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    • 4. 发明申请
    • PLASMA ASHING APPARATUS AND ENDPOINT DETECTION PROCESS
    • 等离子体吸附装置和端点检测过程
    • US20100055807A1
    • 2010-03-04
    • US12552316
    • 2009-09-02
    • Aseem Kumar SrivastavaPalanikumaran SakthivelThomas James Buckley
    • Aseem Kumar SrivastavaPalanikumaran SakthivelThomas James Buckley
    • H01L21/66
    • H01L21/67253G03F7/427H01J37/32357H01J37/32834H01J37/32935H01J2237/3342H01L21/67069
    • A plasma ashing apparatus for removing organic matter from a substrate including a low k dielectric, comprising a first gas source; a plasma generating component in fluid communication with the first gas source; a process chamber in fluid communication with the plasma generating component; an exhaust conduit in fluid communication with the process chamber; wherein the exhaust conduit comprises an inlet for a second gas source and an afterburner assembly coupled to the exhaust conduit, wherein the inlet is disposed intermediate to the process chamber and an afterburner assembly, and wherein the afterburner assembly comprises means for generating a plasma within the exhaust conduit with or without introduction of a gas from the second gas source; and an optical emission spectroscopy device coupled to the exhaust conduit comprising collection optics focused within a plasma discharge region of the afterburner assembly. An endpoint detection process for an oxygen free and nitrogen free plasma process comprises monitoring an optical emission signal of an afterburner excited species in an exhaust conduit of the plasma asher apparatus. The process and apparatus can be used with carbon and/or hydrogen containing low k dielectric materials.
    • 一种用于从包括第一气体源的低k电介质的衬底去除有机物质的等离子体灰化装置; 与所述第一气体源流体连通的等离子体产生部件; 与所述等离子体产生部件流体连通的处理室; 与处理室流体连通的排气管道; 其中所述排气管道包括用于第二气体源的入口和耦合到所述排气管道的后燃烧器组件,其中所述入口设置在所述处理室和加力燃烧器组件的中间,并且其中所述后燃烧器组件包括用于在所述排气管内产生等离子体的装置 具有或不从第二气体源引入气体的排气导管; 以及耦合到所述排气导管的光发射光谱装置,包括聚焦在所述后燃器组件的等离子体放电区域内的收集光学器件。 用于无氧和无氮等离子体工艺的端点检测方法包括监测等离子体灰化装置的排气管道中的后燃器激发物质的光发射信号。 该方法和装置可以与含有低k电介质材料的碳和/或氢一起使用。
    • 5. 发明授权
    • Method and apparatus for micro-jet enabled, low energy ion generation and transport in plasma processing
    • 用于微喷射的方法和装置,等离子体处理中的低能离子产生和输送
    • US07037846B2
    • 2006-05-02
    • US10752906
    • 2004-01-06
    • Aseem Kumar SrivastavaHerbert Harold SawinPalanikumaran Sakthievel
    • Aseem Kumar SrivastavaHerbert Harold SawinPalanikumaran Sakthievel
    • H01L21/302H01L21/461
    • H01J37/32192H01J37/321
    • A method for creating and transporting low-energy ions for use in plasma processing of a semiconductor wafer is disclosed. In an exemplary embodiment of the invention, the method includes generating plasma from a gas species to produce a plasma exhaust. The plasma exhaust is then introduced into a processing chamber containing the wafer. The ion content of the plasma exhaust is enhanced by activating a supplemental ion source as the plasma is introduced into the processing chamber, thereby creating a primary plasma discharge therein. Then, the primary plasma discharge is directed into a baffle plate assembly, thereby creating a secondary plasma discharge exiting the baffle plate assembly. The strength of an electric field exerted on ions contained in the secondary plasma discharge is reduced. In so doing, the reduced strength of the electric field causes the ions to bombard the wafer at an energy insufficient to cause damage to semiconductor devices formed on the wafer.
