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1. 发明授权

US06364542B1 Device and method for providing a true semiconductor die to external fiber optic cable connection 有权
标题翻译：用于向外部光纤电缆连接提供真正的半导体管芯的装置和方法
公开(公告)号：US06364542B1
公开(公告)日：2002-04-02
申请号：US09568094
申请日：2000-05-09
申请人： Peter Deane , Chen-Hui Tsay , Cade Murray , Luu Nguyen
发明人： Peter Deane , Chen-Hui Tsay , Cade Murray , Luu Nguyen
IPC分类号： G02B636
CPC分类号： G02B6/4201 , G02B6/4214 , G02B6/4246
摘要： A low cost device that provides a true die to external fiber optic connection. The device includes a semiconductor die having a first surface, an integrate circuit fabricated on the first surface of the semiconductor die and a package encapsulating the semiconductor die. The device also includes a module mounted onto the package and configured to receive an external fiber optic cable. An opto-electric device, housed in the module is optically coupled to the fiber optic cable when the cable is inserted into the module. To provide the direct die to external fiber optic connection, at least one electrical conductor is provided between the integrated circuit fabricated the semiconductor die, through the package and module, and directly to the opto-electrical device.
摘要翻译：一种低成本的器件，为外部光纤连接提供真正的裸片。该器件包括具有第一表面的半导体管芯，在半导体管芯的第一表面上制造的集成电路和封装半导体管芯的封装。该装置还包括安装到包装上并被配置为接收外部光纤电缆的模块。当电缆插入模块时，容纳在模块中的光电装置光耦合到光纤电缆。为了将直接管芯提供到外部光纤连接，在通过封装和模块制造的半导体管芯的集成电路之间提供至少一个电导体，并直接连接到光电器件。

2. 发明授权

US06707140B1 Arrayable, scaleable, and stackable molded package configuration 有权
标题翻译：可堆叠，可扩展和可堆叠的模制封装配置
公开(公告)号：US06707140B1
公开(公告)日：2004-03-16
申请号：US09568558
申请日：2000-05-09
申请人： Luu Nguyen , Cade Murray , Peter Deane , Chen-Hui Tsay
发明人： Luu Nguyen , Cade Murray , Peter Deane , Chen-Hui Tsay
IPC分类号： H01L2302
CPC分类号： H01L24/16 , H01L23/49838 , H01L24/48 , H01L25/105 , H01L2224/05599 , H01L2224/13099 , H01L2224/14132 , H01L2224/14135 , H01L2224/16145 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2224/73207 , H01L2224/85399 , H01L2225/1029 , H01L2225/1058 , H01L2225/1094 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H05K1/0219 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A stacked molded package comprising a semiconductor package attached to an electronic device. The semiconductor package includes a semiconductor die which is connected to a set of wire leads and is encapsulated within a protective molding material. Additionally, solder bumps within the molding material are attached to input and output contact points on the semiconductor die. Portions of the solder bumps are exposed through the surface of the molding material so that contact can be made with the electrical contacts of an electronic device to be stacked upon the semiconductor package. The electronic device may be, for example, another semiconductor die or an opto-electronic transceiver. The present invention also includes a method for manufacturing the stacked molded package. The method involves forming the semiconductor package within a molding chamber which is injected with the protective molding material. The method further involves lowering the top surface of the molding chamber onto the solder bumps of the semiconductor package. The contact between the top surface of the molding chamber and the solder bumps flattens a portion of the solder bumps and prevents the flattened portion from being covered with molding material. Manufacturing the semiconductor package may be performed with the current manufacturing infrastructure which is used to make semiconductor packages according to specific form factors. A stacked package is formed when an electronic device is attached to the molded package.
摘要翻译：一种堆叠的模制包装，包括附接到电子装置的半导体封装。半导体封装包括半导体管芯，其连接到一组引线并且封装在保护性成型材料内。此外，模制材料内的焊料凸块连接到半导体管芯上的输入和输出接触点。焊料凸块的一部分通过模制材料的表面暴露，使得可以使电子器件的电触点与半导体封装层叠在一起形成接触。电子设备可以是例如另一个半导体管芯或光电收发器。本发明还包括一种制造堆叠的模制包装的方法。该方法包括在注入保护模制材料的模制室内形成半导体封装。该方法还包括将模制室的顶表面降低到半导体封装的焊料凸块上。模制室的顶表面与焊料凸块之间的接触使焊料凸块的一部分平坦化，并防止扁平部分被模制材料覆盖。制造半导体封装可以用当前的制造基础设施进行，这些制造基础设施用于根据特定的形状因素制造半导体封装。当将电子设备附接到模制包装时，形成堆叠的包装。

