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1. 发明授权

US5516408A Process for making copper wire 失效
标题翻译：铜线制造工艺
公开(公告)号：US5516408A
公开(公告)日：1996-05-14
申请号：US329235
申请日：1994-10-26
申请人： Peter Peckham , Sharon K. Young , Bradford A. Mills , Adam G. Bay , Michael A. Eamon , Roger N. Wright , Stephen J. Kohut
发明人： Peter Peckham , Sharon K. Young , Bradford A. Mills , Adam G. Bay , Michael A. Eamon , Roger N. Wright , Stephen J. Kohut
IPC分类号： B01D11/04 , B21C23/01 , B22F3/20 , B22F3/24 , B22F9/24 , C22B3/04 , C22B3/24 , C22B3/26 , C22B3/42 , C22B3/44 , C22B7/00 , C22B15/00 , C22B15/14 , C25C1/12 , C25C5/02 , C25D1/04 , H01B13/00 , C25D7/06 , C25D21/18
CPC分类号： C22B3/0005 , C22B15/00 , C22B15/0065 , C22B15/0067 , C22B3/04 , C25C1/12 , C25C5/02 , C25D1/04 , Y02P10/234 , Y02P10/236
摘要： This invention relates to a process for making copper wire directly from a copper-bearing material, comprising: (A) contacting said copper-beating material with an effective amount of at least one aqueous leaching solution to dissolve copper ions into said leaching solution and form a copper-rich aqueous leaching solution; (B) contacting said copper-rich aqueous leaching solution with an effective amount of at least one water-insoluble extractant to transfer copper ions from said copper-rich aqueous leaching solution to said extractant to form a copper-rich extractant and a copper-depleted aqueous leaching solution; (C) separating said copper-rich extractant from said copper-depleted aqueous leaching solution; (D) contacting said copper-rich extractant with an effective amount of at least one aqueous stripping solution to transfer copper ions from said extractant to said stripping solution to form a copper-rich stripping solution and a copper-depleted extractant; (E) separating said copper-rich stripping solution from said copper-depleted extractant; (F) flowing said copper-rich stripping solution between an anode and a cathode, and applying an effective amount of voltage across said anode and said cathode to deposit copper on said cathode; (G) removing said copper from said cathode; and (H) converting said removed copper from (G) to copper wire at a temperature below the melting point of said copper.
摘要翻译：本发明涉及一种直接由含铜材料制造铜线的方法，包括：（A）使所述铜沸腾材料与有效量的至少一种含水浸出溶液接触以将铜离子溶解到所述浸出溶液中并形成富铜水溶液浸出液; （B）使所述富铜水溶液与有效量的至少一种不溶于水的萃取剂接触，将铜离子从所述富铜水溶液浸出溶液转移到所述萃取剂中以形成富含铜的萃取剂和贫铜含水浸出液; （C）从所述贫铜水溶液中分离出所述富铜萃取剂; （D）使所述富含铜的提取剂与有效量的至少一种水性剥离溶液接触，以将铜离子从所述萃取剂转移到所述汽提溶液中以形成富铜的汽提溶液和贫铜萃取剂; （E）将所述富铜剥离溶液与所述贫铜萃取剂分离; （F）使所述富铜剥离溶液在阳极和阴极之间流动，并且在所述阳极和所述阴极上施加有效量的电压以在所述阴极上沉积铜; （G）从所述阴极去除所述铜; 和（H）在低于所述铜的熔点的温度下将所述去除的铜从（G）转换成铜线。

2. 发明授权

US5679232A Process for making wire 失效
标题翻译：制造电线的工艺
公开(公告)号：US5679232A
公开(公告)日：1997-10-21
申请号：US634271
申请日：1996-04-18
申请人： Robert J. Fedor , Peter Peckham , Sharon K. Young , Michael A. Eamon , Roger N. Wright , Stephen J. Kohut , Craig J. Hasegawa , Susan S. Enos , Robert D. DeWitt
发明人： Robert J. Fedor , Peter Peckham , Sharon K. Young , Michael A. Eamon , Roger N. Wright , Stephen J. Kohut , Craig J. Hasegawa , Susan S. Enos , Robert D. DeWitt
IPC分类号： C25D1/04 , B21C37/04 , C25C1/12 , C25D3/38 , D07B1/06 , H01B7/00
CPC分类号： C25D1/04 , C25D3/38 , C25D7/0614 , Y10T29/301 , Y10T29/307 , Y10T29/49789 , Y10T29/4979
摘要： This invention relates to a process for making metal wire, comprising: (A) forming metal foil; (B) cutting said foil to form at least one strand of metal wire; and (C) shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This process is particularly suitable for making copper wire, especially copper wire having a very thin diameter (e.g., about 0.0002 to about 0.02 inch).
摘要翻译：本发明涉及一种制造金属丝的方法，包括：（A）形成金属箔; （B）切割所述箔以形成至少一股金属丝; 和（C）成形所述线材股线以使所述股线具有期望的横截面形状和尺寸。该方法特别适用于制造铜线，特别是具有非常薄的直径（例如约0.0002至约0.02英寸）的铜线。

