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    • 4. 发明申请
    • HIGH VOLTAGE GaN TRANSISTORS
    • 高电压GaN晶体管
    • US20110114997A1
    • 2011-05-19
    • US13014619
    • 2011-01-26
    • YIFENG WUPrimit ParikhUmesh Mishra
    • YIFENG WUPrimit ParikhUmesh Mishra
    • H01L29/778
    • H01L29/7787H01L29/2003H01L29/404H01L29/66462H01L29/7786
    • A multiple field plate transistor includes an active region, with a source, a drain, and a gate. A first spacer layer is over the active region between the source and the gate and a second spacer layer over the active region between the drain and the gate. A first field plate on the first spacer layer is connected to the gate. A second field plate on the second spacer layer is connected to the gate. A third spacer layer is on the first spacer layer, the second spacer layer, the first field plate, the gate, and the second field plate, with a third field plate on the third spacer layer and connected to the source. The transistor exhibits a blocking voltage of at least 600 Volts while supporting a current of at least 2 Amps with an on resistance of no more than 5.0 mΩ-cm2, of at least 600 Volts while supporting a current of at least 3 Amps with an on resistance of no more than 5.3 mΩ-cm2, of at least 900 Volts while supporting a current of at least 2 Amps with an on resistance of no more than 6.6 mΩ-cm2, or a blocking voltage of at least 900 Volts while supporting a current of at least 3 Amps with an on resistance of no more than 7.0 mΩ-cm2.
    • 多场板晶体管包括有源区,源极,漏极和栅极。 第一间隔层在源极和栅极之间的有源区上方,并且在漏极和栅极之间的有源区上方具有第二间隔层。 第一间隔层上的第一场板连接到栅极。 第二间隔层上的第二场板连接到栅极。 第三间隔层位于第一间隔层,第二间隔层,第一场板,栅极和第二场板上,在第三间隔层上具有第三场板并连接到源极。 晶体管表现出至少600伏特的阻断电压,同时支持至少2安培的电流,其导通电阻不超过5.0mΩ(OHgr·-cm2)为至少600伏,同时支持至少3安培的电流 耐电压不超过5.3mΩ,OHgr--cm2,至少900V,同时支持至少2安培的电流,导通电阻不超过6.6mΩ,OHgr-cm2,或阻断电压至少为900V,同时 支持至少3安培的电流,导通电阻不超过7.0mΩ,OHgr; -cm2。
    • 8. 发明授权
    • Gallium nitride based diodes with low forward voltage and low reverse current operation
    • 具有低正向电压和低反向电流操作的氮化镓基二极管
    • US07476956B2
    • 2009-01-13
    • US10445130
    • 2003-05-20
    • Primit ParikhUmesh Mishra
    • Primit ParikhUmesh Mishra
    • H01L27/095H01L29/812H01L31/108
    • H01L29/475H01L29/2003H01L29/872H01L29/88
    • New Group III based diodes are disclosed having a low on state voltage (Vf) and structures to keep reverse current (Irev) relatively low. One embodiment of the invention is Schottky barrier diode made from the GaN material system in which the Fermi level (or surface potential) of is not pinned. The barrier potential at the metal-to-semiconductor junction varies depending on the type of metal used and using particular metals lowers the diode's Schottky barrier potential and results in a Vf in the range of 0.1-0.3V. In another embodiment a trench structure is formed on the Schottky diodes semiconductor material to reduce reverse leakage current. and comprises a number of parallel, equally spaced trenches with mesa regions between adjacent trenches. A third embodiment of the invention provides a GaN tunnel diode with a low Vf resulting from the tunneling of electrons through the barrier potential, instead of over it. This embodiment can also have a trench structure to reduce reverse leakage current.
    • 公开了具有低导通状态电压(Vf)和保持反向电流(Irev)相对较低的结构的新的基于III族的二极管。 本发明的一个实施例是由GaN材料系统制成的肖特基势垒二极管,其中费米能级(或表面电位)不被固定。 金属对半导体结的势垒电位根据所使用的金属类型而变化,并且使用特定的金属降低二极管的肖特基势垒电位,并导致Vf在0.1-0.3V的范围内。 在另一个实施例中,在肖特基二极管半导体材料上形成沟槽结构以减少反向漏电流。 并且包括多个平行的等间距的沟槽,其间具有相邻沟槽之间的台面区域。 本发明的第三实施例提供了一种具有低Vf的GaN隧道二极管,其由电子穿过势垒电位而不是在其上引起。 该实施例还可以具有沟槽结构以减少反向漏电流。