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    • 3. 发明授权
    • Apparatus and method for measuring each thickness of a multilayer stacked on a substrate
    • 用于测量层叠在基板上的多层厚度的装置和方法
    • US06912056B2
    • 2005-06-28
    • US10914149
    • 2004-08-10
    • Pil-Sik HyunSun-Jin KangSang-Kil LeeKyung-Ho Jung
    • Pil-Sik HyunSun-Jin KangSang-Kil LeeKyung-Ho Jung
    • G01B11/06H01L21/66G01B11/28
    • G01B11/0641
    • In an apparatus and a method of measuring a thickness of a multilayer on a substrate, a spectrum of reflected light reflected from the substrate is measured. A plurality of recipe data, each corresponding to one of a plurality of hypothetical multilayers, is stored. One of the plurality of hypothetical multilayers is initially assumed to be the multilayer actually formed on the substrate. A plurality of theoretical spectra is calculated using one of the plurality of recipe data in accordance with various theoretical thicknesses of one of the plurality of hypothetical multilayers. The measured spectrum is compared with the plurality of theoretical spectra to determine a temporary thickness of the multilayer. A reliability of the temporary thickness of the multilayer is estimated. The temporary thickness is output as a thickness of the multilayer on the substrate when the reliability of the temporary thickness is within an allowable range.
    • 在测量基板上的多层厚度的装置和方法中,测量从基板反射的反射光的光谱。 存储多个与多个假想多层中的一个对应的食谱数据。 多个假想多层中的一个最初被假设为实际形成在基底上的多层。 根据多个假想多层之一的各种理论厚度,使用多个配方数据中的一个来计算多个理论光谱。 将测量的光谱与多个理论光谱进行比较,以确定多层的临时厚度。 估计多层的临时厚度的可靠性。 当临时厚度的可靠性在允许范围内时,临时厚度作为衬底上的多层的厚度输出。