitaxial silicon carbide on the first layer of epitaxial silicon carbide. Carrot defects may be terminated by the process of interrupting the epitaxial growth process, etching the grown layer and regrowing a second layer of epitaxial silicon carbide. The growth interruption/etching/regrowth may be repeated multiple times. A silicon carbide epitaxial layer has at least one carrot defect that is terminated within the epitaxial layer. A semiconductor structure includes an epitaxial layer of silicon carbide on an off-axis silicon carbide substrate, and a carrot defect having a nucleation point in the vicinity of an interface between the substrate and the epitaxial layer and is terminated within the epitaxial layer.
    • 通过将衬底放置在外延生长反应器中,在衬底上生长第一层外延碳化硅,中断外延碳化硅的第一层的生长,蚀刻外延碳化硅的第一层,制造脱轴衬底上的单晶碳化硅外延层 第一层外延碳化硅以减小第一层的厚度,以及在第一层外延碳化硅上再生第二层外延碳化硅。 胡萝卜缺陷可以通过中断外延生长过程,蚀刻生长层和再生第二层外延碳化硅的过程来终止。 生长中断/蚀刻/再生长可以重复多次。 碳化硅外延层具有端接在外延层内的至少一个胡萝卜缺陷。 半导体结构包括在偏轴碳化硅衬底上的碳化硅外延层和在衬底和外延层之间的界面附近具有成核点的胡萝卜缺陷,并且终止在外延层内。
    • 5. 发明申请
    • Deposition systems and susceptor assemblies for depositing a film on a substrate
    • 用于在衬底上沉积膜的沉积系统和感受器组件
    • US20070101939A1
    • 2007-05-10
    • US11512800
    • 2006-08-29
    • Joseph SumakerisMichael PaisleyMichael O'Loughlin
    • Joseph SumakerisMichael PaisleyMichael O'Loughlin
    • C23C16/00
    • C23C16/45519C23C16/4401C23C16/455C23C16/488
    • Parasitic deposits are controlled in a deposition system for depositing a film on a substrate, the deposition system of the type defining a reaction chamber for receiving the substrate and including a process gas in the reaction chamber and an interior surface contiguous with the reaction chamber. Such control is provided by flowing a buffer gas between the interior surface and at least a portion of the process gas to form a gas barrier layer such that the gas barrier layer inhibits contact between the interior surface and components of the process gas. A deposition system for depositing a film on a substrate using a process gas includes a reaction chamber adapted to receive the substrate and the process gas. The system further includes an interior surface contiguous with the reaction chamber. A buffer gas supply system is adapted to supply a flow of a buffer gas between the interior surface and at least a portion of the process gas such that the flow of the buffer gas forms a gas barrier layer to inhibit contact between the interior surface and components of the process gas when the process gas is disposed in the reaction chamber.
    • 寄生沉积物被控制在用于在基底上沉积膜的沉积系统中,这种类型的沉积系统限定用于接收基底的反应室,并且在反应室中包括处理气体和与反应室邻接的内表面。 通过在内表面和至少一部分处理气体之间流动缓冲气体以形成阻气层来提供这种控制,使得气体阻隔层抑制处理气体的内表面和组分之间的接触。 用于使用工艺气体在衬底上沉积膜的沉积系统包括适于接收衬底和工艺气体的反应室。 该系统还包括与反应室邻接的内表面。 缓冲气体供应系统适于在内表面和处理气体的至少一部分之间提供缓冲气体流,使得缓冲气体的流动形成阻气层,以阻止内表面和部件之间的接触 当处理气体设置在反应室中时,该工艺气体。