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1. 发明授权

US10992308B1 In-situ measurement of the delay between the envelope and the RF signal in envelope-tracking systems 有权
公开(公告)号：US10992308B1
公开(公告)日：2021-04-27
申请号：US16862385
申请日：2020-04-29
申请人： QUALCOMM Incorporated
发明人： Chirag Sthalekar , Leon Metreaud , Hakan Inanoglu , Xiangdong Zhang
IPC分类号： H03M1/50 , H03M1/18 , G04F10/10 , G04F10/00
摘要： An in-situ delay measurement is performed for an envelope-tracking power amplifier of an RF input signal. Because the delay measurement is in-situ, the delay measurement avoids the necessity to down convert and digitize a version of an RF output signal from the envelope-tracking power amplifier.

2. 发明授权

US10354795B2 Varying thickness inductor 有权
公开(公告)号：US10354795B2
公开(公告)日：2019-07-16
申请号：US15242007
申请日：2016-08-19
申请人： QUALCOMM Incorporated
发明人： Daeik Daniel Kim , Chengjie Zuo , Changhan Hobie Yun , Mario Francisco Velez , Robert Paul Mikulka , Xiangdong Zhang , Jonghae Kim , Je-Hsiung Lan
IPC分类号： H01F7/06 , H01F41/04 , H01F27/28 , H01F17/00
摘要： A method includes forming a first conductive spiral and a second conductive spiral of a spiral inductor coupled to a substrate. The second conductive spiral overlays the first conductive spiral. A first portion of an innermost turn of the spiral inductor has a first thickness in a direction perpendicular to the substrate. The first portion of the innermost turn includes a first portion of the first conductive spiral and does not include the second conductive spiral. A second portion of the innermost turn includes a first portion of the second conductive spiral. A portion of an outermost turn of the spiral inductor has a second thickness in the direction perpendicular to the substrate. The second thickness is greater than the first thickness. The portion of the outermost turn includes a second portion of the first conductive spiral and a second portion of the second conductive spiral.

3. 发明申请

US20140197902A1 DIPLEXER DESIGN USING THROUGH GLASS VIA TECHNOLOGY 有权
标题翻译：使用通过玻璃技术的DIPLEX设计
公开(公告)号：US20140197902A1
公开(公告)日：2014-07-17
申请号：US13798733
申请日：2013-03-13
申请人： QUALCOMM INCORPORATED
发明人： Chengjie Zuo , Jonghae Kim , Mario Francisco Velez , Je-Hsiung Lan , Daeik D. Kim , Changhan Yun , David F. Berdy , Robert P. Mikulka , Matthew M. Nowak , Xiangdong Zhang , Puay H. See
IPC分类号： H03H7/46 , H03H3/00
CPC分类号： H03H7/461 , H01F2017/0026 , H01F2017/004 , H01L23/15 , H01L23/481 , H01L23/49827 , H01L23/5223 , H01L23/5227 , H01L23/64 , H01L23/66 , H01L2924/0002 , H03H3/00 , H03H7/1758 , H03H7/1766 , H03H7/1791 , H03H7/463 , H03H2001/0021 , H05K1/0233 , H05K1/0306 , H05K1/165 , H05K2201/09627 , H05K2201/09672 , H05K2201/10015 , H05K2201/10098 , Y10T29/49128 , H01L2924/00
摘要： A diplexer includes a substrate having a set of through substrate vias. The diplexer also includes a first set of traces on a first surface of the substrate. The first traces are coupled to the through substrate vias. The diplexer further includes a second set of traces on a second surface of the substrate that is opposite the first surface. The second traces are coupled to opposite ends of the set of through substrate vias. The through substrate vias and the traces also operate as a 3D inductor. The diplexer also includes a capacitor supported by the substrate.
摘要翻译：双工器包括具有一组通过衬底通孔的衬底。双工器还包括在衬底的第一表面上的第一组迹线。第一迹线耦合到贯穿衬底通孔。双工器还包括与第一表面相对的在衬底的第二表面上的第二组迹线。第二迹线耦合到该组通过衬底通孔的相对端。贯通衬底通孔和迹线也作为3D电感器工作。双工器还包括由基板支撑的电容器。

4. 发明授权

US11509269B2 Radio frequency (RF) amplifier bias circuit 有权
公开(公告)号：US11509269B2
公开(公告)日：2022-11-22
申请号：US16995468
申请日：2020-08-17
申请人： QUALCOMM INCORPORATED
发明人： Jisun Ryu , Yan Kit Gary Hau , Guoqing Fu , Xinwei Wang , Xiangdong Zhang , Chenliang Du
IPC分类号： H03F1/30 , H03F3/21
摘要： An amplifier circuit includes an amplifier configured to receive a radio frequency (RF) input signal from an input node, a bias circuit comprising a reference transistor coupled between a reference current source and ground, and a bias transistor coupled to the reference transistor and configured to generate a main bias current to bias the amplifier, an input power sense circuit coupled to the input node, and an additional transistor coupled to the input power sense circuit and to the bias transistor, the additional transistor configured to generate an additional bias current to bias the amplifier, the additional bias current responsive to a power level of the RF input signal.