3. 发明授权

US5820653A Process for making shaped copper articles 失效
标题翻译：制造成型铜制品的工艺
公开(公告)号：US5820653A
公开(公告)日：1998-10-13
申请号：US634432
申请日：1996-04-18
申请人： Michael A. Eamon , Robert J. Fedor , Sharon K. Young , Susan S. Enos , Wendy M. Gort , Roger N. Wright , Stephen J. Kohut
发明人： Michael A. Eamon , Robert J. Fedor , Sharon K. Young , Susan S. Enos , Wendy M. Gort , Roger N. Wright , Stephen J. Kohut
IPC分类号： B01D15/00 , B01D11/04 , B22F1/00 , B22F3/17 , B22F3/20 , B22F5/10 , B22F5/12 , B22F9/04 , B22F9/24 , C01G3/00 , C01G3/10 , C22B3/04 , C22B3/20 , C22B3/26 , C22B3/30 , C22B3/42 , C22B7/00 , C22B7/02 , C22B7/04 , C22B15/00 , C22B15/14 , C22C1/04 , C22C1/05 , C25C1/12 , C25C5/02 , C25C7/06 , C25D1/04
CPC分类号： C22B3/0005 , C01G3/003 , C22B15/0063 , C22B3/0017 , C22C1/0425 , C25C1/12 , C25C5/02 , B22F2998/00 , B22F2998/10 , Y02P10/234 , Y02P10/236
摘要： This invention relates to a process for making a shaped copper article directly from a copper-bearing material, comprising: (A) contacting said copper-bearing material with an effective amount of at least one aqueous leaching solution to dissolve copper ions into said leaching solution and form a copper-rich aqueous leaching solution; (B) contacting said copper-rich aqueous leaching solution with an effective amount of at least one water-insoluble extractant to transfer copper ions from said copper-rich aqueous leaching solution to said extractant to form a copper-rich extractant and a copper-depleted aqueous leaching solution; (C) separating said copper-rich extractant from said copper-depleted aqueous leaching solution; (D) contacting said copper-rich extractant with an effective amount of at least one aqueous stripping solution to transfer copper ions from said extractant to said stripping solution to form a copper-rich stripping solution and a copper-depleted extractant; (E) separating said copper-rich stripping solution from said copper-depleted extractant; (F) flowing said copper-rich stripping solution between an anode and a cathode, and applying an effective amount of voltage across said anode and said cathode to deposit copper powder on said cathode; (G) removing said copper powder from said cathode; and (H) extruding, forging or molding said copper powder to form said shaped copper article.
摘要翻译：本发明涉及直接由含铜材料制造成形铜制品的方法，包括：（A）使所述含铜材料与有效量的至少一种含水浸出溶液接触以将铜离子溶解到所述浸出溶液中并形成富铜水溶液浸出液; （B）使所述富铜水溶液与有效量的至少一种不溶于水的萃取剂接触，将铜离子从所述富铜水溶液浸出溶液转移到所述萃取剂中以形成富含铜的萃取剂和贫铜含水浸出液; （C）从所述贫铜水溶液中分离出所述富铜萃取剂; （D）使所述富含铜的提取剂与有效量的至少一种水性剥离溶液接触，以将铜离子从所述萃取剂转移到所述汽提溶液中以形成富铜的汽提溶液和贫铜萃取剂; （E）将所述富铜剥离溶液与所述贫铜萃取剂分离; （F）使所述富铜剥离溶液在阳极和阴极之间流动，并且在所述阳极和所述阴极上施加有效量的电压以将铜粉沉积在所述阴极上; （G）从所述阴极去除所述铜粉末; 和（H）挤压，锻造或模制所述铜粉以形成所述成形铜制品。

