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1. 外观设计

USD359960S Clip-on earpiece for a portable handset telephone 失效
公开(公告)号：USD359960S
公开(公告)日：1995-07-04
申请号：US23352
申请日：1994-05-23
申请人： Paul R. Kennedy , Frederick Y. Cho , Robert A. Cook
设计人： Paul R. Kennedy , Frederick Y. Cho , Robert A. Cook

2. 发明授权

US4686111A Passivated and low scatter acoustic wave devices and method thereof 失效
标题翻译：钝化和低散射声波装置及其方法
公开(公告)号：US4686111A
公开(公告)日：1987-08-11
申请号：US579916
申请日：1984-02-13
申请人： Frederick Y. Cho , Fred S. Hickernell
发明人： Frederick Y. Cho , Fred S. Hickernell
IPC分类号： H03H3/10 , H03H9/02 , H03H9/145 , B05D5/12
CPC分类号： H03H9/14538 , H03H3/10 , H03H9/02236 , H03H9/02929
摘要： Passivated and low scatter acoustic wave devices comprise surface acoustic wave (SAW) and shallow bulk acoustic wave (SBAW) devices having transducers composed of oxidizable metal and layers of metal oxide on conventional acoustic wave substrates. Passivated transducers are achieved by forming a layer of oxide on an existing transducer. The method may be used to passivate a device packaged in a non-oxidizable package with oxidizable wire leads, thus combining complete protection with efficient manufacturing operations. Low scatter SAW transducers are achieved by forming the transducer and the interstitial insulating layer from a single layer of oxidizable metal by means of masking and oxidation operations.
摘要翻译：钝化和低散射声波装置包括表面声波（SAW）和浅体积声波（SBAW）器件，其具有由可氧化金属和常规声波衬底上的金属氧化物层组成的换能器。钝化传感器通过在现有传感器上形成一层氧化物来实现。该方法可以用于用可氧化的导线钝化封装在不可氧化的封装中的器件，从而将完整的保护与有效的制造操作相结合。通过掩蔽和氧化操作，通过从单层可氧化金属形成换能器和间隙绝缘层来实现低散射SAW换能器。

3. 再颁专利

USRE35191E Method for reducing heterostructure acoustic charge transport device SAW drive power requirements 失效
标题翻译：降低异质结声波电荷传输装置SAW驱动功率要求的方法
公开(公告)号：USRE35191E
公开(公告)日：1996-03-26
申请号：US966650
申请日：1992-10-26
申请人： Fred S. Hickernell , Frederick Y. Cho , Frederick M. Fliegel
发明人： Fred S. Hickernell , Frederick Y. Cho , Frederick M. Fliegel
IPC分类号： H03H9/02 , H01L21/70
CPC分类号： H03H9/02976 , Y10T29/42
摘要： A HACT device employing a thin-film overlay of a more strongly piezoelectric material can operate as a delay line and as a tapped delay line, or transversal filter, while requiring less total power for the SAW clock signal. The increased electrical potential per unit total SAW power thus realized facilitates coupling between the total SAW energy and the mobile charge carriers. Some materials systems, such as a GaAs substrate and a ZnO thin-film overlay, will require an intervening thin-film dielectric layer in between the HACT substrate and epitaxial layers and the thin-film piezoelectric overlay. This may be necessitated by chemical, semiconductor device processing, or adhesion incompatibilities between the substrate material and the thin-film overlay material.
摘要翻译：使用更强压电材料的薄膜覆盖物的HACT装置可以作为延迟线和作为抽头延迟线或横向滤波器而工作，同时对于SAW时钟信号需要更少的总功率。由此实现的每单位总SAW功率的增加的电势便于总SAW能量和移动电荷载流子之间的耦合。一些材料系统，例如GaAs衬底和ZnO薄膜覆盖层，将需要在HACT衬底和外延层之间的介入薄膜电介质层和薄膜压电覆盖层。这可能是通过化学，半导体器件处理或衬底材料和薄膜覆盖材料之间的粘合不相容性所必需的。

