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    • 1. 发明授权
    • Methods of forming inductors on integrated circuits
    • 在集成电路上形成电感器的方法
    • US08042260B2
    • 2011-10-25
    • US12250385
    • 2008-10-13
    • Peter J. HopperPeter JohnsonPeter SmeysAndrei Papou
    • Peter J. HopperPeter JohnsonPeter SmeysAndrei Papou
    • H01F7/06
    • H01L23/5227H01F17/0006H01F41/046H01L2924/0002Y10T29/4902Y10T29/49071Y10T29/49073Y10T29/49075Y10T29/49124Y10T29/4913H01L2924/00
    • The claimed invention pertains to methods of forming one or more inductors on a semiconductor substrate. In one embodiment, a method of forming an array of inductor core elements on a semiconductor substrate that includes integrated circuits is disclosed. A first set of spaced apart metallic core elements are formed over the substrate. Isolation sidewalls are then formed on side surfaces of the core elements. Afterward, a second set of metallic core elements are formed over the substrate. The first and second sets of core elements are substantially co-planar and interleaved such that only the isolation sidewalls separate adjacent core elements. Particular embodiments involve other processing operations, such as the selective electroplating of different types of metal to form core elements and/or the deposition and etching away of an isolation layer to form isolation sidewalls on the core elements.
    • 所要求保护的发明涉及在半导体衬底上形成一个或多个电感器的方法。 在一个实施例中,公开了一种在包括集成电路的半导体衬底上形成电感器芯元件阵列的方法。 第一组间隔开的金属芯元件形成在衬底上。 然后在芯元件的侧表面上形成隔离侧壁。 之后,在衬底上形成第二组金属芯元件。 第一和第二组芯元件基本上是共面的和交错的,使得只有隔离侧壁分隔相邻的芯元件。 具体实施例涉及其他处理操作,例如不同类型的金属的选择性电镀以形成核心元件和/或沉积和蚀刻离开隔离层以在核心元件上形成隔离侧壁。
    • 2. 发明授权
    • Integrated circuits with inductors
    • 集成电路与电感器
    • US07755463B2
    • 2010-07-13
    • US12250382
    • 2008-10-13
    • Peter J. HopperPeter JohnsonPeter SmeysAndrei Papou
    • Peter J. HopperPeter JohnsonPeter SmeysAndrei Papou
    • H01F5/00H01F27/28H01F21/06H01F27/30H01F27/24H02M1/00G05F1/00
    • H01L23/5227H01F17/0006H01F41/046H01L2924/0002Y10T29/4902Y10T29/49071Y10T29/49073Y10T29/49075Y10T29/49124Y10T29/4913H01L2924/00
    • The claimed invention relates to arrangements of inductors and integrated circuit dice. One embodiment pertains to an integrated circuit die that has an inductor formed thereon. The inductor includes an inductor winding having a winding input and a winding output. The inductor also comprises an inductor core array having at least first and second sets of inductor core elements that are magnetically coupled with the inductor winding. Each inductor core element in the first set of inductor core elements is formed from a first metallic material. Each inductor core element in the second set of inductor core elements is formed from a second metallic material that has a different magnetic coercivity than the first magnetic material. The inductor further comprises a set of spacers that electrically isolate the inductor core elements. Some embodiments involve multiple inductor windings and/or multiple inductor core elements that magnetically interact in various ways. Particular embodiments involve core elements having different compositions and/or sizes.