4. 发明授权

US5830583A Copper wire 失效
标题翻译：铜线
公开(公告)号：US5830583A
公开(公告)日：1998-11-03
申请号：US792795
申请日：1997-02-03
申请人： Sidney J. Clouser , Rudolf Wiechmann , Bernd Schneider , Ulrike Bohmler , R. Duane Apperson , Robert J. Fedor , Sharon K. Young , Roger N. Wright , Stephen J. Kohut , Susan S. Enos
发明人： Sidney J. Clouser , Rudolf Wiechmann , Bernd Schneider , Ulrike Bohmler , R. Duane Apperson , Robert J. Fedor , Sharon K. Young , Roger N. Wright , Stephen J. Kohut , Susan S. Enos
IPC分类号： C25D1/04
CPC分类号： C25D1/04 , Y10S428/935 , Y10T428/12431
摘要： This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This invention also relates to a process for making copper wire comprising: flowing an aqueous electrolyte solution between an anode and a cathode and applying an effective amount of voltage across the anode and the cathode to deposit copper foil on the cathode, said electrolyte solution being characterized by a chloride ion concentration of up to about 5 ppm and an organic additive concentration of up to about 0.2 ppm; cutting said foil to form at least one strand of wire; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size.
摘要翻译：本发明涉及具有基本上无定向晶粒结构的基本上均匀的无晶粒状的铜线。本发明还涉及一种制造铜线的方法，包括：切割铜箔以形成铜线的至少一根线，所述铜箔是具有基本上无定向晶粒结构的可退火的电沉积铜箔，其基本上无柱状，所述箔的特征在于在177℃退火15分钟后的疲劳延展性至少约25％; 并且对所述线材进行成形以使所述股线具有期望的横截面形状和尺寸。本发明还涉及一种制造铜线的方法，包括：使阳极和阴极之间的电解质水溶液流动，并在阳极和阴极上施加有效量的电压以将铜箔沉积在阴极上，所述电解质溶液的特征在于通过高达约5ppm的氯离子浓度和高达约0.2ppm的有机添加剂浓度; 切割所述箔以形成至少一根丝线; 并且对所述线材进行成形以使所述股线具有期望的横截面形状和尺寸。

5. 发明授权

US6123788A Copper wire and process for making copper wire 失效
标题翻译：铜线和铜线制造工艺
公开(公告)号：US6123788A
公开(公告)日：2000-09-26
申请号：US647707
申请日：1996-05-24
申请人： Sidney J. Clouser , Rudolf Wiechmann , Bernd Schneider , Ulrike Bohmler , R. Duane Apperson , Robert J. Fedor , Sharon K. Young , Roger N. Wright , Stephen J. Kohut , Susan S. Enos
发明人： Sidney J. Clouser , Rudolf Wiechmann , Bernd Schneider , Ulrike Bohmler , R. Duane Apperson , Robert J. Fedor , Sharon K. Young , Roger N. Wright , Stephen J. Kohut , Susan S. Enos
IPC分类号： C22F1/08 , C25D1/04 , C25D3/38 , C25D5/10 , H05K1/00
CPC分类号： C25D1/04 , C25D5/10 , H05K1/0393 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , H05K2203/1105
摘要： This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This invention also relates to a process for making copper wire comprising: flowing an aqueous electrolyte solution between an anode and a cathode and applying an effective amount of voltage across the anode and the cathode to deposit copper foil on the cathode, said electrolyte solution being characterized by a chloride ion concentration of up to about 5 ppm and an organic additive concentration of up to about 0.2 ppm; cutting said foil to form at least one strand of wire; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size.
摘要翻译：本发明涉及具有基本上无定向晶粒结构的基本上均匀的无晶粒状的铜线。本发明还涉及一种制造铜线的方法，包括：切割铜箔以形成铜线的至少一根线，所述铜箔是具有基本上无定向晶粒结构的可退火的电沉积铜箔，其基本上无柱状，所述箔的特征在于在177℃退火15分钟后的疲劳延展性至少约25％; 并且对所述线材进行成形以使所述股线具有期望的横截面形状和尺寸。本发明还涉及一种制造铜线的方法，包括：使阳极和阴极之间的电解质水溶液流动，并在阳极和阴极上施加有效量的电压以将铜箔沉积在阴极上，所述电解质溶液的特征在于通过高达约5ppm的氯离子浓度和高达约0.2ppm的有机添加剂浓度; 切割所述箔以形成至少一根丝线; 并且对所述线材进行成形以使所述股线具有期望的横截面形状和尺寸。

