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1. 发明申请

US20120040595A1 Silicon Carbide, Sapphire, Germanium, Silicon and Pattern Wafer Polishing Templates Holder 失效
标题翻译：碳化硅，蓝宝石，锗，硅和图案晶圆抛光模板持有人
公开(公告)号：US20120040595A1
公开(公告)日：2012-02-16
申请号：US12856521
申请日：2010-08-13
申请人： Phuong Van Nguyen , Thang Van Tran
发明人： Phuong Van Nguyen , Thang Van Tran
IPC分类号： B24B41/06 , B24B57/00
CPC分类号： B24B37/30 , B24B57/02
摘要： A template for polishing Silicon Carbide, Sapphire, Germanium, Silicon and pattern wafers having a slurry inlet, channels, outlets and pockets for holding said wafers terminating in peripheral vacuum ports in order to facilitate an efficient flow of slurry over the semiconductor wafers during a polishing process.
摘要翻译：用于抛光碳化硅，蓝宝石，锗，硅和图案晶片的模板具有浆料入口，通道，出口和口袋，用于将所述晶片保持在终端于外围真空端口中，以便于在抛光期间有效地将浆料流过半导体晶片处理。

2. 发明授权

US08414361B2 Silicon carbide, sapphire, germanium, silicon and pattern wafer polishing templates holder 失效
标题翻译：碳化硅，蓝宝石，锗，硅和图案晶片抛光模板夹
公开(公告)号：US08414361B2
公开(公告)日：2013-04-09
申请号：US12856521
申请日：2010-08-13
申请人： Phuong Van Nguyen , Thang Van Tran
发明人： Phuong Van Nguyen , Thang Van Tran
IPC分类号： B24B7/00
CPC分类号： B24B37/30 , B24B57/02
摘要： A template for polishing Silicon Carbide, Sapphire, Germanium, Silicon and pattern wafers having a slurry inlet, channels, outlets and pockets for holding said wafers terminating in peripheral vacuum ports in order to facilitate an efficient flow of slurry over the semiconductor wafers during a polishing process.
摘要翻译：用于抛光碳化硅，蓝宝石，锗，硅和图案晶片的模板具有浆料入口，通道，出口和口袋，用于将所述晶片保持在终端于外围真空端口中，以便于在抛光期间有效地将浆料流过半导体晶片处理。

3. 外观设计

USD678745S1 Spinning insert polishing pad 有权
标题翻译：旋转刀片抛光垫
公开(公告)号：USD678745S1
公开(公告)日：2013-03-26
申请号：US29396834
申请日：2011-07-07
申请人： Phuong Van Nguyen
设计人： Phuong Van Nguyen

4. 发明授权

US06645049B2 Polishing holder for silicon wafers and method of use thereof 失效
公开(公告)号：US06645049B2
公开(公告)日：2003-11-11
申请号：US09962897
申请日：2001-09-25
申请人： Phuong Van Nguyen
发明人： Phuong Van Nguyen
IPC分类号： B24B100
CPC分类号： B24B37/042 , B24B37/30
摘要： An method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof. Each cavity has notches cut in the walls thereof and a pattern etched in the base thereof. Holding disks are moistened and positioned within respective cavities for releasably securing a wafer in the cavity. A moistening liquid is dispensed and diffuses into the cavities via the notches cut in the walls and collects in the pattern etched on the base of the cavity thereby increasing the suctional force used to secure the holding disk. When the template is releasably secured within a cavity, rotatably connected to a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities are lapped and polished upon rotation of the rotating head.

5. 发明申请

US20130267155A1 Wafer Polishing Pad Holder Template 审中-公开
标题翻译：晶圆抛光垫座模板
公开(公告)号：US20130267155A1
公开(公告)日：2013-10-10
申请号：US13442246
申请日：2012-04-09
申请人： Phuong Van Nguyen
发明人： Phuong Van Nguyen
IPC分类号： B24B37/34
CPC分类号： B24B37/34
摘要： A system for processing wafers that will reduce the amount of time required for polishing wafers, increase worker safety while performing the process and increase the percentage of acceptable wafers after processing.
摘要翻译：一种用于处理晶片的系统，其将减少抛光晶片所需的时间量，从而在执行该过程时增加工人的安全性，并且在处理之后增加可接受的晶片的百分比。

