专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050046518A1 ELECTROMECHANICAL RESONATOR AND METHOD OF OPERATING SAME 有权
标题翻译：电动共振器及其操作方法
公开(公告)号：US20050046518A1
公开(公告)日：2005-03-03
申请号：US10652406
申请日：2003-08-28
申请人： Peter Zurcher , Rashaunda Henderson , Sergio Pacheco
发明人： Peter Zurcher , Rashaunda Henderson , Sergio Pacheco
IPC分类号： H03H3/007 , H03H9/24 , H03H9/15
CPC分类号： H03H3/0077 , H03H9/02409 , H03H9/2405 , H03H2009/02496
摘要： An electromechanical resonator includes a substrate (150, 450), an anchor (110, 510, 810) coupled to the substrate, a beam (120, 620, 1020, 1120, 1220, 1420) coupled to the anchor and suspended over the substrate, and a drive electrode (130, 435, 630, 930, 933, 935, 1030, 1035, 1130, 1135, 1435) coupled to the substrate and separated from the beam by a gap (140, 445, 640, 1040, 1045, 1140, 1145, 1445). The beam has a first surface (321, 621, 1021, 1121), a second surface (322, 622), and a third surface (323, 623, 1023, 1123, 1223, 1423). The first surface defines a width and a height, the second surface defines the height and a length, and the third surface defines the length and the width. The width, height, and length are substantially mutually perpendicular, and the beam resonates substantially only in compression mode and substantially only along an axis defined by the length.
摘要翻译：机电谐振器包括基板（150,450），联接到基板的锚固件（110,510,810），耦合到锚固件并悬挂在基板上的梁（120,620,1020,1120,1220,1420），以及耦合到所述衬底并且通过间隙（140,445,640,1040,1045）从所述光束分离的驱动电极（130,435,630,930,933,935,1030,1035,1130,1135,1435），1140,1145,1445）。梁具有第一表面（321,621,1021,1121），第二表面（322,622）和第三表面（323,623,1023,1123,1223,1423）。第一表面限定宽度和高度，第二表面限定高度和长度，第三表面限定长度和宽度。宽度，高度和长度基本相互垂直，并且光束基本上仅在压缩模式下并且基本上仅沿着由长度限定的轴共振。

2. 发明申请

US20070007622A1 Method of manufacturing a passive integrated matching network for power amplifiers 有权
公开(公告)号：US20070007622A1
公开(公告)日：2007-01-11
申请号：US11179685
申请日：2005-07-11
申请人： Lianjun Liu , Qiang Li , Melvy Miller , Sergio Pacheco
发明人： Lianjun Liu , Qiang Li , Melvy Miller , Sergio Pacheco
IPC分类号： H01L29/00
CPC分类号： H01L25/16 , H01L23/642 , H01L23/645 , H01L23/66 , H01L24/48 , H01L24/49 , H01L25/18 , H01L28/10 , H01L28/40 , H01L2223/6655 , H01L2224/48091 , H01L2224/48137 , H01L2224/48195 , H01L2224/48472 , H01L2224/49175 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H03H7/38 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An impedance matching network is integrated on a first die and coupled to a second die, with the first and second dies mounted on a conductive back plate. The impedance matching network comprises a first inductor bridging between the first and second dies, a second inductor coupled to the first inductor and disposed on the first die, and a metal-insulator-metal (MIM) capacitor disposed on the first die. The MIM capacitor has a first metal layer coupled to the second inductor, and a second metal layer grounded to the conductive back plate. A method for manufacturing the integrated impedance matching network comprises the steps of forming an inductor on a die, forming a capacitor on the die, coupling the capacitor to the inductor, coupling the die bottom surface and the capacitor to a conductive plate, and coupling the inductor to another inductor that bridges between the die and another die.