3. 发明申请

US20060001183A1 Technique for protecting photonic devices in optoelectronic packages with clear overmolding 有权
公开(公告)号：US20060001183A1
公开(公告)日：2006-01-05
申请号：US11217518
申请日：2005-08-31
申请人： Luu Nguyen , Ken Pham , Peter Deane , William Mazotti , Bruce Roberts
发明人： Luu Nguyen , Ken Pham , Peter Deane , William Mazotti , Bruce Roberts
IPC分类号： B29D11/00
CPC分类号： B29C70/72 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/32225 , H01L2224/4809 , H01L2224/48471 , H01L2224/48479 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/181 , H01L2924/1815 , Y10T29/49146 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/4554
摘要： This disclosure describes a clear overmolding cap for protecting the photonic devices in optoelectronic packages from damage due to handling, module assembly, board assembly, and environmental exposure in field applications. The overmolding of the devices with a clear mold cap or similar material also provides a standoff for optical fibers positioned next to the active facets. The photonic devices are attached to a substrate, which may be flexible that has electronic traces that allow the photonic devices to be connected to an external device such as a semiconductor device. A technique for manufacturing the overmolding cap using a mold die system in combination with a rigid carrier is also disclosed. The rigid carrier is used to maintain the shape of the substrate during the molding process. The proposed method applies to photonic devices used in optoelectronic packages that can serve as transceivers, transmitters, or receivers.

4. 发明申请

US20050100294A1 Techniques for joining an opto-electronic module to a semiconductor package 有权
公开(公告)号：US20050100294A1
公开(公告)日：2005-05-12
申请号：US11015247
申请日：2004-12-15
申请人： Luu Nguyen , Ken Pham , Peter Deane , William Mazotti , Bruce Roberts , Jia Liu
发明人： Luu Nguyen , Ken Pham , Peter Deane , William Mazotti , Bruce Roberts , Jia Liu
IPC分类号： G02B6/38 , G02B6/42 , H01L23/02 , H01L23/498 , H01L25/10 , H05K1/02 , H05K1/18 , H05K3/40 , G02B6/36
CPC分类号： G02B6/4292 , G02B6/3825 , G02B6/3874 , G02B6/3897 , G02B6/4201 , G02B6/4239 , G02B2006/4297 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/1134 , H01L2224/13144 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73207 , H01L2224/97 , H01L2225/1029 , H01L2225/1058 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H05K1/0219 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2224/29099 , H01L2224/45147 , H01L2924/00015 , H01L2924/00012 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753
摘要： The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using wirebond studs and an adhesive material. In other cases, the combination is joined using an anisotropic conductive film. Yet, in other cases, the combination is joined using solder material. Each of these joining mechanisms provides high levels of thermal, electrical and optical performance. The joining mechanisms can apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.

5. 发明申请

US20070071391A1 Optical sub-assembly packaging techniques that incorporate optical lenses 有权
标题翻译：包含光学透镜的光学子组件封装技术
公开(公告)号：US20070071391A1
公开(公告)日：2007-03-29
申请号：US11473820
申请日：2006-06-23
申请人： William Mazotti , Jia Liu , Luu Nguyen , Haryanto Chandra , Peter Deane , Todd Thyes , Brian Huss , John Rukavina , Glenn Woodhouse
发明人： William Mazotti , Jia Liu , Luu Nguyen , Haryanto Chandra , Peter Deane , Todd Thyes , Brian Huss , John Rukavina , Glenn Woodhouse
IPC分类号： G02B6/36
CPC分类号： G02B6/4292 , G02B6/4201 , G02B6/4204 , G02B6/4231 , G02B6/4239 , G02B6/4249 , G02B6/4251
摘要： Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the envirorunent and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.
摘要翻译：描述了以光子器件被保护免受暴露于环境和物理处理可能引起的损害的方式制造光传输装置的技术。本发明涉及将透镜或透镜阵列放置在光子器件上，无论是否使用插座器件，使得光子器件被包含在密封腔内。本发明具有三个主要实施例，其中光子器件可被气密密封，准气密密封或非气密密封。光传输设备可以被配置为用作光接收器，检测器或收发器设备。