5. 发明授权

US10979002B2 Current-limiting circuit for a power amplifier 有权
公开(公告)号：US10979002B2
公开(公告)日：2021-04-13
申请号：US16031834
申请日：2018-07-10
申请人： QUALCOMM Incorporated
发明人： Jing-Hwa Chen , Jisun Ryu , Yan Kit Gary Hau , Yanjie Sun , Xinwei Wang , Xiangdong Zhang
IPC分类号： H03F1/52 , H03F3/191 , H03F1/30 , H03F3/24 , H03F1/32 , G05F3/22 , H03F1/02 , H03F3/21
摘要： Certain aspects of the present disclosure provide methods and apparatus for current-limiting protection of an amplifier, such as a power amplifier in a radio frequency (RF) front-end. One example current-limiting circuit generally includes a node coupled to a current source, a plurality of current-sinking devices coupled to the node, one or more switches coupled between the node and at least one of the plurality of current-sinking devices, and a bias circuit having an input coupled to the node and an output for coupling to an input of the amplifier.

6. 发明授权

US09467196B2 Quadrature current-combining linearizing circuit for generating arbitrary phase and amplitude 有权
标题翻译：用于产生任意相位和幅度的正交电流组合线性化电路
公开(公告)号：US09467196B2
公开(公告)日：2016-10-11
申请号：US14173085
申请日：2014-02-05
申请人： QUALCOMM Incorporated
发明人： James Francis Imbornone , Xinwei Wang , Marc Gerald Dicicco , Frederic Carrez , Zhenying Luo , Xiangdong Zhang
IPC分类号： H04B1/40 , H04B1/48 , H04B1/04 , H04B1/00
CPC分类号： H04B1/48 , H04B1/0057 , H04B1/0475 , H04B2001/485
摘要： A device includes a first circuit path coupled to a first node and a second node, the first circuit path having at least one first varactor circuit configured to receive a first tuning voltage, the first circuit path having a resistor with a selectable value, and a second circuit path coupled to the first node and the second node, the second circuit path having at least one second varactor circuit configured to receive a second tuning voltage, the second circuit path having a capacitor with a selectable value.
摘要翻译：一种设备包括耦合到第一节点和第二节点的第一电路路径，第一电路路径具有被配置为接收第一调谐电压的至少一个第一变容二极管电路，第一电路路径具有可选择值的电阻器，以及第二电路路径，其耦合到第一节点和第二节点，第二电路路径具有被配置为接收第二调谐电压的至少一个第二变容二极管电路，第二电路路径具有具有可选择值的电容器。

7. 发明授权

US09401689B2 Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods 有权
公开(公告)号：US09401689B2
公开(公告)日：2016-07-26
申请号：US13887568
申请日：2013-05-06
申请人： QUALCOMM Incorporated
发明人： Chengjie Zuo , Daeik D. Kim , Je-Hsiung Lan , Jonghae Kim , Mario Francisco Velez , Changhan Yun , David F. Berdy , Robert P. Mikulka , Matthew M. Nowak , Xiangdong Zhang , Puay H. See
IPC分类号： H03H7/46
摘要： Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.

8. 发明申请

US20160204758A1 TUNABLE DIPLEXERS IN THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (IC) (3DIC) AND RELATED COMPONENTS AND METHODS 有权
标题翻译：三维（3D）集成电路（IC）（3DIC）及相关组件和方法中的可执行程序
公开(公告)号：US20160204758A1
公开(公告)日：2016-07-14
申请号：US15079789
申请日：2016-03-24
申请人： QUALCOMM Incorporated
发明人： Chengjie Zuo , Daeik D. Kim , Je-Hsiung Lan , Jonghae Kim , Mario Francisco Velez , Changhan Yun , David F. Berdy , Robert P. Mikulka , Matthew M. Nowak , Xiangdong Zhang , Puay H. See
IPC分类号： H03H7/46 , H03H7/01 , H03H3/00
CPC分类号： H03H7/461 , H03H3/00 , H03H7/0115 , H03H7/463 , Y10T29/49016
摘要： Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.
摘要翻译：公开了三维（3D）集成电路（IC）（3DIC）中的可调谐双工器。在一个实施例中，可调谐双工器可以通过在双工器中提供变容二极管或可变电感器之一来形成。可变电抗器或可变电感器的可变特性允许调谐双工器中的陷波，以便选择频带停止以消除期望频率处的谐波以及控制通带的截止频率。通过将双工器的元件堆叠成三维空间是保守的，并且可以使用各种变容二极管和电感器。

