专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20090300849A1 METHOD OF EXTRACTING OIL OF CLOTH VIA SUPERCRITICAL FLUID 审中-公开
标题翻译：通过超临界流体萃取油的方法
公开(公告)号：US20090300849A1
公开(公告)日：2009-12-10
申请号：US12430317
申请日：2009-04-27
申请人： Po-Jen Cheng , Li-Hao Cheng , Chih-Huang Cheng
发明人： Po-Jen Cheng , Li-Hao Cheng , Chih-Huang Cheng
IPC分类号： B01D11/02 , D06L1/02
CPC分类号： D06L1/00 , D06L1/02
摘要： The present invention relates to a method of extracting oil of cloth via supercritical fluid, comprises the steps of: a cloth to be extracted is provided in an extracting tank; a gas is filled into a storing tank; a water-cooling machine is provided and served to cool down the temperature of the gas; a pump is provided and served to compress the gas; a water-heating machine is provided and served to raise the temperature of the gas so the gas becomes a supercritical fluid; and the supercritical fluid is inserted into the extracting tank for extracting the oil. By the above mentioned method, the cleanness of the cleanroom wiping cloth can be immediately sensed and obtained, and the gas can be recycled for achieving energy-saving.
摘要翻译：本发明涉及一种通过超临界流体提取布料的方法，包括以下步骤：提取罐中提取的布料; 将气体填充到储存罐中; 提供了一台水冷机，用来冷却气体的温度; 提供一个泵并用来压缩气体; 提供了一种水加热机，用于提高气体的温度，使气体成为超临界流体; 并将超临界流体插入提取罐中以提取油。通过上述方法，可以立即检测和获得洁净室擦拭布的清洁度，并且可以再循环气体以实现节能。

2. 发明授权

US07741152B2 Three-dimensional package and method of making the same 有权
标题翻译：三维包装及其制作方法
公开(公告)号：US07741152B2
公开(公告)日：2010-06-22
申请号：US11645040
申请日：2006-12-26
申请人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chian-Chi Lin
发明人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chian-Chi Lin
IPC分类号： H01L21/44
CPC分类号： H01L21/76898 , H01L25/0657 , H01L25/50 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2924/0002 , H01L2924/00
摘要： A method of making a three-dimensional package, including: (a) providing a wafer; (b) forming at least one blind hole; (c) forming an isolation layer; (d) forming a conductive layer; (e) forming a dry film; (f) filling the blind hole with a solder; (g) removing the dry film; (h) patterning the conductive layer; (i) removing a part of the lower surface of the wafer and the isolation layer, so as to expose the conductive layer; (j) stacking a plurality of the wafers, and performing a reflow process; and (k) cutting the stacked wafers, so as to form a plurality of three-dimensional packages. As such, the lower end of the conductive layer is inserted into the solder of the lower wafer, so as to enhance the joint between the conductive layer and the solder, and effectively reduce the overall height of the three-dimensional packages after joining.
摘要翻译：一种制造三维封装的方法，包括：（a）提供晶片; （b）形成至少一个盲孔; （c）形成隔离层; （d）形成导电层; （e）形成干膜; （f）用焊料填充盲孔; （g）去除干膜; （h）图案化导电层; （i）去除晶片的下表面的一部分和隔离层，以暴露导电层; （j）堆叠多个晶片，并进行回流处理; 和（k）切割堆叠的晶片，以便形成多个三维封装。因此，导电层的下端插入下晶片的焊料中，以增强导电层和焊料之间的接合，并且有效地降低了连接后三维封装的整体高度。

3. 发明申请

US20070174650A1 Efficiency optimization method for hardware devices with adjustable clock frequencies 有权
标题翻译：具有可调时钟频率的硬件设备的效率优化方法
公开(公告)号：US20070174650A1
公开(公告)日：2007-07-26
申请号：US11335534
申请日：2006-01-20
申请人： Ming-Ting Won , Fu-Shun Wu , Po-Jen Cheng
发明人： Ming-Ting Won , Fu-Shun Wu , Po-Jen Cheng
IPC分类号： G06F1/04
CPC分类号： G06F1/206 , G06F1/3203 , G06F1/324 , Y02D10/126
摘要： An efficiency optimization method for hardware devices with adjustable clock frequencies is provided. The work current of the hardware device is measured and used to obtain the corresponding work level from a conversion table. The obtained work level is compared with the currently executing work level to make adjustments for various parameters for the hardware device and for the operation of the corresponding heat-dissipating device. Therefore, the hardware device can achieve a better performance.
摘要翻译：提供了具有可调时钟频率的硬件设备的效率优化方法。测量硬件设备的工作电流，并从转换表中获得相应的工作电平。将获得的工作级别与当前执行的工作级别进行比较，以对硬件设备的各种参数和相应的散热装置的操作进行调整。因此，硬件设备可以实现更好的性能。