6. 发明授权

US5520792A Process for making copper metal powder, copper oxides and copper foil 失效
公开(公告)号：US5520792A
公开(公告)日：1996-05-28
申请号：US454537
申请日：1995-03-30
申请人： David P. Burgess , Wendy M. Gort , Ronald K. Haines , Jackson G. Jenkins , Stephen J. Kohut , Peter Peckham
发明人： David P. Burgess , Wendy M. Gort , Ronald K. Haines , Jackson G. Jenkins , Stephen J. Kohut , Peter Peckham
IPC分类号： C22B15/14 , B22F9/24 , C22B3/14 , C22B3/24 , C22B15/00 , C25C1/12 , C25C5/02 , C25D1/04
CPC分类号： C25D1/04 , C22B15/0067 , C25C1/12 , C25C5/02 , Y02P10/236
摘要： This invention is directed to a process for making copper metal powder from copper-bearing material, comprising: (A) contacting said copper-beating material with an effective amount of at least one aqueous leaching solution to dissolve copper ions in said leaching solution and form a copper-rich aqueous leaching solution; (B) contacting said copper-rich aqueous leaching solution with an effective amount of at least one water-insoluble extractant to transfer copper ions from said copper-rich aqueous leaching solution to said extractant to form a copper-rich extractant and a copper-depleted aqueous leaching solution, said extractant comprising (i) at least one oxime characterized by a hydrocarbon linkage with at least one --OH group and at least one .dbd.NOH group attached to different carbon atoms on said hydrocarbon linkage, (ii) at least one betadiketone, or (iii) at least one ion-exchange resin; (C) separating said copper-rich extractant from said copper-depleted aqueous leaching solution; (D) contacting said copper-rich extractant with an effective amount of at least one aqueous stripping solution to transfer copper ions from said extractant to said stripping solution to form a copper-rich stripping solution and a copper-depleted extractant; (E) separating said copper-rich stripping solution from said copper-depleted extractant to form a first electrolyte solution; (F) advancing said first electrolyte solution to an electrolytic cell equipped with at least one first anode and at least one first cathode, and applying an effective amount of voltage across said first anode and said first cathode to deposit copper metal powder on said first cathode; and (G) removing copper metal powder from said first cathode. In one embodiment the copper metal powder is converted to copper foil. In one embodiment the copper metal powder is converted to cuprous oxide, cupric oxide or a mixture thereof; these copper oxides can be readily dissolved in sulfuric acid and used to make copper foil.

7. 发明授权

US5670033A Process for making copper metal powder, copper oxides and copper foil 失效
公开(公告)号：US5670033A
公开(公告)日：1997-09-23
申请号：US544619
申请日：1995-10-18
申请人： David P. Burgess , Wendy M. Gort , Ronald K. Haines , Jackson G. Jenkins , Stephen J. Kohut , Peter Peckham
发明人： David P. Burgess , Wendy M. Gort , Ronald K. Haines , Jackson G. Jenkins , Stephen J. Kohut , Peter Peckham
IPC分类号： C22B3/20 , B22F9/24 , C01G3/02 , C22B15/14 , C25C1/12 , C25C5/02 , C25D1/04
CPC分类号： C01G3/02 , C25C1/12 , C25C5/02 , C25D1/04 , C01P2006/10 , C01P2006/80
摘要： This invention is directed to a process for making copper metal powder from copper-bearing material, comprising: (A) contacting said copper-bearing material with an effective mount of at least one aqueous leaching solution to dissolve copper ions in said leaching solution and form a copper-rich aqueous leaching solution; (B) contacting said copper-rich aqueous leaching solution with an effective amount of at least one water-insoluble extractant to transfer copper ions from said copper-rich aqueous leaching solution to said extractant to form a copper-rich extractant and a copper-depleted aqueous leaching solution; (C) separating said copper-rich extractant from said copper-depleted aqueous leaching solution; (D) contacting said copper-rich extractant with an effective amount of at least one aqueous stripping solution to transfer copper ions from said extractant to said stripping solution to form a copper-rich stripping solution and a copper-depleted extractant; (E) separating said copper-rich stripping solution from said copper-depleted extractant to form a first electrolyte solution; (F) advancing said first electrolyte solution to an electrolytic cell equipped with at least one first anode and at least one first cathode, and applying an effective amount of voltage across said first anode and said first cathode to deposit copper metal powder on said first cathode; and (G) removing copper metal powder from said first cathode. In one embodiment the first electrolyte solution used in step (F) is characterized by a chloride ion concentration of up to about 5 ppm. In one embodiment the first electrolyte solution used in step (F) contains at least one triazole. In one embodiment the copper metal powder is convened to copper foil. In one embodiment the copper metal powder is converted to cuprous oxide, cupric oxide or a mixture thereof; these copper oxides can be readily dissolved in sulfuric acid and used to make copper foil.