4. 发明授权

US5270606A Processing robust acoustic reflectors 失效
标题翻译：处理坚固的声反射器
公开(公告)号：US5270606A
公开(公告)日：1993-12-14
申请号：US733933
申请日：1991-07-22
申请人： Frederick Y. Cho , Thomas S. Hickernell , David Penunuri
发明人： Frederick Y. Cho , Thomas S. Hickernell , David Penunuri
IPC分类号： H03H9/02 , H01L41/08
CPC分类号： H03H9/02653 , H03H9/02637 , Y10T29/42
摘要： A reflector arrangement for an acoustic wave device comprises an acoustic wave propagating substrate, reflection elements having at least two different widths separated by at least one gap breadth disposed on the acoustic wave propagating substrate. The at least two different widths enhance reflected waves produced by the propagating acoustic wave in such a fashion to as to achieve a total acoustic reflectivity which is independent of variations in width of the reflection elements.
摘要翻译：用于声波装置的反射器装置包括声波传播基板，具有至少两个不同宽度的反射元件，该至少两个不同的宽度被布置在声波传播基板上的至少一个间隙宽度分开。至少两个不同的宽度以这样的方式增强由传播声波产生的反射波，以便实现与反射元件的宽度的变化无关的全部声反射率。

5. 发明授权

US5073807A Method and apparatus for achieving multiple acoustic charge transport device input contacts 失效
标题翻译：用于实现多个声电荷输送装置输入触点的方法和装置
公开(公告)号：US5073807A
公开(公告)日：1991-12-17
申请号：US562497
申请日：1990-08-02
申请人： Frederick M. Fliegel , Frederick Y. Cho , Fred S. Hickernell
发明人： Frederick M. Fliegel , Frederick Y. Cho , Fred S. Hickernell
IPC分类号： H03H9/02
CPC分类号： H03H9/02976
摘要： A bipolar injector structure, similar to a common-base amplifier circuit, is described for use as a unidirectional injector of charge for a charge-transfer device input circuit. This injector structure acts to reduce the input impedance of such devices. A plurality of bipolar injector structures may be implemented on a single ACT device channel, and electrically connected in parallel, to effect a further reduction of input impedance and a further increase in device dynamic range. By employing an input contact structure which allows charge to be injected at more than one point along the length of the channel, without perturbing charge which was injected at some earlier time, a means for forming a transversal filter function can be realized at the input contact structure in addition to that which is achieved at the output contact structure, thus permitting improved ACT device selectivity when operated as a filter. The plurality of bipolar injection structures form a transversal filter, allowing the overall ACT device to achieve out-of-band rejection and selectivity.
摘要翻译：描述了类似于公共基极放大器电路的双极注入器结构，用作电荷传输器件输入电路的单向注入器。该喷射器结构用于减小这些装置的输入阻抗。多个双极注入器结构可以在单个ACT器件通道上实现并且并联电连接，以进一步降低输入阻抗并进一步增加器件动态范围。通过采用输入接触结构，其允许沿着通道的长度在多于一个点处注入电荷，而不会在较早时间被注入的扰动电荷，可以在输入触点处实现用于形成横向滤波器功能的装置结构以及在输出接触结构处实现的结构，从而当作为滤波器操作时允许改进的ACT器件选择性。多个双极注入结构形成横向滤波器，允许整个ACT器件实现带外抑制和选择性。

