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1. 发明授权

US4909025A Drive unit for harvester blade assembly 失效
标题翻译：收割机叶片组件的驱动单元
公开(公告)号：US4909025A
公开(公告)日：1990-03-20
申请号：US231885
申请日：1988-08-12
申请人： Peter Reissig , Manfred Hille , Manfred Tetchmann , Bernd Zumpe , Michael Beck , Rudolf Simon , Arndt During
发明人： Peter Reissig , Manfred Hille , Manfred Tetchmann , Bernd Zumpe , Michael Beck , Rudolf Simon , Arndt During
IPC分类号： A01D34/30
CPC分类号： A01D34/305
摘要： A blade assembly normally driven by a power takeoff shaft has a frame normally displaced in a travel direction and provided with a pair of blade carriers horizontally reciprocal transverse to the direction. The drive unit comprises a right-angle transmission having a horizontal input connected to the power takeoff shaft and a vertical output, a vertical shaft offset from the output and having a pair of angularly offset eccentrics, and a belt drive interconnecting the transmission output and the vertical shaft. A pair of relatively long actuating arms extending in the direction flank the transmission and shaft and have rear ends pivoted on the frame and front ends connected to the respective blade carriers. A pair of respective connector plates extending transversely of the direction have respective inner ends carried on the eccentrics and outer ends connected to the arms between the ends thereof. The frame comprises side plates extending in the direction and transversely bridged by front, center, and rear bars.
摘要翻译：通常由动力输出轴驱动的叶片组件具有通常在行进方向上移位的框架，并且设置有横向于该方向水平往复的一对叶片承载件。驱动单元包括具有连接到动力输出轴和垂直输出的水平输入的直角传动装置，从输出偏移并具有一对角偏移的偏心轮的垂直轴以及将变速器输出和竖井。一对相对长的致动臂，其沿着传动轴和轴的侧面延伸，并且具有在框架上枢转的后端，并且前端连接到相应的叶片承载件。沿着该方向横向延伸的一对相应的连接器板具有承载在偏心件上的相应的内端和连接到其端部之间的臂的外端。该框架包括沿着该方向延伸并横向由前，中，后杆桥接的侧板。

2. 发明申请

US20190173854A1 DECENTRALIZED INFORMATION SHARING NETWORK 审中-公开
公开(公告)号：US20190173854A1
公开(公告)日：2019-06-06
申请号：US16198296
申请日：2018-11-21
申请人： Michael Beck
发明人： Michael Beck
IPC分类号： H04L29/06 , H04L9/32 , H04L9/06 , H04L29/08
摘要： A payload data can be received. The payload data can be packaged into a first immutable secure container at a first secure system. A new block of a blockchain can be created. The new block of the block chain can be separate from the first secure system. The new block can include a proof of existence of the payload data.

3. 发明授权

US08309435B2 Crack stops for semiconductor devices 有权
标题翻译：半导体器件的裂纹停止
公开(公告)号：US08309435B2
公开(公告)日：2012-11-13
申请号：US13160214
申请日：2011-06-14
申请人： Erdem Kaltalioglu , Michael Beck
发明人： Erdem Kaltalioglu , Michael Beck
IPC分类号： H01L23/544
CPC分类号： H01L21/78 , H01L23/585 , H01L2924/0002 , H01L2924/00
摘要： Crack stops for semiconductor devices, semiconductor devices, and methods of manufacturing semiconductor devices are disclosed. In one embodiment, a barrier structure for a semiconductor device includes a plurality of substantially V-shaped regions. Each of the plurality of substantially V-shaped regions is disposed adjacent another of the plurality of substantially V-shaped regions.
摘要翻译：公开了用于半导体器件，半导体器件和制造半导体器件的方法的裂纹停止。在一个实施例中，用于半导体器件的阻挡结构包括多个基本上V形的区域。多个基本V形区域中的每一个被设置成与多个基本V形区域中的另一个相邻。

4. 发明申请

US20120093854A1 USE OF MYCOPLASMA BOVIS ANTIGEN 有权
标题翻译： MYCOPLASMA BOVIS抗原的使用
公开(公告)号：US20120093854A1
公开(公告)日：2012-04-19
申请号：US13056501
申请日：2009-10-22
申请人： Michael Beck , Phillip Wayne Hayes , Jeffrey P. Knittel
发明人： Michael Beck , Phillip Wayne Hayes , Jeffrey P. Knittel
IPC分类号： A61K39/295 , A61K39/116 , A61P37/04 , A61P31/22 , A61P31/12 , A61P31/14 , A61P31/20 , A61K39/02 , A61P31/04
CPC分类号： A61K39/0241 , A61K2039/522 , A61K2039/54 , A61K2039/543 , A61K2039/545 , A61K2039/552 , C12N1/36 , C12R1/35
摘要： The present invention relates to combination vaccines and/or the combined use of immunogenic compositions for the treatment and/or prophylaxis of cattle against microbiological infections, wherein the infections are caused by M. bovis and at least one further cattle relevant pathogen. The combination vaccine as described herein comprises at least one M. bovis antigen, preferably the attenuated, avirulent M. bovis as provided herewith and one or more further immunologically active components effective for the treatment and/or prophylaxis of infections caused by a further pathogen of cattle.
摘要翻译：本发明涉及用于治疗和/或预防牛抗微生物感染的免疫原性组合物的组合疫苗和/或组合使用，其中所述感染由牛分枝杆菌和至少一种其他牛相关病原体引起。如本文所述的组合疫苗包含至少一种牛分枝杆菌抗原，优选为本发明提供的减毒的无毒力牛分枝杆菌，以及一种或多种进一步的免疫活性组分，其有效用于治疗和/或预防由另一病原体牛。

