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1. 发明授权

US07018575B2 Method for assembly of complementary-shaped receptacle site and device microstructures 失效
公开(公告)号：US07018575B2
公开(公告)日：2006-03-28
申请号：US10218052
申请日：2002-08-12
申请人： Peter D. Brewer , Andrew T. Hunter , Luisa M. Deckard
发明人： Peter D. Brewer , Andrew T. Hunter , Luisa M. Deckard
IPC分类号： H01L21/00 , B29C59/00 , B28B5/00
CPC分类号： H01L24/95 , B82Y10/00 , B82Y30/00 , H01L23/13 , H01L24/26 , H01L24/83 , H01L25/0655 , H01L25/50 , H01L29/0657 , H01L2224/8319 , H01L2224/8385 , H01L2224/95085 , H01L2224/95145 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01061 , H01L2924/01072 , H01L2924/01075 , H01L2924/01079 , H01L2924/01322 , H01L2924/07802 , H01L2924/09701 , H01L2924/10158 , H01L2924/10329 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/15157 , H01L2924/15165 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T428/12528 , H01L2924/00
摘要： A method for assembly including the steps of:(a) providing a plurality of microstructure components with each of the components having a bottom with the same three dimensional shape;(b) forming a mold with at least one protuberance from a surface thereof so that the at least one protuberance has the same shape;(c) molding a moldable substrate with the mold to form a molded substrate having a surface with at least one recess having the same shape; and(d) positioning a first of the plurality of microstructure components into said at least one recess. Each of the microstructure components may be formed by a masking and etching process, with the mold being formed by the same masking and etching process. The positioning step may consist of mixing the microstructure components with a fluid to form a slurry; and depositing the slurry on the surface of the molded substrate to cause the first of the plurality of microstructure components to self-align in the recess.

2. 发明申请

US20080156429A1 Preparing composites by using resins 审中-公开
标题翻译：使用树脂制备复合材料
公开(公告)号：US20080156429A1
公开(公告)日：2008-07-03
申请号：US11818310
申请日：2007-06-13
申请人： Luisa M. Deckard , Jennifer J. Zinck
发明人： Luisa M. Deckard , Jennifer J. Zinck
IPC分类号： B32B37/00
CPC分类号： B29C70/00 , B29C64/165 , B29C70/54 , B29C70/70 , B29C2035/0877 , B33Y10/00
摘要： A method for making a part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) optionally providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices, (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam; (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer, whereby the cured or uncured upper layer becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (e) optionally curing the lower layer resulting from step (d) if the lower layer is uncured to yield a cured lower layer; (f) after step (e), optionally providing a new uncured upper layer on the uncured upper layer provided in step (d), whereby the uncured upper layer provided in step (d) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (g) after step (f) curing the uncured upper layer and/or the uncured lower layer(s) after step (f) using an electron beam; and (h) optionally-repeating steps (d) through (g) a number of times to form a desired number of cured layers.
摘要翻译：一种制造零件的方法，所述方法包括：（a）在零件，基底，工件，支撑平台或基底层上提供未固化的上层，其中未固化的上层包含树脂，并且还包括纤维，颗粒，粉末和/或电子设备; （b）任选地在步骤（a）中提供的未固化的上层上提供新的未固化的上层，由此步骤（a）中提供的未固化的上层成为未固化的下层，并且其中新的未固化的上层包含树脂，包括纤维，颗粒，粉末和/或电子装置，（c）在步骤（b）之后使用电子束固化未固化的上层和/或未固化的下层; （d）在步骤（c）之后，在固化或未固化的上层上提供新的未固化的上层，由此固化或未固化的上层变成固化或未固化的下层，并且其中新的未固化上层包含树脂，并且还包括纤维，颗粒，粉末和/或电子装置; （e）如果下层未固化以产生固化的下层，则任选地固化由步骤（d）得到的下层; （f）在步骤（e）之后，任选地在步骤（d）中提供的未固化的上层上提供新的未固化的上层，由此步骤（d）中提供的未固化上层变成未固化的下层，上层包括树脂，并且还包括纤维，颗粒，粉末和/或电子装置; （g）在步骤（f）之后，使用电子束在步骤（f）之后固化未固化的上层和/或未固化的下层; 和（h）任选重复步骤（d）至（g）多次以形成所需数量的固化层。

3. 发明授权

US07258896B2 Preparing composites by using resins 失效
标题翻译：使用树脂制备复合材料
公开(公告)号：US07258896B2
公开(公告)日：2007-08-21
申请号：US10274840
申请日：2002-10-18
申请人： Luisa M. Deckard , Jennifer J. Zinck
发明人： Luisa M. Deckard , Jennifer J. Zinck
IPC分类号： B05D5/00 , B29C65/00 , B29C35/08
CPC分类号： B29C70/00 , B29C64/165 , B29C70/54 , B29C70/70 , B29C2035/0877 , B33Y10/00
摘要： A method for making a part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) optionally providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam; (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer, whereby the cured or uncured upper layer becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (e) optionally curing the lower layer resulting from step (d) if the lower layer is uncured to yield a cured lower layer; (f) after step (e), optionally providing a new uncured upper layer on the uncured upper layer provided in step (d), whereby the uncured upper layer provided in step (d) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (g) after step (f) curing the uncured upper layer and/or the uncured lower layer(s) after step (f) using an electron beam; and (h) optionally repeating steps (d) through (g) a number of times to form a desired number of cured layers.
摘要翻译：一种制造零件的方法，所述方法包括：（a）在零件，基底，工件，支撑平台或基底层上提供未固化的上层，其中未固化的上层包含树脂，并且还包括纤维，颗粒，粉末和/或电子设备; （b）任选地在步骤（a）中提供的未固化的上层上提供新的未固化的上层，由此步骤（a）中提供的未固化的上层成为未固化的下层，并且其中新的未固化的上层包含树脂，包括纤维，颗粒，粉末和/或电子装置; （c）使用电子束在步骤（b）之后固化未固化的上层和/或未固化的下层; （d）在步骤（c）之后，在固化或未固化的上层上提供新的未固化的上层，由此固化或未固化的上层变成固化或未固化的下层，并且其中新的未固化上层包含树脂，并且还包括纤维，颗粒，粉末和/或电子装置; （e）如果下层未固化以产生固化的下层，则任选地固化由步骤（d）得到的下层; （f）在步骤（e）之后，任选地在步骤（d）中提供的未固化的上层上提供新的未固化的上层，由此步骤（d）中提供的未固化上层变成未固化的下层，上层包括树脂，并且还包括纤维，颗粒，粉末和/或电子装置; （g）在步骤（f）之后，使用电子束在步骤（f）之后固化未固化的上层和/或未固化的下层; 和（h）任选地重复步骤（d）至（g）多次以形成所需数量的固化层。

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