6. 发明申请

US20050175297A1 Optical sub-assembly for opto-electronic modules 有权
标题翻译：光电子模块的光学子组件
公开(公告)号：US20050175297A1
公开(公告)日：2005-08-11
申请号：US11095637
申请日：2005-03-30
申请人： William Mazotti , Peter Deane , Luu Nguyen , Ken Pham , Bruce Roberts , Jia Liu , Yongseon Koh , John Briant , Roger Clarke , Michael Nelson , Christopher Smith , Janet Townsend
发明人： William Mazotti , Peter Deane , Luu Nguyen , Ken Pham , Bruce Roberts , Jia Liu , Yongseon Koh , John Briant , Roger Clarke , Michael Nelson , Christopher Smith , Janet Townsend
IPC分类号： G02B6/42 , H05K1/02 , H05K1/18 , H05K3/40 , G02B6/36
CPC分类号： G02B6/4201 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H05K1/0219 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121 , H01L2924/00014 , H01L2924/00
摘要： Concepts for conveniently arranging devices for the transduction of signals to and from voltage and current domains to infrared radiation domains is described. Specifically, optoelectronic components and methods of making the same are described. In one aspect, the optoelectronic component includes a base substrate having a pair of angled (or substantially perpendicular) faces with electrical traces extending therebetween. A semiconductor chip assembly is mounted on the first face of the base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. In some embodiments the base substrate is formed from a ceramic material having the electrical traces formed thereon. In other implementations the substrate includes a backing block having a flexible printed circuit substrate adhered thereto.
摘要翻译：描述了用于方便地布置用于将电压和电流域的信号传导到红外辐射域的装置的概念。具体地说，描述了光电子元件及其制造方法。在一个方面，光电子部件包括具有一对成角度（或基本上垂直）的表面的基底基板，其间延伸有电迹线。半导体芯片组件安装在基底基板的第一面上，并且光子器件安装在第二面上。半导体芯片组件和光子器件都与基底衬底上的迹线电连接。半导体芯片组件通常被布置成电连接到外部装置。光子器件通常布置成与一根或多根光纤光学通信。所描述的结构可以与各种各样的光子器件一起使用。在一些实施例中，基底由具有形成在其上的电迹线的陶瓷材料形成。在其它实施方式中，基板包括具有粘附到其上的柔性印刷电路基板的背衬块。

7. 发明申请

US20050157990A1 Optical sub-assembly packaging techniques that incorporate optical lenses 有权
标题翻译：包含光学透镜的光学子组件封装技术
公开(公告)号：US20050157990A1
公开(公告)日：2005-07-21
申请号：US11050073
申请日：2005-02-01
申请人： William Mazotti , Jia Liu , Luu Nguyen , Haryanto Chandra , Peter Deane , Todd Thyes , Brian Huss , John Rukavina , Glenn Woodhouse
发明人： William Mazotti , Jia Liu , Luu Nguyen , Haryanto Chandra , Peter Deane , Todd Thyes , Brian Huss , John Rukavina , Glenn Woodhouse
IPC分类号： G02B6/42
CPC分类号： G02B6/4292 , G02B6/4201 , G02B6/4204 , G02B6/4231 , G02B6/4239 , G02B6/4249 , G02B6/4251
摘要： Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the environment and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.
摘要翻译：描述了以使得光子器件免受可能由于暴露于环境和物理处理引起的损害的方式制造光传输装置的技术。本发明涉及将透镜或透镜阵列放置在光子器件上，无论是否使用插座器件，使得光子器件被包含在密封腔内。本发明具有三个主要实施例，其中光子器件可被气密密封，准气密密封或非气密密封。光传输设备可以被配置为用作光接收器，检测器或收发器设备。