5. 发明授权

US08008750B2 Crack stops for semiconductor devices 有权
标题翻译：半导体器件的裂纹停止
公开(公告)号：US08008750B2
公开(公告)日：2011-08-30
申请号：US12024758
申请日：2008-02-01
申请人： Erdem Kaltalioglu , Michael Beck
发明人： Erdem Kaltalioglu , Michael Beck
IPC分类号： H01L23/544
CPC分类号： H01L21/78 , H01L23/585 , H01L2924/0002 , H01L2924/00
摘要： Crack stops for semiconductor devices, semiconductor devices, and methods of manufacturing semiconductor devices are disclosed. In one embodiment, a barrier structure for a semiconductor device includes a plurality of substantially V-shaped regions. Each of the plurality of substantially V-shaped regions is disposed adjacent another of the plurality of substantially V-shaped regions.
摘要翻译：公开了用于半导体器件，半导体器件和制造半导体器件的方法的裂纹停止。在一个实施例中，用于半导体器件的阻挡结构包括多个基本上V形的区域。多个基本V形区域中的每一个被设置成与多个基本V形区域中的另一个相邻。

6. 发明申请

US20100228385A1 System, method and operating unit for forming mixed layers for pallets 有权
标题翻译：用于形成托盘混合层的系统，方法和操作单元
公开(公告)号：US20100228385A1
公开(公告)日：2010-09-09
申请号：US12660727
申请日：2010-03-03
申请人： Michael Beck , Markus Ludsteck
发明人： Michael Beck , Markus Ludsteck
IPC分类号： G06F7/00 , B65G57/00 , G06F3/048
CPC分类号： B65G1/1378 , B65G47/086 , B65G57/24 , B65G60/00 , B65G61/00
摘要： A system (1), a method and an operating unit (62) for the creation of mixed layers for pallets (81, 82, 83, 84) are disclosed. A storage (10) is provided in which at least two different pack types are stored on a plurality of pallets (81, 82, 83, 84), including a plurality of layers of homogenous packs. The packs are intermediately stored in a plurality of individual, parallel conveyors (301, 302, . . . 30N) in a homogenous state. Based on the input of a user (5) on a touch panel (62), the packs are supplied to a grouping table (50) via a supply conveyor (40) in a predetermined sequence. A controller (60) is associated with the system (1) so that, in the grouping table (50), individual different pack types are allocated to the predefined positions of the different pack types as a function of predefined positions of the different pack types in a layer pattern (14) of a layer (24) of a production pallet (12).
摘要翻译：公开了一种用于产生用于托盘（81,82,83,84）的混合层的方法和操作单元（62）。提供了一种存储装置，其中至少两种不同的包装类型存储在多个包括多层均匀包装的托盘（81,82,83,84）中。这些包装以均匀的状态中间存储在多个单独的平行输送机（301,302，...，30N）中。基于触摸面板（62）上的用户（5）的输入，经由供给传送器（40）以预定的顺序将包提供给分组表（50）。控制器（60）与系统（1）相关联，使得在分组表（50）中，根据不同包装类型的预定位置的函数将单独的不同包类型分配给不同包类型的预定义位置在生产托盘（12）的层（24）的层图案（14）中。

7. 发明申请

US20100054022A1 Method and Apparatus for Reducing Charge Trapping in High-K Dielectric Material 有权
标题翻译：用于降低高K电介质材料电荷捕获的方法和装置
公开(公告)号：US20100054022A1
公开(公告)日：2010-03-04
申请号：US12201223
申请日：2008-08-29
申请人： Michael Beck , Martin Kerber , Peter Lahnor , Roland Thewes
发明人： Michael Beck , Martin Kerber , Peter Lahnor , Roland Thewes
IPC分类号： G11C11/24 , G11C7/00
CPC分类号： G11C7/1006 , G11C11/406 , G11C11/40615 , G11C2211/4068
摘要： In one embodiment, an integrated circuit includes a memory array having a plurality of capacitors for storing data of an initial state in the memory array in an initial state. The integrated circuit also includes circuitry for occasionally inverting the data stored by the plurality of capacitors and tracking whether the current state of the data stored by the plurality of capacitors corresponds to the initial state. The circuitry inverts the data read out of the memory array during a read operation when the current state of the data does not correspond to the initial state.
摘要翻译：在一个实施例中，集成电路包括具有多个电容器的存储器阵列，用于在初始状态下存储存储器阵列中初始状态的数据。集成电路还包括用于偶尔反转由多个电容器存储的数据的电路，并且跟踪由多个电容器存储的数据的当前状态是否对应于初始状态。当数据的当前状态不对应于初始状态时，电路在读取操作期间将从存储器阵列读出的数据反相。

