专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07226653B2 Printed circuit board and method for producing a printed circuit board 失效
标题翻译：印刷电路板及印刷电路板的制造方法
公开(公告)号：US07226653B2
公开(公告)日：2007-06-05
申请号：US10398961
申请日：2001-08-02
申请人： Peter Straub , Peter Weber
发明人： Peter Straub , Peter Weber
IPC分类号： B32B3/00 , H05K1/00 , H01L23/14
CPC分类号： H05K1/0306 , Y10T428/24917 , Y10T428/24926 , Y10T428/265
摘要： A printed circuit board for an electronic circuit, especially for the ultra-high frequencies located in the GHz range that comprises at least one conductor layer, which is arranged on top of an insulating layer and which is flatly joined to said insulating layer. Improved mechanical, thermal and electrical properties are attained by virtue of the fact that the insulating layer is a thin glass layer.
摘要翻译：一种用于电子电路的印刷电路板，特别是位于GHz范围内的超高频，其包括至少一个导体层，其布置在绝缘层的顶部并且平坦地接合到所述绝缘层。凭借绝缘层是薄玻璃层的事实，可获得机械，热和电性能的改善。

2. 发明授权

US4653569A Process for producing fiber-reinforced light-metal castings 失效
标题翻译：生产纤维增强轻金属铸件的工艺
公开(公告)号：US4653569A
公开(公告)日：1987-03-31
申请号：US827288
申请日：1986-02-07
申请人： Eggert Tank , Dieter Hedrich , Peter Straub
发明人： Eggert Tank , Dieter Hedrich , Peter Straub
IPC分类号： B22D19/14 , C22C47/00 , C22C47/08 , C22C47/12
CPC分类号： C22C47/08 , B22D19/14
摘要： A process is described for producing fiber-reinforced light-metal castings in which a loose fiber tangle is placed in a casting mold and is saturated with molten light-metal under low pressure. Subsequently, the excess of molten light-metal is squeezed off while the fiber tangle is compressed. The outflow of the molten light-metal is then stopped with the molten light-metal being solidified under high pressure. The process is especially suitable for utilizing the solution-spun inorganic fiber tangles that up to now had not been especially suitable for the reinforcing of light-metals.
摘要翻译：描述了一种制造纤维增强轻金属铸件的方法，其中在铸模中放置松散的纤维缠结并在低压下被熔融的轻金属饱和。随后，当纤维缠结被压缩时，熔融轻金属的过量被挤出。然后在熔融的轻金属在高压下固化，停止熔融的轻金属的流出。该方法特别适用于迄今为止特别适用于轻金属增强的溶液纺丝无机纤维缠结。

3. 发明授权

US06938561B1 Device for producing a rotating flow 有权
标题翻译：用于产生旋转流的装置
公开(公告)号：US06938561B1
公开(公告)日：2005-09-06
申请号：US09650533
申请日：2000-08-30
申请人： Erich Vogler , Peter Straub , Gérard Capitaine , Jean-Pierre Budliger
发明人： Erich Vogler , Peter Straub , Gérard Capitaine , Jean-Pierre Budliger
IPC分类号： F23G5/44 , F23G5/14 , F23J15/00 , F23L9/02 , F23B5/00 , F23G7/06 , F23L9/04
CPC分类号： F23J15/003 , F23G2202/106 , F23L9/02 , F23L2900/07002
摘要： A device for producing a rotating flow in a rectangular flow duct which has a flue-gas outlet of an incineration plant, in particular of a garbage incineration plant, and a transition region from a combustion chamber of the incineration plant to the flue-gas outlet. First wall sections on two opposite walls define the flow duct and have a wall width b. The first wall sections have a length l1 of at least approximately 0.4b
摘要翻译：一种用于在矩形流动管道中产生旋转流的装置，该流动管道具有焚化装置的烟道气出口，特别是垃圾焚烧装置，以及从焚化装置的燃烧室到烟气出口的过渡区域。两个相对的壁上的第一壁部分限定了流动管道并且具有壁宽度b。第一壁部分具有至少约0.4b <0.8b的长度l 1/2。这些第一壁部分以流体管道的中心纵向轴线为对称轴线，彼此是中心对称的并且在一侧由相邻的壁限定。在第一壁部分中，可以以喷射形式发射的介质的第一喷嘴在喷射平面中被排列成一排，使得它们将射流喷射到喷射平面中，该角度位于喷射平面中在壁和喷射射流之间至少约90°。