8. 发明申请

US20060253609A1 Determining address of closest edge server 有权
标题翻译：确定最近边缘服务器的地址
公开(公告)号：US20060253609A1
公开(公告)日：2006-11-09
申请号：US11120344
申请日：2005-05-03
申请人： Dmitry Andreev , Galina Grunin , Luu Nguyen , Gregory Vilshansky
发明人： Dmitry Andreev , Galina Grunin , Luu Nguyen , Gregory Vilshansky
IPC分类号： G06F15/16
CPC分类号： H04L29/12132 , H04L29/12066 , H04L61/1511 , H04L61/1552 , H04L67/28 , H04L67/2842
摘要： A method and system is presented for bypassing a local Domain Name Server (DNS) when using edge caching servers. Domain names of frequently used business applications that are known to rely upon edge servers, together with the corresponding authoritative DNSs, are listed in both local hosts file and user defined FSFD local configuration file fsfd.conf. When the client computer's browser attempts to resolve a domain name, a File System Filtering Driver (FSFD) in the client computer intercepts the browser's request. If the domain name which is being resolved is found in a local FSFD configuration file fsfd.conf, then the FSFD initiates a DNS request directly to the appropriate authoritative DNS whose IP address gets extracted from the fsfd.conf record, thus bypassing the local DNS. The authoritative DNS returns the IP address for an edge caching server that is topographically proximate to the client computer's browser.
摘要翻译：提出了一种方法和系统，用于在使用边缘缓存服务器时绕过本地域名服务器（DNS）。在本地主机文件和用户定义的FSFD本地配置文件fsfd.conf中列出了已知依赖于边缘服务器的经常使用的业务应用程序的域名以及相应的权威DNS。当客户端计算机的浏览器尝试解析域名时，客户端计算机中的文件系统过滤驱动程序（FSFD）会拦截浏览器的请求。如果正在解析的域名在本地FSFD配置文件fsfd.conf中找到，则FSFD将直接向适当的授权DNS发起DNS请求，该域名的IP地址从fsfd.conf记录中提取出来，从而绕过本地DNS 。权威性DNS返回位于邻近客户端计算机浏览器的边缘缓存服务器的IP地址。

9. 发明申请

US20060055080A1 Semiconductor package having flash-free contacts and techniques for manufacturing the same 审中-公开
标题翻译：具有无闪光触点的半导体封装及其制造技术
公开(公告)号：US20060055080A1
公开(公告)日：2006-03-16
申请号：US11267719
申请日：2005-11-03
申请人： Ken Pham , Luu Nguyen , William Mazotti
发明人： Ken Pham , Luu Nguyen , William Mazotti
IPC分类号： B29C45/02 , B29C45/14 , B29C45/37 , B29C70/72 , B29C70/88 , H01L21/56
CPC分类号： B29C45/37 , B29C45/14639 , B29C2045/14934 , H01L24/73 , H01L2224/16145 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/01088 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/0401
摘要： Techniques for forming packaged semiconductor devices having top surfaces with flash-free electrical contact surfaces are described. According to one aspect, a molding cavity is provided which has a molding surface that is sufficiently smooth such that when placed in contact with an electrically conductive contact, gaps between the conductive contact and the mold cavity surface do not form.
摘要翻译：描述了用于形成具有无闪光电接触表面的顶表面的封装半导体器件的技术。根据一个方面，提供了一种模制腔，其具有足够光滑的模制表面，使得当与导电触点接触时，不形成导电触头和模腔表面之间的间隙。

10. 发明授权

US06245595B1 Techniques for wafer level molding of underfill encapsulant 有权
标题翻译：底层填料密封剂晶圆级成型技术
公开(公告)号：US06245595B1
公开(公告)日：2001-06-12
申请号：US09359074
申请日：1999-07-22
申请人： Luu Nguyen , Hem P. Takiar , Ethan Warner , Shahram Mostafazadeh , Joseph O. Smith
发明人： Luu Nguyen , Hem P. Takiar , Ethan Warner , Shahram Mostafazadeh , Joseph O. Smith
IPC分类号： H01L2144
CPC分类号： H01L21/67126 , H01L21/563 , H01L24/11 , H01L24/29 , H01L24/94 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/13099 , H01L2224/16 , H01L2224/274 , H01L2224/73104 , H01L2224/73203 , H01L2224/83191 , H01L2224/83856 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/351 , H01L2924/01031 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： A method and apparatus for forming a layer of underfill encapsulant on an integrated circuit located on a wafer are described. As a flip chip, the integrated circuit has electrically conductive pads, most of which have a solder ball attached thereto. Most of the solder balls have been flattened in order to provide an enlarged solder wetting area. A layer of underfill encapsulant is injected onto the integrated circuit under pressure to form a layer of underfill encapsulant that is then pre-cured. The integrated circuit is mounted to a substrate and the substrate and the integrated circuit are electrically coupled by a solder reflow operation which also finally cures the underfill encapsulant.
摘要翻译：描述了在位于晶片上的集成电路上形成底层密封剂层的方法和装置。作为倒装芯片，集成电路具有导电焊盘，其中大部分具有附着于其上的焊球。大多数焊球已经被平坦化，以便提供扩大的焊料润湿区域。将一层底层填料密封剂在压力下注入到集成电路上，以形成一层底层填料密封剂，然后将其预固化。集成电路安装到基板上，并且基板和集成电路通过回流焊接操作电耦合，焊接回流操作也最终固化底部填充密封剂。

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