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    • 4. 发明授权
    • Mask making with error recognition
    • 面具制作与错误识别
    • US08555211B2
    • 2013-10-08
    • US13416897
    • 2012-03-09
    • Jia-Guei JouKuan-Chi ChenPeng-Ren ChenDong-Hsu Cheng
    • Jia-Guei JouKuan-Chi ChenPeng-Ren ChenDong-Hsu Cheng
    • G06F17/50
    • G03F1/70G03F1/36
    • A method of making a mask includes receiving an IC design layout from a designer, applying an logic operation (LOP) correction, performing an OPC correction, fracturing the modified data into a plurality of main features in an electron beam format, and sending the electron beam format data to a mask writer for a mask fabrication. An XOR operation is implemented into the method to check and verify if a pattern is lost during OPC modification and/or data fracture. A BACKBONE XOR operation is also implemented into the method for a plurality of main features with a critical dimension (CD) size smaller than the max OPC correction to check and verify if a small pattern feature is lost during OPC modification and/or data fracture for 45 nm and beyond semiconductor technologies.
    • 制作掩模的方法包括从设计者接收IC设计布局,应用逻辑操作(LOP)校正,执行OPC校正,将修改后的数据分解为电子束格式的多个主要特征,以及发送电子 波束格式数据到掩模编写器用于掩模制造。 在该方法中实施XOR操作,以检查和验证在OPC修改和/或数据断裂期间是否丢失模式。 对于具有小于最大OPC校正的临界尺寸(CD)尺寸的多个主要特征的方法也实施了BACKBONE XOR操作,以检查和验证在OPC修改和/或数据断裂期间是否丢失小图案特征 45纳米以上的半导体技术。
    • 5. 发明申请
    • MASK MAKING WITH ERROR RECOGNITION
    • 屏蔽错误识别
    • US20130239072A1
    • 2013-09-12
    • US13416897
    • 2012-03-09
    • Jia-Guei JouKuan-Chi ChenPeng-Ren ChenDong-Hsu Cheng
    • Jia-Guei JouKuan-Chi ChenPeng-Ren ChenDong-Hsu Cheng
    • G06F17/50
    • G03F1/70G03F1/36
    • A method of making a mask includes receiving an IC design layout from a designer, applying an logic operation (LOP) correction, performing an OPC correction, fracturing the modified data into a plurality of main features in an electron beam format, and sending the electron beam format data to a mask writer for a mask fabrication. An XOR operation is implemented into the method to check and verify if a pattern is lost during OPC modification and/or data fracture. A BACKBONE XOR operation is also implemented into the method for a plurality of main features with a critical dimension (CD) size smaller than the max OPC correction to check and verify if a small pattern feature is lost during OPC modification and/or data fracture for 45 nm and beyond semiconductor technologies.
    • 制作掩模的方法包括从设计者接收IC设计布局,应用逻辑操作(LOP)校正,执行OPC校正,将修改后的数据分解为电子束格式的多个主要特征,以及发送电子 波束格式数据到掩模编写器用于掩模制造。 在该方法中实施XOR操作,以检查和验证在OPC修改和/或数据断裂期间是否丢失模式。 对于具有小于最大OPC校正的临界尺寸(CD)尺寸的多个主要特征的方法也实施了BACKBONE XOR操作,以检查和验证在OPC修改和/或数据断裂期间是否丢失小图案特征 45纳米以上的半导体技术。
    • 6. 发明申请
    • LED STRUCTURE
    • LED结构
    • US20110272719A1
    • 2011-11-10
    • US12776834
    • 2010-05-10
    • Peng-Ren ChenHsueh-Hsing LiuJen-Inn Chyi
    • Peng-Ren ChenHsueh-Hsing LiuJen-Inn Chyi
    • H01L33/32
    • H01L33/14H01L33/04
    • The present invention discloses an LED structure, wherein an N-type current spreading layer is interposed between N-type semiconductor layers to uniformly distribute current flowing through the N-type semiconductor layer. The N-type current spreading layer includes at least three sub-layers stacked in a sequence of from a lower band gap to a higher band gap, wherein the sub-layer having the lower band gap is near the substrate, and the sub-layer having the higher band gap is near the light emitting layer. Each sub-layer of the N-type current spreading layer is expressed by a general formula InxAlyGa(1-x-y)N, wherein 0≦x≦1, 0≦y≦1, and 0≦x+y≦1.