4. 发明申请

US20120013431A1 FUSE ELEMENT 审中-公开
标题翻译：保险丝元件
公开(公告)号：US20120013431A1
公开(公告)日：2012-01-19
申请号：US13161544
申请日：2011-06-16
申请人： Hans-Peter Blattler , Peter Straub , Jose Ramos
发明人： Hans-Peter Blattler , Peter Straub , Jose Ramos
IPC分类号： H01H85/046
摘要： A fuse element (10), in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material (11), which is usable particularly in the multilayer technology and is coated with a metal or metal alloy (15), from which metal or metal alloy the fuse (12) is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse (10) is distinguished in that the printed circuit board substrate material (11), on which the fuse (12) can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy (15) from which the fuse (12) is made.
摘要翻译：一种特别适合用于由多层技术构成的电气和/或电子电路的熔丝元件（10），包括印刷电路板基板材料（11），其特别可用在多层技术中并被涂覆有金属或金属合金（15），通过光刻和/或印刷图像产生技术并随后进行蚀刻或雕刻工艺，产生金属或金属合金熔丝（12）。保险丝（10）的特征在于可以提供保险丝（12）的印刷电路板基板材料（11）至少包括具有热膨胀系数的高温稳定的电绝缘材料其基本上类似于制造熔丝（12）的金属或金属合金（15）的热膨胀系数变化。

5. 发明授权

US10755884B2 Fuse element 有权
公开(公告)号：US10755884B2
公开(公告)日：2020-08-25
申请号：US13161544
申请日：2011-06-16
申请人： Hans-Peter Blattler , Peter Straub , Jose Ramos
发明人： Hans-Peter Blattler , Peter Straub , Jose Ramos
IPC分类号： H01H85/046 , H01H85/02 , H05K1/02 , H05K1/03 , H01H69/02
摘要： A fuse element, in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material, which is usable particularly in the multilayer technology and is coated with a metal or metal alloy from which the fuse is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse is distinguished in that the printed circuit board substrate material, on which the fuse can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy from which the fuse is made.

6. 发明授权

US06116495A Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same 失效
标题翻译：在两面或多层上用铜材料覆盖的电路板及其制造方法
公开(公告)号：US06116495A
公开(公告)日：2000-09-12
申请号：US271534
申请日：1999-03-18
申请人： Dietrich Richter , Peter Straub , Marian Lancki , Peter Diehm , Dieter Berchtold , Hans-Georg Wissmeier
发明人： Dietrich Richter , Peter Straub , Marian Lancki , Peter Diehm , Dieter Berchtold , Hans-Georg Wissmeier
IPC分类号： H05K1/02 , H05K3/00 , H05K3/34 , B23K1/00
CPC分类号： H05K3/0061 , H05K3/341 , H05K1/0206 , H05K2201/10416 , H05K2203/0278 , H05K2203/1581 , Y02P70/613 , Y10S428/901
摘要： A circuit-board overlaid with a copper material on both sides with a lead-tin layer on the copper material and a plate-shaped heat sink (6). To achieve desirable dissipation of heat generated by electronic components on such circuit-board, the heat sink (6) is provided with a copper surface and then a layer of silver (8) applied to it is soldered to one side of the circuit-board (1). In a method of fabricating the circuit-board, a heat sink (6) having a copper surface is provided with a silver layer (8) and is applied to the circuit board (1) with its side (7) having the silver layer (8) The heat sink (6) is pressed with the circuit board (1) and a heated platen (20) in close contact with the heat sink (6).
摘要翻译：电路板在两面上覆盖有铜材料，铜材上的铅锡层和板状散热片（6）。为了在这种电路板上实现由电子部件产生的热量的期望散热，散热器（6）设置有铜表面，然后施加到其上的一层银（8）被焊接到电路板的一侧（1）。在制造电路板的方法中，具有铜表面的散热器（6）设置有银层（8），并且其电路板（1）被施加到其具有银层的侧面（7）（ 8）散热片（6）与电路板（1）和加热的压板（20）与散热片（6）紧密接触。