4. 发明申请

US20070172983A1 Three-dimensional package and method of making the same 审中-公开
标题翻译：三维包装及其制作方法
公开(公告)号：US20070172983A1
公开(公告)日：2007-07-26
申请号：US11645039
申请日：2006-12-26
申请人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chian-Chi Lin
发明人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chian-Chi Lin
IPC分类号： H01L21/00
CPC分类号： H01L21/76898 , H01L25/0657 , H01L25/50 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a three-dimensional package and a method of making the same. The three-dimensional package comprises a first wafer, at least one first hole, a first isolation layer, a first conductive layer, a first solder, a second wafer, at least one second hole, a second isolation layer, a second conductive layer, and a second solder. The first wafer has at least one first pad and a first protection layer exposing the first pad. The first hole penetrates the first wafer. The first isolation layer is disposed on the side wall of the first hole. The lower end of the first conductive layer extends below the surface of the first wafer. The first solder is disposed in the first hole, and is electrically connected to the first pad via the first conductive layer. The second wafer has at least one second pad and a second protection layer exposing the second pad. The second hole penetrates the second wafer. The second isolation layer is disposed on the side wall of the second hole. The lower end of the second conductive layer extends to below the surface of the second wafer and contacts the upper end of the first solder. The second solder is disposed in the second hole and is electrically connected to the second pad via the second conductive layer.
摘要翻译：本发明涉及三维包装及其制造方法。三维封装包括第一晶片，至少一个第一孔，第一隔离层，第一导电层，第一焊料，第二晶片，至少一个第二孔，第二隔离层，第二导电层，和第二焊料。第一晶片具有至少一个第一焊盘和暴露第一焊盘的第一保护层。第一个孔穿透第一个晶片。第一隔离层设置在第一孔的侧壁上。第一导电层的下端延伸到第一晶片的表面下方。第一焊料设置在第一孔中，并且经由第一导电层电连接到第一焊盘。第二晶片具有至少一个第二焊盘和暴露第二焊盘的第二保护层。第二孔穿透第二晶片。第二隔离层设置在第二孔的侧壁上。第二导电层的下端延伸到第二晶片的表面下方并接触第一焊料的上端。第二焊料设置在第二孔中，并通过第二导电层与第二焊盘电连接。

5. 发明授权

US07500122B2 Efficiency optimization method for hardware devices with adjustable clock frequencies 有权
标题翻译：具有可调时钟频率的硬件设备的效率优化方法
公开(公告)号：US07500122B2
公开(公告)日：2009-03-03
申请号：US11335534
申请日：2006-01-20
申请人： Ming-Ting Won , Fu-Shun Wu , Po-Jen Cheng
发明人： Ming-Ting Won , Fu-Shun Wu , Po-Jen Cheng
IPC分类号： G06F1/26
CPC分类号： G06F1/206 , G06F1/3203 , G06F1/324 , Y02D10/126
摘要： An efficiency optimization method for hardware devices with adjustable clock frequencies is provided. The work current of the hardware device is measured and used to obtain the corresponding work level from a conversion table. The obtained work level is compared with the currently executing work level to make adjustments for various parameters for the hardware device and for the operation of the corresponding heat-dissipating device. Therefore, the hardware device can achieve a better performance.
摘要翻译：提供了具有可调时钟频率的硬件设备的效率优化方法。测量硬件设备的工作电流，并从转换表中获得相应的工作电平。将获得的工作级别与当前执行的工作级别进行比较，以对硬件设备的各种参数和相应的散热装置的操作进行调整。因此，硬件设备可以实现更好的性能。

6. 发明申请

US20050159253A1 Bumper guard for a sports racquet 失效
公开(公告)号：US20050159253A1
公开(公告)日：2005-07-21
申请号：US10715068
申请日：2003-11-17
申请人： Walter Shen , David Repetto , Po-Jen Cheng
发明人： Walter Shen , David Repetto , Po-Jen Cheng
IPC分类号： A63B49/02 , A63B49/14 , A63B49/18 , A63B51/00
CPC分类号： A63B49/14 , A63B49/02 , A63B60/00 , A63B60/54
摘要： A bumper guard for attachment to a sports racquet. The sports racquet includes a frame having a head portion with an outer peripheral surface and a plurality of grommet holes formed into the head portion for supporting a string bed. The bumper guard includes an elongate body having a first length, an inner surface and an outer surface. The body includes a central region and first and second wings. The central region, when installed on the racquet, is generally centered about a plane defined by the string bed. The first and second wings extend from the central region. The inner surface of the body configured to generally conform with the peripheral outer surface of the head portion. Each of the first and second wings has an inner wall and an outer wall defining at least one elongate hollow cavity.