3. 发明授权

US08445978B2 Electromechanical transducer device and method of forming a electromechanical transducer device 有权
标题翻译：机电换能器装置及形成机电换能装置的方法
公开(公告)号：US08445978B2
公开(公告)日：2013-05-21
申请号：US13128035
申请日：2009-11-25
申请人： Francois Perruchot , Emmanuel Defay , Patrice Rey , Lianjun Liu , Sergio Pacheco
发明人： Francois Perruchot , Emmanuel Defay , Patrice Rey , Lianjun Liu , Sergio Pacheco
IPC分类号： G01P15/08
CPC分类号： B81B3/0072 , B81B2201/032 , H01L41/0933 , H01L41/094
摘要： A micro or nano electromechanical transducer device formed on a semiconductor substrate comprises a movable structure which is arranged to be movable in response to actuation of an actuating structure. The movable structure comprises a mechanical structure comprising at least one mechanical layer having a first thermal response characteristic and a first mechanical stress response characteristic, at least one layer of the actuating structure, the at least one layer having a second thermal response characteristic different to the first thermal response characteristic and a second mechanical stress response characteristic different to the first mechanical stress response characteristic, a first compensation layer having a third thermal response characteristic and a third mechanical stress characteristic, and a second compensation layer having a fourth thermal response characteristic and a fourth mechanical stress response characteristic. The first and second compensation layers are arranged to compensate a thermal effect produced by the different first and second thermal response characteristics of the mechanical structure and the at least one layer of the actuating structure such that movement of the movable structure is substantially independent of variations in temperature and to adjust a stress effect produced by the different first and second stress response characteristics of the mechanical structure and the at least one layer of the actuating structure such that the movable structure is deflected a predetermined amount relative to the substrate when the electromechanical transducer device is in an inactive state.
摘要翻译：形成在半导体衬底上的微型或纳米机电换能器装置包括可移动结构，其被布置成响应于致动结构的致动而是可移动的。可移动结构包括机械结构，其包括具有第一热响应特性和第一机械应力响应特性的至少一个机械层，所述致动结构的至少一层，所述至少一层具有与第一热响应特性和与第一机械应力响应特性不同的第二机械应力响应特性，具有第三热响应特性和第三机械应力特性的第一补偿层，以及具有第四热响应特性的第二补偿层和第四机械应力响应特性。第一和第二补偿层布置成补偿由机械结构和致动结构的至少一个层的不同的第一和第二热响应特性产生的热效应，使得可移动结构的移动基本上与并且调节由所述机械结构和所述致动结构的所述至少一个层的不同的第一和第二应力响应特性产生的应力效应，使得当所述机电换能器装置处于非活动状态。

4. 发明申请

US20080036035A1 METHOD FOR MANUFACTURING A PASSIVE INTEGRATED MATCHING NETWORK FOR POWER AMPLIFIERS 有权
标题翻译：用于功率放大器的被动集成匹配网络的制造方法
公开(公告)号：US20080036035A1
公开(公告)日：2008-02-14
申请号：US11830577
申请日：2007-07-30
申请人： Lianjun Liu , Qiang Li , Melvy Miller , Sergio Pacheco
发明人： Lianjun Liu , Qiang Li , Melvy Miller , Sergio Pacheco
IPC分类号： H01L29/00
CPC分类号： H01L25/16 , H01L23/642 , H01L23/645 , H01L23/66 , H01L24/48 , H01L24/49 , H01L25/18 , H01L28/10 , H01L28/40 , H01L2223/6655 , H01L2224/48091 , H01L2224/48137 , H01L2224/48195 , H01L2224/48472 , H01L2224/49175 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H03H7/38 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An impedance matching network is integrated on a first die and coupled to a second die, with the first and second dies mounted on a conductive back plate. The impedance matching network comprises a first inductor bridging between the first and second dies, a second inductor coupled to the first inductor and disposed on the first die, and a metal-insulator-metal (MIM) capacitor disposed on the first die. The MIM capacitor has a first metal layer coupled to the second inductor, and a second metal layer grounded to the conductive back plate. A method for manufacturing the integrated impedance matching network comprises the steps of forming an inductor on a die, forming a capacitor on the die, coupling the capacitor to the inductor, coupling the die bottom surface and the capacitor to a conductive plate, and coupling the inductor to another inductor that bridges between the die and another die.
摘要翻译：阻抗匹配网络集成在第一裸片上并耦合到第二裸片，第一和第二裸片安装在导电背板上。阻抗匹配网络包括桥接在第一和第二管芯之间的第一电感器，耦合到第一电感器并且设置在第一管芯上的第二电感器和设置在第一管芯上的金属 - 绝缘体 - 金属（MIM）电容器。 MIM电容器具有耦合到第二电感器的第一金属层和接地到导电背板的第二金属层。一种用于制造集成阻抗匹配网络的方法包括以下步骤：在管芯上形成电感器，在管芯上形成电容器，将电容器耦合到电感器，将管芯底表面和电容器耦合到导电板上，电感器到另一个电感器，其在管芯和另一个管芯之间桥接。