8. 发明授权

US5458746A Process for making copper metal powder, copper oxides and copper foil 失效
公开(公告)号：US5458746A
公开(公告)日：1995-10-17
申请号：US287703
申请日：1994-08-09
申请人： David P. Burgess , Wendy M. Gort , Ronald K. Haines , Jackson G. Jenkins , Stephen J. Kohut , Peter Peckham
发明人： David P. Burgess , Wendy M. Gort , Ronald K. Haines , Jackson G. Jenkins , Stephen J. Kohut , Peter Peckham
IPC分类号： C22B15/14 , B22F9/24 , C22B3/14 , C22B3/24 , C22B15/00 , C25C1/12 , C25C5/02 , C25D1/04
CPC分类号： C25D1/04 , C22B15/0067 , C25C1/12 , C25C5/02 , Y02P10/236
摘要： This invention is directed to a process for making copper metal powder from copper-bearing material, comprising: (A) contacting said copper-bearing material with an effective amount of at least one aqueous leaching solution to dissolve copper ions in said leaching solution and form a copper-rich aqueous leaching solution; (B) contacting said copper-rich aqueous leaching solution with an effective amount of at least one water-insoluble extractant to transfer copper ions from said copper-rich aqueous leaching solution to said extractant to form a copper-rich extractant and a copper-depleted aqueous leaching solution, said extractant comprising (i) at least one oxime characterized by a hydrocarbon linkage with at least one --OH group and at least one .dbd.NOH group attached to different carbon atoms on said hydrocarbon linkage, (ii) at least one betadiketone, or (iii) at least one ion-exchange resin; (C) separating said copper-rich extractant from said copper-depleted aqueous leaching solution; (D) contacting said copper-rich extractant with an effective amount of at least one aqueous stripping solution to transfer copper ions from said extractant to said stripping solution to form a copper-rich stripping solution and a copper-depleted extractant; (E) separating said copper-rich stripping solution from said copper-depleted extractant to form a first electrolyte solution; (F) advancing said first electrolyte solution to an electrolytic cell equipped with at least one first anode and at least one first cathode, and applying an effective amount of voltage across said first anode and said first cathode to deposit copper metal powder on said first cathode; and (G) removing copper metal powder from said first cathode. In one embodiment the copper metal powder is converted to copper foil. In one embodiment the copper metal powder is converted to cuprous oxide, cupric oxide or a mixture thereof; these copper oxides can be readily dissolved in sulfuric acid and used to make copper foil.

9. 发明授权

US06531039B2 Anode for plating a semiconductor wafer 有权
公开(公告)号：US06531039B2
公开(公告)日：2003-03-11
申请号：US09790078
申请日：2001-02-21
申请人： Stephen J. Kohut
发明人： Stephen J. Kohut
IPC分类号： C25B1104
CPC分类号： C25D17/10
摘要： An anode for use in electroplating semiconductor wafers, comprising a metal plate formed from a generally continuous casting process that is essentially free of voids or cracks, the casting being thermo-mechanically worked until the anode has an average grain size of less than 100 &mgr;m.

10. 发明授权

US06322609B1 Low density high surface area copper powder and electrodeposition process for making same 有权
标题翻译：低密度高表面积铜粉和电沉积工艺相同
公开(公告)号：US06322609B1
公开(公告)日：2001-11-27
申请号：US09384093
申请日：1999-08-27
申请人： Stephen J. Kohut , Ronald K. Haines , Nicholas D. Sopchak , Wendy Gort
发明人： Stephen J. Kohut , Ronald K. Haines , Nicholas D. Sopchak , Wendy Gort
IPC分类号： B22F100
CPC分类号： C25C5/02 , B22F1/0007 , C22C1/0425
摘要： This invention relates to a low density high surface area copper powder having an apparent density in the range of about 0.20 to about 0.60 gram per cubic centimeter, and a surface area of at least about 0.5 square meter per gram. This invention also relates to an electrodeposition process for making the foregoing copper powder by electrodepositing the copper powder from an electrolyte solution using a critical combination of process parameters. These critical parameters include: a copper ion concentration for the electrolyte solution in the range of about 2 to about 7 grams per liter; a free chloride ion concentration for the electrolyte solution in the range of about 8 to about 20 ppm; an impurity level for the electrolyte solution of no more than about 1.0 gram per liter; and an electrolyte solution that is free of organic additives.
摘要翻译：本发明涉及一种表观密度在约0.20至约0.60克/立方厘米范围内的表面密度为至少约0.5平方米/克的表面积的低密度高表面积铜粉。本发明还涉及通过使用工艺参数的关键组合从电解液中电沉积铜粉来制造上述铜粉的电沉积方法。这些关键参数包括：电解质溶液的铜离子浓度在约2至约7克/升的范围内; 在约8至约20ppm范围内的电解质溶液的游离氯离子浓度; 电解质溶液的杂质含量不超过约1.0克/升; 以及不含有机添加剂的电解质溶液。

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