    • 公开了一种用于产生和传送用于半导体晶片的等离子体处理的低能离子的方法。 在本发明的示例性实施例中,该方法包括从气体种类产生等离子体以产生等离子体排气。 然后将等离子体废气引入到包含晶片的处理室中。 当等离子体被引入处理室中时,通过激活补充离子源来提高等离子体排气的离子含量,由此在其中产生初级等离子体放电。 然后,将初级等离子体放电引导到挡板组件中,从而产生离开挡板组件的次级等离子体放电。 施加在次级等离子体放电中包含的离子上的电场的强度降低。 这样做时,电场强度的降低会使离子以不足以对晶片上形成的半导体器件造成损害的能量轰击晶片。
    • 7. 发明授权
    • Plasma ashing apparatus and endpoint detection process
    • 等离子灰化装置和端点检测过程
    • US08268181B2
    • 2012-09-18
    • US12552316
    • 2009-09-02
    • Aseem Kumar SrivastavaPalanikumaran SakthivelThomas James Buckley
    • Aseem Kumar SrivastavaPalanikumaran SakthivelThomas James Buckley
    • G01L21/30G01R31/00
    • H01L21/67253G03F7/427H01J37/32357H01J37/32834H01J37/32935H01J2237/3342H01L21/67069
    • A plasma ashing apparatus for removing organic matter from a substrate including a low k dielectric, comprising a first gas source; a plasma generating component in fluid communication with the first gas source; a process chamber in fluid communication with the plasma generating component; an exhaust conduit in fluid communication with the process chamber; wherein the exhaust conduit comprises an inlet for a second gas source and an afterburner assembly coupled to the exhaust conduit, wherein the inlet is disposed intermediate to the process chamber and an afterburner assembly, and wherein the afterburner assembly comprises means for generating a plasma within the exhaust conduit with or without introduction of a gas from the second gas source; and an optical emission spectroscopy device coupled to the exhaust conduit comprising collection optics focused within a plasma discharge region of the afterburner assembly. An endpoint detection process for an oxygen free and nitrogen free plasma process comprises monitoring an optical emission signal of an afterburner excited species in an exhaust conduit of the plasma asher apparatus. The process and apparatus can be used with carbon and/or hydrogen containing low k dielectric materials.
    • 一种用于从包括第一气体源的低k电介质的衬底去除有机物质的等离子体灰化装置; 与所述第一气体源流体连通的等离子体产生部件; 与所述等离子体产生部件流体连通的处理室; 与处理室流体连通的排气管道; 其中所述排气管道包括用于第二气体源的入口和耦合到所述排气管道的后燃烧器组件,其中所述入口设置在所述处理室和加力燃烧器组件的中间,并且其中所述后燃烧器组件包括用于在所述排气管内产生等离子体的装置 具有或不从第二气体源引入气体的排气导管; 以及耦合到所述排气导管的光发射光谱装置,包括聚焦在所述后燃器组件的等离子体放电区域内的收集光学器件。 用于无氧和无氮等离子体工艺的端点检测方法包括监测等离子体灰化装置的排气管道中的后燃器激发物质的光发射信号。 该方法和装置可以与含有低k电介质材料的碳和/或氢一起使用。
    • 8. 发明授权
    • Method and apparatus for micro-jet enabled, low-energy ion generation transport in plasma processing
    • 用于等离子体处理中的微喷射低能量离子生成传输的方法和装置
    • US06761796B2
    • 2004-07-13
    • US09905043
    • 2001-07-13
    • Aseem Kumar SrivastavaHerbert Harold SawinPalanikumaran Sakthievel
    • Aseem Kumar SrivastavaHerbert Harold SawinPalanikumaran Sakthievel
    • H05H100
    • H01J37/32192H01J37/321
    • A method for creating and transporting low-energy ions for use in plasma processing of a semiconductor wafer is disclosed. In an exemplary embodiment of the invention, the method includes generating plasma from a gas species to produce a plasma exhaust. The plasma exhaust is then introduced into a processing chamber containing the wafer. The ion content of the plasma exhaust is enhanced by activating a supplemental ion source as the plasma is introduced into the processing chamber, thereby creating a primary plasma discharge therein. Then, the primary plasma discharge is directed into a baffle plate assembly, thereby creating a secondary plasma discharge exiting the baffle plate assembly. The strength of an electric field exerted on ions contained in the secondary plasma discharge is reduced. In so doing, the reduced strength of the electric field causes the ions to bombard the wafer at an energy insufficient to cause damage to semiconductor devices formed on the wafer.
    • 公开了一种用于产生和传送用于半导体晶片的等离子体处理的低能离子的方法。 在本发明的示例性实施例中,该方法包括从气体种类产生等离子体以产生等离子体排气。 然后将等离子体废气引入到包含晶片的处理室中。 当等离子体被引入处理室中时,通过激活补充离子源来提高等离子体排气的离子含量,由此在其中产生初级等离子体放电。 然后,将初级等离子体放电引导到挡板组件中,从而产生离开挡板组件的次级等离子体放电。 施加在次级等离子体放电中包含的离子上的电场的强度降低。 这样做时,电场强度的降低会使离子以不足以对晶片上形成的半导体器件造成损害的能量轰击晶片。