    • 所要求保护的发明涉及电感器和集成电路芯片的布置。 一个实施例涉及其上形成有电感器的集成电路管芯。 电感器包括具有绕组输入和绕组输出的电感器绕组。 电感器还包括电感器芯阵列,其具有与电感器绕组磁耦合的至少第一组和第二组电感器芯体元件。 第一组电感器芯元件中的每个电感器芯体元件由第一金属材料形成。 第二组电感器芯元件中的每个电感器芯体元件由具有与第一磁性材料不同的磁矫顽力的第二金属材料形成。 电感器还包括一组将电感器芯元件电隔离的间隔件。 一些实施例涉及以各种方式磁性相互作用的多个电感器绕组和/或多个电感器核心元件。 具体实施方案涉及具有不同组成和/或尺寸的核心元件。
    • 3. 发明申请
    • INTEGRATED CIRCUITS WITH INDUCTORS
    • 集成电路与电感器
    • US20090040000A1
    • 2009-02-12
    • US12250382
    • 2008-10-13
    • Peter J. HopperPeter JohnsonPeter SmeysAndrei Papou
    • Peter J. HopperPeter JohnsonPeter SmeysAndrei Papou
    • H01F5/00
    • H01L23/5227H01F17/0006H01F41/046H01L2924/0002Y10T29/4902Y10T29/49071Y10T29/49073Y10T29/49075Y10T29/49124Y10T29/4913H01L2924/00
    • The claimed invention relates to arrangements of inductors and integrated circuit dice. One embodiment pertains to an integrated circuit die that has an inductor formed thereon. The inductor includes an inductor winding having a winding input and a winding output. The inductor also comprises an inductor core array having at least first and second sets of inductor core elements that are magnetically coupled with the inductor winding. Each inductor core element in the first set of inductor core elements is formed from a first metallic material. Each inductor core element in the second set of inductor core elements is formed from a second metallic material that has a different magnetic coercivity than the first magnetic material. The inductor further comprises a set of spacers that electrically isolate the inductor core elements. Some embodiments involve multiple inductor windings and/or multiple inductor core elements that magnetically interact in various ways. Particular embodiments involve core elements having different compositions and/or sizes.
    • 所要求保护的发明涉及电感器和集成电路芯片的布置。 一个实施例涉及其上形成有电感器的集成电路管芯。 电感器包括具有绕组输入和绕组输出的电感器绕组。 电感器还包括电感器芯阵列,其具有与电感器绕组磁耦合的至少第一组和第二组电感器芯体元件。 第一组电感器芯元件中的每个电感器芯体元件由第一金属材料形成。 第二组电感器芯元件中的每个电感器芯体元件由具有与第一磁性材料不同的磁矫顽力的第二金属材料形成。 电感器还包括一组将电感器芯元件电隔离的间隔件。 一些实施例涉及以各种方式磁性相互作用的多个电感器绕组和/或多个电感器核心元件。 具体实施方案涉及具有不同组成和/或尺寸的核心元件。
    • 4. 发明授权
    • Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits
    • 用于在半导体集成电路上制造高价值电感器的晶片级的装置和方法
    • US07468899B1
    • 2008-12-23
    • US11621424
    • 2007-01-09
    • Peter J. HopperPeter JohnsonPeter SmeysAndrei Papou
    • Peter J. HopperPeter JohnsonPeter SmeysAndrei Papou
    • G05F1/59G05F1/618
    • H01L23/5227H01F17/0006H01F41/046H01L2924/0002Y10T29/4902Y10T29/49071Y10T29/49073Y10T29/49075Y10T29/49124Y10T29/4913H01L2924/00
    • An apparatus and method for wafer level fabrication of high value inductors directly on top of semiconductor integrated circuits is disclosed. The integrated circuit includes a plurality of regulator circuits, each of the regulator circuits having an input node configured to receive a plurality of pulsed input signals having a predetermined duty cycle and a plurality of inductor windings associated with each of the plurality of regulator circuits respectively. The integrated circuit also includes a core array having a plurality of core elements. The plurality of core elements are positioned adjacent to and magnetically coupled with one or more of the plurality of inductor windings. An output node is electrically coupled to the plurality of inductor windings. The output signal at the output node is the sum of the instantaneous voltage on each of the inductor windings associated with the plurality of regulator circuits respectively. The integrated circuit also includes a phase control circuit coupled to the plurality of regulator circuits. The phase control circuit controls the phase of the plurality of pulsed input signals received at the plurality of the regulator circuits to control the output signal at the output node.
    • 公开了一种直接在半导体集成电路之上晶圆级制造高值电感器的装置和方法。 集成电路包括多个调节器电路,每个调节器电路具有被配置为分别接收具有预定占空比的多个脉冲输入信号和与多个调节器电路中的每一个相关联的多个电感器绕组的输入节点。 集成电路还包括具有多个核心元件的芯阵列。 多个芯元件被定位成与多个电感器绕组中的一个或多个相邻并且磁耦合。 输出节点电耦合到多个电感器绕组。 输出节点处的输出信号分别是与多个调节器电路相关联的每个电感器绕组上的瞬时电压之和。 集成电路还包括耦合到多个调节器电路的相位控制电路。 相位控制电路控制在多个调节器电路处接收的多个脉冲输入信号的相位,以控制输出节点处的输出信号。