9. 发明授权

US09392558B2 Control of transmit power and adjustment of antenna tuning network of a wireless device 有权
标题翻译：发射功率的控制和无线设备天线调谐网络的调整
公开(公告)号：US09392558B2
公开(公告)日：2016-07-12
申请号：US13667160
申请日：2012-11-02
申请人： QUALCOMM Incorporated
发明人： Puay Hoe See , Xiangdong Zhang
IPC分类号： H04B1/40 , H04W52/36 , H04B17/12
CPC分类号： H04W52/367 , H04B17/12
摘要： Techniques for controlling transmit power and adjusting an antenna tuning network of a wireless device are disclosed. In an exemplary design, an apparatus (e.g., a wireless device or a circuit module) includes a directional coupler and at least one detector. The directional coupler receives an input radio frequency (RF) signal at a first port, provides an output RF signal at a second port, and provides a coupled RF signal at a third port. The detector(s) receive at least one RF signal on at least one port of the directional coupler, measure the at least one RF signal, and provide measurements that are used to control the transmit power of the wireless device and adjust an antenna tuning network. For example, the measurements may be used to determine incident power, reflected power, delivered power, etc., which may be used to control the transmit power and/or adjust the antenna tuning network.
摘要翻译：公开了用于控制无线设备的发射功率和调整天线调谐网络的技术。在示例性设计中，设备（例如，无线设备或电路模块）包括定向耦合器和至少一个检测器。定向耦合器在第一端口处接收输入射频（RF）信号，在第二端口处提供输出RF信号，并在第三端口处提供耦合的RF信号。检测器在定向耦合器的至少一个端口上接收至少一个RF信号，测量至少一个RF信号，并提供用于控制无线设备的发射功率并调整天线调谐网络。例如，可以使用测量来确定可用于控制发射功率和/或调整天线调谐网络的入射功率，反射功率，传送功率等。

10. 发明授权

US09203373B2 Diplexer design using through glass via technology 有权
标题翻译：双工器设计采用玻璃通过技术
公开(公告)号：US09203373B2
公开(公告)日：2015-12-01
申请号：US13798733
申请日：2013-03-13
申请人： QUALCOMM Incorporated
发明人： Chengjie Zuo , Jonghae Kim , Mario Francisco Velez , Je-Hsiung Lan , Daeik D. Kim , Changhan Yun , David F. Berdy , Robert P. Mikulka , Matthew M. Nowak , Xiangdong Zhang , Puay H. See
IPC分类号： H03H7/46 , H03H3/00 , H05K1/16 , H01L23/64 , H03H1/00 , H01L23/15 , H01L23/498 , H03H7/01 , H01F17/00 , H01L23/48 , H01L23/522 , H05K1/02 , H05K1/03 , H01L23/66
CPC分类号： H03H7/461 , H01F2017/0026 , H01F2017/004 , H01L23/15 , H01L23/481 , H01L23/49827 , H01L23/5223 , H01L23/5227 , H01L23/64 , H01L23/66 , H01L2924/0002 , H03H3/00 , H03H7/1758 , H03H7/1766 , H03H7/1791 , H03H7/463 , H03H2001/0021 , H05K1/0233 , H05K1/0306 , H05K1/165 , H05K2201/09627 , H05K2201/09672 , H05K2201/10015 , H05K2201/10098 , Y10T29/49128 , H01L2924/00
摘要： A diplexer includes a substrate having a set of through substrate vias. The diplexer also includes a first set of traces on a first surface of the substrate. The first traces are coupled to the through substrate vias. The diplexer further includes a second set of traces on a second surface of the substrate that is opposite the first surface. The second traces are coupled to opposite ends of the set of through substrate vias. The through substrate vias and the traces also operate as a 3D inductor. The diplexer also includes a capacitor supported by the substrate.
摘要翻译：双工器包括具有一组通过衬底通孔的衬底。双工器还包括在衬底的第一表面上的第一组迹线。第一迹线耦合到贯穿衬底通孔。双工器还包括与第一表面相对的在衬底的第二表面上的第二组迹线。第二迹线耦合到该组通过衬底通孔的相对端。贯通衬底通孔和迹线也作为3D电感器工作。双工器还包括由基板支撑的电容器。

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