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1. 发明申请

US20140330995A1 DATA STORAGE SYSTEM 审中-公开
标题翻译：数据存储系统
公开(公告)号：US20140330995A1
公开(公告)日：2014-11-06
申请号：US14268283
申请日：2014-05-02
申请人： Paul S. Levy , William N. Gallas , John Huie
发明人： Paul S. Levy , William N. Gallas , John Huie
IPC分类号： G06F13/16 , G06F13/42
CPC分类号： G06F13/1694 , G06F13/385 , G06F13/4282
摘要： In an embodiment, a storage device may include a tangible non-transitory physical storage for storing information. The storage device may also include an interface. The interface may be used to receive a signal that may be associated with one of a plurality of different protocols. The signal may be received serially. The storage device may include circuitry which may be used to identify a protocol associated with the received signal. The protocol may be identified based on an attribute associated with the received signal. Alternatively or in addition to, the protocol may be identified based on information encoded in the received signal. The information encoded in the received signal may include, for example, a data header that may be associated with the protocol.
摘要翻译：在一个实施例中，存储设备可以包括用于存储信息的有形非瞬态物理存储器。存储设备还可以包括接口。接口可以用于接收可能与多个不同协议之一相关联的信号。该信号可以被串行接收。存储设备可以包括可以用于识别与接收到的信号相关联的协议的电路。可以基于与接收到的信号相关联的属性来识别该协议。或者或除了可以基于在接收信号中编码的信息来识别协议。在接收信号中编码的信息可以包括例如可以与协议相关联的数据报头。

2. 发明授权

US5815372A Packaging multiple dies on a ball grid array substrate 失效
标题翻译：在球栅阵列基板上包装多个管芯
公开(公告)号：US5815372A
公开(公告)日：1998-09-29
申请号：US822743
申请日：1997-03-25
申请人： William N. Gallas
发明人： William N. Gallas
IPC分类号： H01L23/31 , H01L25/065 , H01L25/00
CPC分类号： H01L25/0652 , H01L23/3128 , H01L24/24 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2225/06568 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/14 , H01L2924/15174 , H01L2924/15184 , H01L2924/15192 , H01L2924/15311 , H01L2924/181
摘要： An electrical arrangement including a circuitized substrate, the circuitized substrate having (i) a first substrate surface including a set of substrate contacts disposed thereon, and (ii) a second substrate surface including a set of input/output contacts disposed thereon. The electrical arrangement also includes a first die having (i) a first die surface including a set of first die contacts disposed thereon which is coupled to a first portion of the set of substrate contacts, and (ii) a second die surface configured to receive a second die. In the electrical arrangement, the set of substrate contacts includes a second portion of substrate contacts configured to be coupled to a set of second die contacts disposed on the second die and the circuitized substrate electrically interconnects the first portion and second portion of the set of substrate contacts and the set of input/output contacts to form a predetermined circuit.
摘要翻译：一种包括电路化基板的电气布置，所述电路化基板具有（i）包括设置在其上的一组基板触点的第一基板表面，以及（ii）包括设置在其上的一组输入/输出触点的第二基板表面。电气布置还包括第一管芯，其具有（i）第一管芯表面，第一管芯表面包括设置在其上的一组第一管芯接触件，其联接到该组衬底触头的第一部分，以及（ii）第二管芯表面，被配置为接收第二个死亡在电气布置中，该组衬底触点包括衬底触点的第二部分，其被配置为耦合到设置在第二裸片上的一组第二裸片触点，并且电路化衬底将该组衬底的第一部分和第二部分电互连触点和一组输入/输出触点以形成预定电路。

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