6. 发明授权

US06612905B2 Silicon wafer polishing holder and method of use thereof 失效
公开(公告)号：US06612905B2
公开(公告)日：2003-09-02
申请号：US09840506
申请日：2001-04-23
申请人： Phuong Van Nguyen
发明人： Phuong Van Nguyen
IPC分类号： B24B100
CPC分类号： B24B37/30
摘要： A method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof and a backing plate positioned on a side of the main disk opposite the first side. Holding disks are moistened and positioned within respective cavities for releasably securing a wafer in the cavity. When the template is releasably secured to and rotatable with a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities are lapped and polished upon rotation of the rotating head. A plurality of shims are selectively received within respective cavities between a base of the cavity and the holding disk for adjusting a depth of the cavity thereby adjusting an amount of a wafer to be lapped and polished. The shims have varying thickness' and are color coated, each color being representative of a predetermined thickness for the shim. A mylar layer is bonded to a side of the backing plate opposite the main disk. A liquid is provided atop the lapping and polishing surface upon rotation of the templates.

7. 发明授权

US08182315B2 Chemical mechanical polishing pad and dresser 失效
标题翻译：化学机械抛光垫和梳妆台
公开(公告)号：US08182315B2
公开(公告)日：2012-05-22
申请号：US12054018
申请日：2008-03-24
申请人： Phuong Van Nguyen
发明人： Phuong Van Nguyen
IPC分类号： B24B53/00
CPC分类号： B24B53/017
摘要： The present invention discloses a Chemical Mechanical Polishing (CMP) pad dresser used in lapping and polishing silicon wafers in either single or double sided polishing machines.
摘要翻译：本发明公开了一种用于在单面或双面抛光机中研磨和抛光硅晶片的化学机械抛光（CMP）抛光修整器。

8. 发明申请

US20090239456A1 Chemical Mechanical Polishing Pad and Dresser 失效
标题翻译：化学机械抛光垫和梳妆台
公开(公告)号：US20090239456A1
公开(公告)日：2009-09-24
申请号：US12054018
申请日：2008-03-24
申请人： Phuong Van Nguyen
发明人： Phuong Van Nguyen
IPC分类号： B24D11/00 , B24D11/04 , B24B29/02
CPC分类号： B24B53/017
摘要： The present invention discloses a Chemical Mechanical Polishing (CMP) pad dresser used in lapping and polishing silicon wafers in either single or double sided polishing machines.
摘要翻译：本发明公开了一种用于在单面或双面抛光机中研磨和抛光硅晶片的化学机械抛光（CMP）抛光修整器。

9. 外观设计

USD684551S1 Wafer polishing pad holder 有权
标题翻译：晶圆抛光垫座
公开(公告)号：USD684551S1
公开(公告)日：2013-06-18
申请号：US29396846
申请日：2011-07-07
申请人： Phuong Van Nguyen
设计人： Phuong Van Nguyen

10. 发明授权

US06733367B1 Method and apparatus for polishing silicon wafers 失效
标题翻译：抛光硅片的方法和装置
公开(公告)号：US06733367B1
公开(公告)日：2004-05-11
申请号：US10052647
申请日：2002-01-18
申请人： Phuong Van Nguyen
发明人： Phuong Van Nguyen
IPC分类号： B24B100
CPC分类号： B24B37/042 , B24B37/30
摘要： The invention shows a workpiece template and a number of additional elements for forming wafers of varying thicknesses=. The template is formed of a main disk including a plurality of cavities extending through a main plate with either a frictionless material or a backing plate forming the cavity base. The template shows additional elements to aid in the lapping/polishing abrasive fluid movement in the form of spiraling channels moving across the top surface of the template. The channels can extend through the template cavity walls. Also shown are the improvement previously stated applied to a template having notched gear-like teeth for another type of lapping/polishing machine.
摘要翻译：本发明示出了用于形成不同厚度的晶片的工件模板和多个附加元件。模板由包括多个空腔的主盘形成，多个空腔通过主板与无摩擦材料或形成空腔基座的背板延伸。该模板显示了额外的元素，以帮助研磨/抛光研磨液体运动，其形式为跨过模板顶表面的螺旋形通道。通道可以延伸穿过模板腔壁。还示出了先前所述的应用于具有用于另一种研磨抛光机的切口齿轮状齿轮的模板的改进。

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