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    • 2. 发明授权
    • Process for making copper wire
    • 铜线制造工艺
    • US5516408A
    • 1996-05-14
    • US329235
    • 1994-10-26
    • Peter PeckhamSharon K. YoungBradford A. MillsAdam G. BayMichael A. EamonRoger N. WrightStephen J. Kohut
    • Peter PeckhamSharon K. YoungBradford A. MillsAdam G. BayMichael A. EamonRoger N. WrightStephen J. Kohut
    • B01D11/04B21C23/01B22F3/20B22F3/24B22F9/24C22B3/04C22B3/24C22B3/26C22B3/42C22B3/44C22B7/00C22B15/00C22B15/14C25C1/12C25C5/02C25D1/04H01B13/00C25D7/06C25D21/18
    • C22B3/0005C22B15/00C22B15/0065C22B15/0067C22B3/04C25C1/12C25C5/02C25D1/04Y02P10/234Y02P10/236
    • This invention relates to a process for making copper wire directly from a copper-bearing material, comprising: (A) contacting said copper-beating material with an effective amount of at least one aqueous leaching solution to dissolve copper ions into said leaching solution and form a copper-rich aqueous leaching solution; (B) contacting said copper-rich aqueous leaching solution with an effective amount of at least one water-insoluble extractant to transfer copper ions from said copper-rich aqueous leaching solution to said extractant to form a copper-rich extractant and a copper-depleted aqueous leaching solution; (C) separating said copper-rich extractant from said copper-depleted aqueous leaching solution; (D) contacting said copper-rich extractant with an effective amount of at least one aqueous stripping solution to transfer copper ions from said extractant to said stripping solution to form a copper-rich stripping solution and a copper-depleted extractant; (E) separating said copper-rich stripping solution from said copper-depleted extractant; (F) flowing said copper-rich stripping solution between an anode and a cathode, and applying an effective amount of voltage across said anode and said cathode to deposit copper on said cathode; (G) removing said copper from said cathode; and (H) converting said removed copper from (G) to copper wire at a temperature below the melting point of said copper.
    • 本发明涉及一种直接由含铜材料制造铜线的方法,包括:(A)使所述铜沸腾材料与有效量的至少一种含水浸出溶液接触以将铜离子溶解到所述浸出溶液中并形成 富铜水溶液浸出液; (B)使所述富铜水溶液与有效量的至少一种不溶于水的萃取剂接触,将铜离子从所述富铜水溶液浸出溶液转移到所述萃取剂中以形成富含铜的萃取剂和贫铜 含水浸出液; (C)从所述贫铜水溶液中分离出所述富铜萃取剂; (D)使所述富含铜的提取剂与有效量的至少一种水性剥离溶液接触,以将铜离子从所述萃取剂转移到所述汽提溶液中以形成富铜的汽提溶液和贫铜萃取剂; (E)将所述富铜剥离溶液与所述贫铜萃取剂分离; (F)使所述富铜剥离溶液在阳极和阴极之间流动,并且在所述阳极和所述阴极上施加有效量的电压以在所述阴极上沉积铜; (G)从所述阴极去除所述铜; 和(H)在低于所述铜的熔点的温度下将所述去除的铜从(G)转换成铜线。
    • 4. 发明授权
    • Process for making copper foil
    • 制作铜箔的工艺
    • US5366612A
    • 1994-11-22
    • US49176
    • 1993-04-19
    • Sidney J. ClouserMichael A. EamonThomas L. JordanStephen I. Kohut
    • Sidney J. ClouserMichael A. EamonThomas L. JordanStephen I. Kohut
    • B01D11/02C08J5/20C22B3/04C22B3/14C22B3/24C22B3/26C22B15/00C25C1/12C25D1/04C25D5/04C25D21/14C25D1/20
    • C22B3/0005C22B15/00C22B15/0065C22B3/04C25D1/04Y02P10/234Y02P10/236
    • The present invention relates to a process for making copper foil from copper-bearing material comprising:(A) contacting said copper-bearing material with an effective amount of at least one aqueous leaching solution to dissolve copper ions into said leaching solution and form a copper-rich aqueous leaching solution;(B) contacting said copper-rich aqueous leaching solution with an effective amount of at least one water-insoluble extractant to transfer copper ions from said copper-rich aqueous leaching solution to said extractant to form a copper-rich extractant and a copper-depleted aqueous leaching solution;(C) separating said copper-rich extractant from said copper-depleted aqueous leaching solution;(D) contacting said copper-rich extractant with an effective amount of at least one aqueous stripping solution to transfer copper ions from said extractant to said stripping solution to form a copper-rich stripping solution and a copper-depleted extractant;(E) separating said copper-rich stripping solution from said copper-depleted extractant;(F) flowing said copper-rich stripping solution between an anode and a rotating cathode, and applying an effective amount of voltage across said anode and said cathode to deposit copper on said cathode; and(G) continuously removing copper foil from said cathode.
    • 本发明涉及由含铜材料制造铜箔的方法,包括:(A)使所述含铜材料与有效量的至少一种含水浸出溶液接触以将铜离子溶解到所述浸出溶液中并形成铜 含水浸出液; (B)使所述富铜水溶液与有效量的至少一种不溶于水的萃取剂接触,将铜离子从所述富铜水溶液浸出溶液转移到所述萃取剂中以形成富含铜的萃取剂和贫铜 含水浸出液; (C)从所述贫铜水溶液中分离出所述富铜萃取剂; (D)使所述富含铜的提取剂与有效量的至少一种水性剥离溶液接触,以将铜离子从所述萃取剂转移到所述汽提溶液中以形成富铜的汽提溶液和贫铜萃取剂; (E)将所述富铜剥离溶液与所述贫铜萃取剂分离; (F)使所述富铜剥离溶液在阳极和旋转阴极之间流动,并且在所述阳极和所述阴极上施加有效量的电压以在所述阴极上沉积铜; 和(G)从所述阴极连续地除去铜箔。