7. 发明授权

US5914861A Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same 失效
标题翻译：两面或多层用铜材料覆盖的电路板及其制造方法
公开(公告)号：US5914861A
公开(公告)日：1999-06-22
申请号：US996356
申请日：1997-12-22
申请人： Dietrich Richter , Peter Straub , Marian Lancki , Peter Diehm , Dieter Berchtold , Hans-Georg Wissmeier
发明人： Dietrich Richter , Peter Straub , Marian Lancki , Peter Diehm , Dieter Berchtold , Hans-Georg Wissmeier
IPC分类号： H05K1/02 , H05K3/00 , H05K3/34 , H05K7/20
CPC分类号： H05K3/0061 , H05K3/341 , H05K1/0206 , H05K2201/10416 , H05K2203/0278 , H05K2203/1581 , Y02P70/613 , Y10S428/901
摘要： A circuit-board overlaid with a copper material on both sides with a lead-tin layer on the copper material and a plate-shaped heat sink (6). To achieve desirable dissipation of heat generated by electronic components on such circuit-board, the heat sink (6) is provided with a copper surface and then a layer of silver (8) applied to it is soldered to one side of the circuit-board (1). In a method of fabricating the circuit-board, a heat sink (6) having a copper surface is provided with a silver layer (8) and is applied to the circuit board (1) with its side (7) having the silver layer (8). The heat sink (6) is pressed with the circuit board (1) and a heated platen (20) in close contact with the heat sink (6).
摘要翻译：电路板在两面上覆盖有铜材料，铜材上的铅锡层和板状散热片（6）。为了在这种电路板上实现由电子部件产生的热量的期望散热，散热器（6）设置有铜表面，然后施加到其上的一层银（8）被焊接到电路板的一侧（1）。在制造电路板的方法中，具有铜表面的散热器（6）设置有银层（8），并且其电路板（1）被施加到其具有银层的侧面（7）（ 8）。散热片（6）与电路板（1）和与散热片（6）紧密接触的加热压板（20）被按压。

8. 发明授权

US4586554A Process for manufacturing fiber reinforced light metal castings 失效
标题翻译：制造纤维增强轻金属铸件的工艺
公开(公告)号：US4586554A
公开(公告)日：1986-05-06
申请号：US698795
申请日：1985-02-06
申请人： Eggert Tank , Peter Straub
发明人： Eggert Tank , Peter Straub
IPC分类号： B22D17/00 , B22D19/14 , B29C45/14 , B29C45/26 , C22C47/00 , C22C47/08 , C22C47/12 , C22C49/04
CPC分类号： B22D17/00 , B22D19/14 , C22C49/04
摘要： A process is provided for the production of fibre-reinforced light-metal castings by die casting. A fibre moulding is introduced into an auxiliary mould and the auxiliary mould is heated to an optimum temperature above the melting point of the light metal. The auxiliary mould is then inserted with positive fit into a die casting mould corresponding to the outer contour of the auxiliary mould and filled with light metal under pressure. The fibre moulding can optionally be stabilized by means of a temporary organic binder which decomposes when the auxiliary mould is heated.
摘要翻译：提供了通过压铸生产纤维增强轻金属铸件的方法。将纤维成型体引入辅助模具中，并将辅助模具加热至高于轻金属熔点的最佳温度。然后将辅助模具正确地插入到与辅助模具的外部轮廓相对应的压铸模具中，并在压力下填充轻金属。纤维成型体可以任选地通过临时有机粘合剂来稳定，其在辅助模具被加热时分解。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式