6. 发明授权

US4546283A Conductor structure for thick film electrical device 失效
标题翻译：用于厚膜电气设备的导体结构
公开(公告)号：US4546283A
公开(公告)日：1985-10-08
申请号：US607094
申请日：1984-05-04
申请人： Michael D. Adamo , Cederick U. Darter , Frederick Y. Cho
发明人： Michael D. Adamo , Cederick U. Darter , Frederick Y. Cho
IPC分类号： H01L21/48 , H01L21/58 , H01L21/60 , H01L23/498 , H05K3/24 , H01L41/08 , H05K7/02
CPC分类号： H01L24/85 , H01L21/4853 , H01L21/4867 , H01L23/49811 , H01L23/49883 , H01L24/32 , H01L24/48 , H01L24/83 , H05K3/245 , H01L2224/05624 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48455 , H01L2224/48472 , H01L2224/48724 , H01L2224/48764 , H01L2224/73265 , H01L2224/83194 , H01L2224/8385 , H01L2224/83951 , H01L2224/85205 , H01L2224/85444 , H01L2224/85464 , H01L2224/85469 , H01L24/45 , H01L24/73 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/0103 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12043 , H01L2924/14 , H01L2924/15724 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/20752 , H05K2201/0391
摘要： A thick film device conductor arrangement suitable for making connections between a resiliently mounted element such as a surface acoustic delay line and adjacent thick film conductors and then with the device connecting pins. The thick film conductors include a double layer structure of differing noble metals each selected for desirable properties in designated areas of the device.
摘要翻译：一种厚膜装置导体装置，适于在诸如表面声延迟线和相邻的厚膜导体之间的弹性安装元件之间连接，然后与装置连接销连接。厚膜导体包括在器件的指定区域中选择为期望性质的不同贵金属的双层结构。

7. 发明授权

US5327626A Method for processing robust acoustic reflectors 失效
标题翻译：强化声反射器的处理方法
公开(公告)号：US5327626A
公开(公告)日：1994-07-12
申请号：US976749
申请日：1992-11-16
申请人： Frederick Y. Cho , Thomas S. Hickernell , David Penunuri
发明人： Frederick Y. Cho , Thomas S. Hickernell , David Penunuri
IPC分类号： H03H9/02 , H01L41/22
CPC分类号： H03H9/02653 , H03H9/02637 , Y10T29/42
摘要： A reflector arrangement for an acoustic wave device comprises an acoustic wave propagating substrate, reflection elements having at least two different widths separated by at least one gap breadth disposed on the acoustic wave propagating substrate. The at least two different widths enhance reflected waves produced by the propagating acoustic wave in such a fashion as to achieve a total acoustic reflectivity which is independent of variations in width of the reflection elements.
摘要翻译：用于声波装置的反射器装置包括声波传播基板，具有至少两个不同宽度的反射元件，该至少两个不同的宽度被布置在声波传播基板上的至少一个间隙宽度分开。至少两个不同的宽度增强了由传播声波产生的反射波，以便实现与反射元件的宽度的变化无关的全部声反射率。

8. 发明授权

US5301420A Method for manufacturing a light weight circuit module 失效
标题翻译：轻量化电路模块的制造方法
公开(公告)号：US5301420A
公开(公告)日：1994-04-12
申请号：US86060
申请日：1993-07-06
申请人： Frederick Y. Cho , Russell J. Elias , James F. Landers
发明人： Frederick Y. Cho , Russell J. Elias , James F. Landers
IPC分类号： H01L21/48 , H05K3/00 , H05K3/06 , H05K3/20 , H05K3/42 , H05K3/34
CPC分类号： H01L21/486 , H05K3/20 , H05K3/427 , H05K1/0272 , H05K2203/0156 , H05K2203/0769 , H05K2203/308 , H05K3/002 , H05K3/064 , Y10T29/49121 , Y10T29/49144 , Y10T29/49155
摘要： A method for making a light weight circuit module includes steps of providing a substrate, drilling through holes in the substrate and plating the through holes with a metal. The substrate is a rigid planar substrate and having metallization on both sides. The method also includes steps of drilling through holes in the substrate and plating the through holes with a metal. The method also includes steps of preparing a patterned photoresist layer on at least one of the two sides, etching the metallization on the at least one side in accordance with the patterned photoresist layer, drilling support holes, filling the support holes with a material chemically distinct from the substrate, stripping the patterned photoresist layer from the at least one side and chemically removing the substrate from the metallization.
摘要翻译：一种制造轻量化电路模块的方法包括提供基板，穿过基板中的孔并用金属电镀通孔的步骤。衬底是刚性平面衬底，并且在两侧具有金属化。该方法还包括钻穿基板中的孔并用金属电镀通孔的步骤。该方法还包括以下步骤：在两侧中的至少一个上制备图案化的光致抗蚀剂层，根据图案化的光致抗蚀剂层蚀刻至少一侧上的金属化，钻孔支撑孔，用化学上不同的材料填充支撑孔从所述衬底剥离所述图案化的光致抗蚀剂层从所述至少一个侧面，并从所述金属化化学去除所述衬底。

