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    • 1. 发明授权
    • Low overhead dynamic thermal management in many-core cluster architecture
    • 多核心集群架构中的低开销动态热管理
    • US08595731B2
    • 2013-11-26
    • US12698545
    • 2010-02-02
    • Pradip BosePhilip G. EmmaEren KursunJude A. Rivers
    • Pradip BosePhilip G. EmmaEren KursunJude A. Rivers
    • G06F9/46G06F9/44
    • G06F9/46
    • A semiconductor chip includes a plurality of multi-core clusters each including a plurality of cores and a cluster controller unit. Each cluster controller unit is configured to control thread assignment within the multi-core cluster to which it belongs. The cluster controller unit monitors various parameters measured in the plurality of cores within the multi-core cluster to estimate the computational demand of each thread that runs in the cores. The cluster controller unit may reassign the threads within the multi-core cluster based on the estimated computational demand of the threads and transmit a signal to an upper-level software manager that controls the thread assignment across the semiconductor chip. When an acceptable solution to thread assignment cannot be achieved by shuffling of threads within the multi-core cluster, the cluster controller unit may also report inability to solve thread assignment to the upper-level software manager to request a system level solution.
    • 半导体芯片包括多个多芯簇,每个多核簇包括多个核和集群控制器单元。 每个集群控制器单元被配置为控制它所属的多核集群内的线程分配。 集群控制器单元监视在多核集群内的多个核心中测量的各种参数,以估计在核心中运行的每个线程的计算需求。 集群控制器单元可以基于线程的估计的计算需求来重新分配多核集群内的线程,并将信号发送到控制半导体芯片上的线程分配的上级软件管理器。 当通过在多核心集群内的线程进行混洗,无法实现线程分配的可接受解决方案时,集群控制器单元也可能会报告无法解决线程分配给上级软件管理器以请求系统级解决方案。
    • 2. 发明申请
    • LOW OVERHEAD DYNAMIC THERMAL MANAGEMENT IN MANY-CORE CLUSTER ARCHITECTURE
    • 多个核心集群架构中的低层动态热管理
    • US20110191776A1
    • 2011-08-04
    • US12698545
    • 2010-02-02
    • Pradip BosePhilip G. EmmaEren KursunJude A. Rivers
    • Pradip BosePhilip G. EmmaEren KursunJude A. Rivers
    • G06F9/46
    • G06F9/46
    • A semiconductor chip includes a plurality of multi-core clusters each including a plurality of cores and a cluster controller unit. Each cluster controller unit is configured to control thread assignment within the multi-core cluster to which it belongs. The cluster controller unit monitors various parameters measured in the plurality of cores within the multi-core cluster to estimate the computational demand of each thread that runs in the cores. The cluster controller unit may reassign the threads within the multi-core cluster based on the estimated computational demand of the threads and transmit a signal to an upper-level software manager that controls the thread assignment across the semiconductor chip. When an acceptable solution to thread assignment cannot be achieved by shuffling of threads within the multi-core cluster, the cluster controller unit may also report inability to solve thread assignment to the upper-level software manager to request a system level solution.
    • 半导体芯片包括多个多芯簇,每个多核簇包括多个核和集群控制器单元。 每个集群控制器单元被配置为控制它所属的多核集群内的线程分配。 集群控制器单元监视在多核集群内的多个核心中测量的各种参数,以估计在核心中运行的每个线程的计算需求。 集群控制器单元可以基于线程的估计的计算需求来重新分配多核集群内的线程,并将信号发送到控制半导体芯片上的线程分配的上级软件管理器。 当通过在多核心集群内的线程进行混洗,无法实现线程分配的可接受解决方案时,集群控制器单元也可能会报告无法解决线程分配给上级软件管理器以请求系统级解决方案。
    • 3. 发明授权
    • Temperature-controlled 3-dimensional bus placement
    • 温控三维总线布置
    • US08141020B2
    • 2012-03-20
    • US12493599
    • 2009-06-29
    • Philip G. EmmaEren KursunJude A. Rivers
    • Philip G. EmmaEren KursunJude A. Rivers
    • G06F17/50
    • G06F17/5072
    • Block placement within each device-containing layer is optimized under the constraint of a simultaneous optimization of interlayer connectivity between the device-containing layer and immediately adjacent device-containing layers. For each functional block within the device-containing layer, lateral heat flow is calculated to laterally adjacent functional blocks. If the lateral heat flow is less than a threshold value for a pair of adjacent functional blocks, placement of the functional blocks and/or interlayer interconnect structure array therebetween or modification of the interlayer interconnect structure array is performed. This routine is repeated for all adjacent pairs of functional blocks in each of the device-containing layers. Subsequently, block placement within each device-containing layer may be optimized under the constraint of a simultaneous optimization of interlayer connectivity across all device-containing layers. This method provides a design having sufficient lateral heat flow in each of the device-containing layers in a semiconductor chip.
    • 在包含装置的层和紧邻相邻的装置层之间的层间连通性的同时优化的限制下,在每个含有装置的层内的块放置被优化。 对于含有装置的层内的每个功能块,横向热流被计算为横向相邻的功能块。 如果侧向热流小于一对相邻功能块的阈值,则在其间布置功能块和/或层间互连结构阵列或者修改层间互连结构阵列。 对于每个含设备的层中的所有相邻的功能块对,重复此例程。 随后,可以在跨所有含有装置的层的层间连接的同时优化的约束下优化在每个包含装置的层内的块放置。 该方法提供了在半导体芯片中的每个含有器件的层中具有足够的横向热流的设计。
    • 9. 发明申请
    • TEMPERATURE-CONTROLLED 3-DIMENSIONAL BUS PLACEMENT
    • 温度控制三维总线布置
    • US20100333056A1
    • 2010-12-30
    • US12493599
    • 2009-06-29
    • Philip G. EmmaEren KursunJude A. Rivers
    • Philip G. EmmaEren KursunJude A. Rivers
    • G06F17/50
    • G06F17/5072
    • Block placement within each device-containing layer is optimized under the constraint of a simultaneous optimization of interlayer connectivity between the device-containing layer and immediately adjacent device-containing layers. For each functional block within the device-containing layer, lateral heat flow is calculated to laterally adjacent functional blocks. If the lateral heat flow is less than a threshold value for a pair of adjacent functional blocks, placement of the functional blocks and/or interlayer interconnect structure array therebetween or modification of the interlayer interconnect structure array is performed. This routine is repeated for all adjacent pairs of functional blocks in each of the device-containing layers. Subsequently, block placement within each device-containing layer may be optimized under the constraint of a simultaneous optimization of interlayer connectivity across all device-containing layers. This method provides a design having sufficient lateral heat flow in each of the device-containing layers in a semiconductor chip.
    • 在包含装置的层和紧邻相邻的装置层之间的层间连通性的同时优化的限制下,在每个含有装置的层内的块放置被优化。 对于含有装置的层内的每个功能块,横向热流被计算为横向相邻的功能块。 如果侧向热流小于一对相邻功能块的阈值,则在其间布置功能块和/或层间互连结构阵列或者修改层间互连结构阵列。 对于每个含设备的层中的所有相邻的功能块对,重复此例程。 随后,可以在跨所有含有装置的层的层间连接的同时优化的约束下优化在每个包含装置的层内的块放置。 该方法提供了在半导体芯片中的每个含有器件的层中具有足够的横向热流的设计。