8. 发明授权

US07651942B2 Metal interconnect structure and method 有权
标题翻译：金属互连结构和方法
公开(公告)号：US07651942B2
公开(公告)日：2010-01-26
申请号：US11203883
申请日：2005-08-15
申请人： Frank Huebinger , Michael Beck
发明人： Frank Huebinger , Michael Beck
IPC分类号： H01L21/4763
CPC分类号： H01L21/76808 , H01L21/02063 , H01L21/76805 , H01L21/76814
摘要： A method of fabricating a semiconductor device including a metal interconnect structure with a conductive region formed in a first dielectric layer, and an overlying, low-k, dielectric layer. A via and trench are formed in a dual damascene structure in the overlying dielectric layer, the via aligned with the conductive region and the trench. A sacrificial liner to release organic residues is deposited in the via and over the upper surface of the wafer, over which an organic planarization layer is deposited. The organic planarization layer is removed with a dry plasma etch, followed by a wet clean to remove the sacrificial liner. A diffusion barrier to separate the conductive material from the dielectric layers is deposited over the dual damascene structure and over the upper surface of the wafer. A conductive structure is formed over the diffusion barrier and polished to form an even surface for further processing steps.
摘要翻译：一种制造半导体器件的方法，该半导体器件包括具有形成在第一介电层中的导电区域的金属互连结构和上覆的低k电介质层。在上覆电介质层中的双镶嵌结构中形成通孔和沟槽，通孔与导电区域和沟槽对准。用于释放有机残余物的牺牲衬垫沉积在晶片的通孔和上表面上，沉积有机平坦化层。用干等离子体蚀刻除去有机平坦化层，然后进行湿法清洁以除去牺牲衬垫。将导电材料与电介质层分离的扩散阻挡层沉积在双镶嵌结构上并在晶片的上表面上。导电结构形成在扩散阻挡层上并被抛光以形成用于进一步处理步骤的均匀表面。

9. 发明授权

US07615484B2 Integrated circuit manufacturing method using hard mask 有权
标题翻译：使用硬掩模的集成电路制造方法
公开(公告)号：US07615484B2
公开(公告)日：2009-11-10
申请号：US11739595
申请日：2007-04-24
申请人： Wuping Liu , Michael Beck , John A. Fitzsimmons
发明人： Wuping Liu , Michael Beck , John A. Fitzsimmons
IPC分类号： H01L21/4763
CPC分类号： H01L21/76804 , H01L21/02063 , H01L21/76814 , H01L21/76835
摘要： An integrated circuit hard mask processing system is provided including providing a substrate having an integrated circuit; forming an interconnect layer over the integrated circuit; applying a low-K dielectric layer over the interconnect layer; applying a hard mask layer over the low-K dielectric layer; forming a via opening through the hard mask layer and the low-K dielectric layer to the interconnect layer; applying a first fluid and a second fluid in the via opening for removing an overhang of the hard mask layer; depositing an interconnect metal in the via opening; and chemical-mechanical polishing the interconnect metal and the ultra low-K dielectric layer.
摘要翻译：提供一种集成电路硬掩模处理系统，包括提供具有集成电路的基板; 在所述集成电路上形成互连层; 在所述互连层上施加低K电介质层; 在低K电介质层上施加硬掩模层; 通过所述硬掩模层和所述低K电介质层形成通孔至所述互连层; 在所述通孔开口中施加第一流体和第二流体以去除所述硬掩模层的突出端; 在所述通孔开口中沉积互连金属; 并对互连金属和超低K电介质层进行化学机械抛光。

10. 发明申请

US20090130148A1 MYCOPLASMA BOVIS VACCINE AND METHODS OF USE THEREOF 有权
标题翻译： MYCOPLASMA BOVIS VACCINE及其使用方法
公开(公告)号：US20090130148A1
公开(公告)日：2009-05-21
申请号：US12260520
申请日：2008-10-29
申请人： Michael Beck , Jeffrey Knittel
发明人： Michael Beck , Jeffrey Knittel
IPC分类号： A61K39/02 , C12N1/20 , C12N1/02
CPC分类号： C12N1/36 , A61K39/0241 , A61K2039/522 , A61K2039/54 , A61K2039/543 , A61K2039/552 , C12R1/35
摘要： The present invention relates to new attenuated M. bovis bacteria strains. Moreover, the present invention also provides immunogenic compositions comprising live bacteria of an of those attenuated M. bovis bacteria strain, their manufacture and use for the treatment and prophylaxis of M. bovis infections.
摘要翻译：本发明涉及新的减毒牛分枝杆菌菌株。此外，本发明还提供包含那些减毒牛枝原体细菌菌株的活细菌的免疫原性组合物，其制备和用于治疗和预防牛分枝杆菌感染的用途。

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