5. 发明授权

US08736145B2 Electromechanical transducer device and method of forming a electromechanical transducer device 有权
标题翻译：机电换能器装置及形成机电换能装置的方法
公开(公告)号：US08736145B2
公开(公告)日：2014-05-27
申请号：US13128032
申请日：2009-11-25
申请人： Lianjun Liu , Sergio Pacheco , Francois Perruchot , Emmanuel Defay , Patrice Rey
发明人： Lianjun Liu , Sergio Pacheco , Francois Perruchot , Emmanuel Defay , Patrice Rey
IPC分类号： H01L41/06 , H01L41/09
CPC分类号： B81B3/0072 , B81B2201/032 , H01L41/0933 , H01L41/094
摘要： A micro or nano electromechanical transducer device formed on a semiconductor substrate comprises a movable structure which is arranged to be movable in response to actuation of an actuating structure. The movable structure comprises a mechanical structure having at least one mechanical layer having a first thermal response characteristic, at least one layer of the actuating structure having a second thermal response characteristic different to the first thermal response characteristic, and a thermal compensation structure having at least one thermal compensation layer. The thermal compensation layer is different to the at least one layer and is arranged to compensate a thermal effect produced by the mechanical layer and the at least one layer of the actuating structure such that the movement of the movable structure is substantially independent of variations in temperature.
摘要翻译：形成在半导体衬底上的微型或纳米机电换能器装置包括可移动结构，其被布置成响应于致动结构的致动而是可移动的。可移动结构包括具有至少一个具有第一热响应特性的机械层的机械结构，至少一层致动结构具有不同于第一热响应特性的第二热响应特性，以及至少具有至少一个热补偿层。热补偿层不同于至少一个层，并且被布置成补偿由机械层和致动结构的至少一个层产生的热效应，使得可移动结构的运动基本上与温度变化无关。

6. 发明授权

US08513042B2 Method of forming an electromechanical transducer device 有权
标题翻译：形成机电换能器装置的方法
公开(公告)号：US08513042B2
公开(公告)日：2013-08-20
申请号：US13320579
申请日：2010-06-15
申请人： Francois Perruchot , Lianjun Liu , Sergio Pacheco , Emmanuel Defay , Patrice Rey
发明人： Francois Perruchot , Lianjun Liu , Sergio Pacheco , Emmanuel Defay , Patrice Rey
IPC分类号： H01L21/00
CPC分类号： B81C1/00666 , B81B2203/0118 , B81C2201/0167 , B81C2201/0169
摘要： A method of forming an electromechanical transducer device comprises forming on a fixed structure a movable structure and an actuating structure of the electromechanical transducer device, wherein the movable structure is arranged in operation of the electromechanical transducer device to be movable in relation to the fixed structure in response to actuation of the actuating structure. The method further comprises providing a stress trimming layer on at least part of the movable structure, after providing the stress trimming layer, releasing the movable structure from the fixed structure to provide a released electromechanical transducer device, and after releasing the movable structure changing stress in the stress trimming layer of the released electromechanical transducer device such that the movable structure is deflected a predetermined amount relative to the fixed structure when the electromechanical transducer device is in an off state.
摘要翻译：一种形成机电换能器装置的方法包括在固定结构上形成机电换能器装置的可移动结构和致动结构，其中可移动结构被布置成在机电换能器装置的操作中相对于固定结构可移动响应致动结构的致动。该方法还包括在提供应力修剪层之后，在可移动结构的至少一部分上提供应力修剪层，将可移动结构从固定结构释放以提供释放的机电换能器装置，以及在释放可移动结构之后，改变应力释放的机电换能器装置的应力修剪层，使得当机电换能器装置处于关闭状态时，可移动结构相对于固定结构偏转预定量。

7. 发明申请

US20120056308A1 METHOD OF FORMING AN ELECTROMECHANICAL TRANSDUCER DEVICE 有权
标题翻译：形成机电传感器装置的方法
公开(公告)号：US20120056308A1
公开(公告)日：2012-03-08
申请号：US13320579
申请日：2010-06-15
申请人： Francois Perruchot , Lianjun Liu , Sergio Pacheco , Emmanuel Defay , Patrice Rey
发明人： Francois Perruchot , Lianjun Liu , Sergio Pacheco , Emmanuel Defay , Patrice Rey
IPC分类号： H01L29/66 , H01L21/66
CPC分类号： B81C1/00666 , B81B2203/0118 , B81C2201/0167 , B81C2201/0169
摘要： A method of forming an electromechanical transducer device comprises forming on a fixed structure a movable structure and an actuating structure of the electromechanical transducer device, wherein the movable structure is arranged in operation of the electromechanical transducer device to be movable in relation to the fixed structure in response to actuation of the actuating structure. The method further comprises providing a stress trimming layer on at least part of the movable structure, after providing the stress trimming layer, releasing the movable structure from the fixed structure to provide a released electromechanical transducer device, and after releasing the movable structure changing stress in the stress trimming layer of the released electromechanical transducer device such that the movable structure is deflected a predetermined amount relative to the fixed structure when the electromechanical transducer device is in an off state.
摘要翻译：一种形成机电换能器装置的方法包括在固定结构上形成机电换能器装置的可移动结构和致动结构，其中可移动结构被布置成在机电换能器装置的操作中相对于固定结构可移动响应致动结构的致动。该方法还包括在提供应力修剪层之后，在可移动结构的至少一部分上提供应力修剪层，将可移动结构从固定结构释放以提供释放的机电换能器装置，以及在释放可移动结构之后，改变应力释放的机电换能器装置的应力修剪层，使得当机电换能器装置处于关闭状态时，可移动结构相对于固定结构偏转预定量。