    • 本发明公开了一种LED结构,其中N型电流扩展层插入在N型半导体层之间以均匀地分布流过N型半导体层的电流。 N型电流扩展层包括从低带隙到较高带隙的顺序堆叠的至少三个子层,其中具有较低带隙的子层在衬底附近,并且子层 具有较高带隙的发光层靠近发光层。 N型电流扩展层的每个子层由通式In x Al y Ga(1-x-y)N表示,其中0≦̸ x≦̸ 1,0& nlE; y≦̸ 1和0≦̸ x + y≦̸
    • 8. 发明授权
    • Cycle time reduction in data preparation
    • 数据准备中的周期时间缩短
    • US08458631B2
    • 2013-06-04
    • US13207691
    • 2011-08-11
    • Chi-Ta LuJia-Guei JouPeng-Ren ChenDong-Hsu Cheng
    • Chi-Ta LuJia-Guei JouPeng-Ren ChenDong-Hsu Cheng
    • G06F17/50
    • G03F1/70G03F7/70441G06F17/5081
    • The present disclosure provides for methods of reducing cycle time in data preparation. In one embodiment, a method includes receiving an initial integrated circuit (IC) design layout and an optical proximity correction (OPC)-processed initial IC design layout, and receiving a revised IC design layout. The method further includes comparing the revised IC design layout to the initial IC design layout to identify a difference region of the revised IC design layout from the initial IC design layout, performing an OPC on the difference region of the revised IC design layout, and merging the OPC-processed difference region of the revised IC design layout with the OPC-processed initial IC design layout.
    • 本公开提供了减少数据准备中的周期时间的方法。 在一个实施例中,一种方法包括接收初始集成电路(IC)设计布局和光学邻近校正(OPC)处理的初始IC设计布局,以及接收修订的IC设计布局。 该方法还包括将修订的IC设计布局与初始IC设计布局进行比较,以从初始IC设计布局识别修订的IC设计布局的差异区域,在修订的IC设计布局的差异区域上执行OPC,并且合并 OPC处理差分区域的修订后的IC设计布局与OPC处理的初始IC设计布局。
    • 10. 发明申请
    • CYCLE TIME REDUCTION IN DATA PREPARATION
    • 数据准备中的循环时间减少
    • US20130042210A1
    • 2013-02-14
    • US13207691
    • 2011-08-11
    • Chi-Ta LuJia-Guei JouPeng-Ren ChenDong-Hsu Cheng
    • Chi-Ta LuJia-Guei JouPeng-Ren ChenDong-Hsu Cheng
    • G06F17/50
    • G03F1/70G03F7/70441G06F17/5081
    • The present disclosure provides for methods of reducing cycle time in data preparation. In one embodiment, a method includes receiving an initial integrated circuit (IC) design layout and an optical proximity correction (OPC)-processed initial IC design layout, and receiving a revised IC design layout. The method further includes comparing the revised IC design layout to the initial IC design layout to identify a difference region of the revised IC design layout from the initial IC design layout, performing an OPC on the difference region of the revised IC design layout, and merging the OPC-processed difference region of the revised IC design layout with the OPC-processed initial IC design layout.
    • 本公开提供了减少数据准备中的周期时间的方法。 在一个实施例中,一种方法包括接收初始集成电路(IC)设计布局和光学邻近校正(OPC)处理的初始IC设计布局,以及接收修订的IC设计布局。 该方法还包括将修订的IC设计布局与初始IC设计布局进行比较,以从初始IC设计布局识别修订的IC设计布局的差异区域,在修订的IC设计布局的差异区域上执行OPC,并且合并 OPC处理差分区域的修订后的IC设计布局与OPC处理的初始IC设计布局。