7. 发明授权

US06891274B2 Under-bump-metallurgy layer for improving adhesion 有权
标题翻译：不足焊点 - 冶金层，用于改善附着力
公开(公告)号：US06891274B2
公开(公告)日：2005-05-10
申请号：US10604794
申请日：2003-08-18
申请人： William Tze-You Chen , Ho-Ming Tong , Chun-Chi Lee , Su Tao , Jeng-Da Wu , Chih-Huang Chang , Po-Jen Cheng
发明人： William Tze-You Chen , Ho-Ming Tong , Chun-Chi Lee , Su Tao , Jeng-Da Wu , Chih-Huang Chang , Po-Jen Cheng
IPC分类号： H01L21/60 , H01L23/485 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/05 , H01L24/12 , H01L2224/0401 , H01L2224/05027 , H01L2224/05572 , H01L2224/13109 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2224/05552
摘要： An under-bump-metallurgy layer is provided. The under-bump-metallurgy layer is formed over the contact pad of a chip and a welding lump is formed over the under-ball-metallurgy layer. The under-bump-metallurgy layer comprises an adhesion layer, a barrier layer and a wettable layer. The adhesion layer is directly formed over the contact pad. The barrier layer made from a material such as nickel-vanadium alloy is formed over the adhesion layer. The wettable layer made from a material such as copper is formed over the barrier layer. The wettable layer has an overall thickness that ranges from about 3 μm to about 8 μm.
摘要翻译：提供了凸块下的冶金层。凸块下金属层形成在芯片的接触焊盘上，并且焊接块形成在球下冶金层之上。凸块下冶金层包括粘合层，阻挡层和可润湿层。粘合层直接形成在接触垫上。在粘合层上形成由诸如镍 - 钒合金的材料制成的阻挡层。由诸如铜的材料制成的可湿性层形成在阻挡层上。可湿性层的总厚度范围为约3μm至约8μm。

8. 发明授权

US06840874B2 Game racquet with separate head and handle portions for reducing vibration 有权
标题翻译：游戏球拍与独立的头部和手柄部分，以减少振动
公开(公告)号：US06840874B2
公开(公告)日：2005-01-11
申请号：US10654172
申请日：2003-09-03
申请人： William D. Severa , Po-Jen Cheng , Gerald J. LeVault , Donald G. Loeffler
发明人： William D. Severa , Po-Jen Cheng , Gerald J. LeVault , Donald G. Loeffler
IPC分类号： A63B49/02 , A63B59/00
CPC分类号： A63B49/03 , A63B60/52 , A63B60/54
摘要： A game racquet includes separate head and handle portions which are separated by shock and/or vibration absorbing material. Both the head portion and the handle portion are bonded to the absorbing material and are thereby connected to each other.
摘要翻译：游戏球拍包括由冲击和/或振动吸收材料分开的单独的头部和手柄部分。头部和把手部分都与吸收材料接合，从而彼此连接。

9. 发明授权

US06527656B1 Two-piece grommet assembly for a sports racquet 有权
标题翻译：用于运动球拍的两件式索环组件
公开(公告)号：US06527656B1
公开(公告)日：2003-03-04
申请号：US09995183
申请日：2001-11-27
申请人： Po-Jen Cheng , William D. Severa , Kristin M. Bachochin
发明人： Po-Jen Cheng , William D. Severa , Kristin M. Bachochin
IPC分类号： A63B4900
CPC分类号： A63B60/54 , A63B49/022
摘要： A two-piece grommet assembly for a sports racquet. The sports racquet includes a frame having a plurality of grommet holes and at least one racquet string. The grommet assembly includes first and second grommet members. The first grommet member includes a first strip and at least two spaced-apart barrels extending generally perpendicular from the first strip. Each barrel includes a first string hole and is configured to extend through a separate grommet hole in the frame. The second grommet member includes a second strip and at least two spaced-apart pegs extending generally perpendicular from the second strip. Each peg has a second string hole. The second strip contacts the first strip, and the pegs extend into the barrels such that the first and second string holes are generally co-axially aligned. The first grommet member is configured to substantially isolate the pegs and the second strip from the frame.
摘要翻译：用于运动球拍的两件式索环组件。运动球拍包括具有多个索环孔和至少一个球拍绳的框架。索环组件包括第一和第二索环构件。第一索环构件包括第一条和至少两个彼此垂直于第一条延伸的间隔开的管。每个桶包括第一串孔，并且构造成延伸通过框架中的单独的索环孔。第二索环构件包括第二条带和至少两个间隔开的钉，大体垂直于第二条带延伸。每个钉有一个第二个弦孔。第二条带接触第一条带，并且销钉延伸到桶中，使得第一和第二串孔大体上同轴对准。第一索环构件构造成将钉和第二条带与框架基本隔离。

10. 外观设计

USD469488S1 Middle region of a game racquet with separate head and handle portions 失效
标题翻译：游戏球拍的中部区域，具有单独的头部和手柄部分
公开(公告)号：USD469488S1
公开(公告)日：2003-01-28
申请号：US29160026
申请日：2002-05-02
申请人： William D. Severa , Po-Jen Cheng , Gerald J. LeVault
设计人： William D. Severa , Po-Jen Cheng , Gerald J. LeVault

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式