9. 发明授权

US5296824A Low loss wide bandwidth parallel channel acoustic filter 失效
标题翻译：低损耗宽带宽并行通道声滤波器
公开(公告)号：US5296824A
公开(公告)日：1994-03-22
申请号：US801297
申请日：1991-12-02
申请人： Frederick Y. Cho , Thomas S. Hickernell , David Penunuri
发明人： Frederick Y. Cho , Thomas S. Hickernell , David Penunuri
IPC分类号： H03H9/02 , H03H9/145 , H03H9/25 , H03H9/64
CPC分类号： H03H9/0285 , H03H9/14505 , H03H9/6433 , H03H9/6469 , H03H9/1452
摘要： An acoustic wave filtering apparatus includes an acoustic wave propagating substrate for supporting propagation of acoustic waves and a plurality of acoustic wave filters for filtering an electrical signal. Each of said plurality further comprises an input for supplying electrical input signals, an input unidirectional acoustic wave transducer for converting electrical signal energy into acoustic energy, an output unidirectional acoustic wave transducer for converting acoustic signals to electrical signals, and an output for combining and delivering electrical output signals to external electrical apparatus.
摘要翻译：声波滤波装置包括用于支撑声波传播的声波传播基板和用于滤波电信号的多个声波滤波器。所述多个的每一个还包括用于提供电输入信号的输入端，用于将电信号能量转换为声能的输入单向声波换能器，用于将声信号转换为电信号的输出单向声波换能器，以及用于组合和传递的输出电气输出信号到外部电气设备。

10. 发明授权

US5119172A Microelectronic device package employing capacitively coupled connections 失效
标题翻译：采用电容耦合连接的微电子器件封装
公开(公告)号：US5119172A
公开(公告)日：1992-06-02
申请号：US663347
申请日：1991-03-04
申请人： Frederick Y. Cho , Gerald Norley , David Penunuri
发明人： Frederick Y. Cho , Gerald Norley , David Penunuri
IPC分类号： H01L23/522
CPC分类号： H01L23/5222 , H01L2924/0002
摘要： A microelectronic device including a passivation layer disposed on the top surface has disposed on a portion of its surface a bonding agent. The resulting structure is inverted and sealed to a package base, forming a hermetically sealed cavity. This protects the microelectronic device from the environment. External electrical connection to other electronic apparatus is effected by means of conductors disposed on the package base surface. Alternating current (AC) capacitive coupling contacts allow electrical coupling to the microelectronic device and prevent violation of the integrity of the passivation layer. This method realizes compact microelectronics device packages which can be mass produced from entire microelectronic device substrates.
摘要翻译：包括设置在顶表面上的钝化层的微电子器件在其表面的一部分上设置有粘合剂。所得到的结构被倒置并密封到包装基底，形成气密密封腔。这保护微电子器件免受环境的影响。与其他电子设备的外部电连接通过设置在封装基座表面上的导体进行。交流电（AC）电容耦合触点允许电耦合到微电子器件并防止违反钝化层的完整性。该方法实现了可以从整个微电子器件衬底大规模生产的紧凑型微电子器件封装。

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