8. 发明申请

US20110233693A1 ELECTROMECHANICAL TRANSDUCER DEVICE AND METHOD OF FORMING A ELECTROMECHANICAL TRANSDUCER DEVICE 有权
标题翻译：机电传感器装置及形成机电传感器装置的方法
公开(公告)号：US20110233693A1
公开(公告)日：2011-09-29
申请号：US13128035
申请日：2009-11-25
申请人： François Perruchot , Emmanuel Defay , Patrice Rey , Lianjun Liu , Sergio Pacheco
发明人： François Perruchot , Emmanuel Defay , Patrice Rey , Lianjun Liu , Sergio Pacheco
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： B81B3/0072 , B81B2201/032 , H01L41/0933 , H01L41/094
摘要： A micro or nano electromechanical transducer device formed on a semiconductor substrate comprises a movable structure which is arranged to be movable in response to actuation of an actuating structure. The movable structure comprises a mechanical structure comprising at least one mechanical layer having a first thermal response characteristic and a first mechanical stress response characteristic, at least one layer of the actuating structure, the at least one layer having a second thermal response characteristic different to the first thermal response characteristic and a second mechanical stress response characteristic different to the first mechanical stress response characteristic, a first compensation layer having a third thermal response characteristic and a third mechanical stress characteristic, and a second compensation layer having a fourth thermal response characteristic and a fourth mechanical stress response characteristic. The first and second compensation layers are arranged to compensate a thermal effect produced by the different first and second thermal response characteristics of the mechanical structure and the at least one layer of the actuating structure such that movement of the movable structure is substantially independent of variations in temperature and to adjust a stress effect produced by the different first and second stress response characteristics of the mechanical structure and the at least one layer of the actuating structure such that the movable structure is deflected a predetermined amount relative to the substrate when the electromechanical transducer device is in an inactive state.
摘要翻译：形成在半导体衬底上的微型或纳米机电换能器装置包括可移动结构，其被布置成响应于致动结构的致动而是可移动的。可移动结构包括机械结构，其包括具有第一热响应特性和第一机械应力响应特性的至少一个机械层，所述致动结构的至少一层，所述至少一层具有与第一热响应特性和与第一机械应力响应特性不同的第二机械应力响应特性，具有第三热响应特性和第三机械应力特性的第一补偿层，以及具有第四热响应特性的第二补偿层和第四机械应力响应特性。第一和第二补偿层布置成补偿由机械结构和致动结构的至少一个层的不同的第一和第二热响应特性产生的热效应，使得可移动结构的移动基本上与并且调节由所述机械结构和所述致动结构的所述至少一个层的不同的第一和第二应力响应特性产生的应力效应，使得当所述机电换能器装置处于非活动状态。

9. 发明申请

US20110221307A1 ELECTROMECHANICAL TRANSDUCER DEVICE AND METHOD OF FORMING A ELECTROMECHANICAL TRANSDUCER DEVICE 有权
标题翻译：机电传感器装置及形成机电传感器装置的方法
公开(公告)号：US20110221307A1
公开(公告)日：2011-09-15
申请号：US13128032
申请日：2009-11-25
申请人： Lianjun Liu , Sergio Pacheco , Francois Perruchot , Emmanuel Defay , Patrice Rey
发明人： Lianjun Liu , Sergio Pacheco , Francois Perruchot , Emmanuel Defay , Patrice Rey
IPC分类号： H01L41/04
CPC分类号： B81B3/0072 , B81B2201/032 , H01L41/0933 , H01L41/094
摘要： A micro or nano electromechanical transducer device formed on a semiconductor substrate comprises a movable structure which is arranged to be movable in response to actuation of an actuating structure. The movable structure comprises a mechanical structure having at least one mechanical layer having a first thermal response characteristic, at least one layer of the actuating structure having a second thermal response characteristic different to the first thermal response characteristic, and a thermal compensation structure having at least one thermal compensation layer. The thermal compensation layer is different to the at least one layer and is arranged to compensate a thermal effect produced by the mechanical layer and the at least one layer of the actuating structure such that the movement of the movable structure is substantially independent of variations in temperature.
摘要翻译：形成在半导体衬底上的微型或纳米机电换能器装置包括可移动结构，其被布置成响应于致动结构的致动而是可移动的。可移动结构包括具有至少一个具有第一热响应特性的机械层的机械结构，至少一层致动结构具有不同于第一热响应特性的第二热响应特性，以及至少具有至少一个热补偿层。热补偿层不同于至少一个层，并且被布置成补偿由机械层和致动结构的至少一个层产生的热效应，使得可移动结构的运动基本上与温度变化无关。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式