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1. 发明授权

US07654596B2 Endeffectors for handling semiconductor wafers 有权
标题翻译：用于处理半导体晶圆的处理器
公开(公告)号：US07654596B2
公开(公告)日：2010-02-02
申请号：US10781323
申请日：2004-02-18
申请人： Paul Mantz
发明人： Paul Mantz
IPC分类号： B65G49/07 , B66C1/02
CPC分类号： H01L21/68707 , Y10S414/141
摘要： Various endeffector designs are disclosed for handling semiconductor wafers. For instance, an endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include uniquely designed support members that are configured to only contact a wafer at the wafer's edge. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector. As designed, the endeffectors may have a very slim profile making the endeffectors easily maneuverable.
摘要翻译：公开了用于处理半导体晶片的各种设计。例如，在相对较低的温度下处理用于处理晶片的用于处理相对低温度的晶片的封口器被公开。两个消除器都包括独特设计的支撑构件，其构造成仅在晶片的边缘处接触晶片。消除器还可以包括晶片检测系统。用于在较低温度下处理晶片的落料器还可以包括推动装置，该推动装置不仅用于定位晶片，而且用于在由附接到止血器的机械手臂引起的止血器的加速或减速期间将晶片保持在封闭器上。根据设计，减压罩可以具有非常纤薄的轮廓，使得能够容易地操纵能量。

2. 发明授权

US08109549B2 Endeffectors for handling semiconductor wafers 有权
标题翻译：用于处理半导体晶圆的处理器
公开(公告)号：US08109549B2
公开(公告)日：2012-02-07
申请号：US12640135
申请日：2009-12-17
申请人： Paul Mantz
发明人： Paul Mantz
IPC分类号： B65G49/07 , B66C1/02
CPC分类号： H01L21/68707 , Y10S414/141
摘要： Various endeffector designs are disclosed for handling semiconductor wafers. For instance, an endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include uniquely designed support members that are configured to only contact a wafer at the wafer's edge. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector. As designed, the endeffectors may have a very slim profile making the endeffectors easily maneuverable.
摘要翻译：公开了用于处理半导体晶片的各种设计。例如，在相对较低的温度下处理用于处理晶片的用于处理相对低温度的晶片的封口器被公开。两个消除器都包括独特设计的支撑构件，其构造成仅在晶片的边缘处接触晶片。消除器还可以包括晶片检测系统。用于在较低温度下处理晶片的落料器还可以包括推动装置，该推动装置不仅用于定位晶片，而且用于在由附接到止血器的机械手臂引起的止血器的加速或减速期间将晶片保持在封闭器上。根据设计，减压罩可以具有非常纤薄的轮廓，使得能够容易地操纵能量。

3. 发明授权

US07004716B2 Device and method for aligning disk-shaped substrates 失效
公开(公告)号：US07004716B2
公开(公告)日：2006-02-28
申请号：US10148656
申请日：2000-11-29
申请人： Ottmar Graf , Paul Mantz
发明人： Ottmar Graf , Paul Mantz
IPC分类号： B25J11/00
CPC分类号： H01L21/68 , Y10S414/136
摘要： The invention relates to a simple and cost-effective method for aligning substrates. In order to achieve this, the invention provides a device for aligning disc-shaped substrates, in particular semiconductor wafers, comprising an alignment detection unit, at least one first support for receiving the substrate, which forms an oblique plane in relation to the horizontal, a stop against which the substrate can be displaced as a result of the oblique angle and a rotational device for rotating the substrate. The invention also relates to a method for aligning disc-shaped substrates, in particular semiconductor wafers, comprising the following steps: displacement of the substrate into an oblique position in relation to the horizontal, in which the substrate is held on a support which forms a tilted plane in relation to the horizontal and lies against a stop as a result of the oblique angle; rotation of the substrate into a predefined rotational position; and monitoring of the rotational position using a detection unit.

4. 发明申请

US20060245906A1 Device for accommodating disk-shaped objects and apparatus for handling objects 审中-公开
标题翻译：用于容纳盘形物体的装置和处理物体的装置
公开(公告)号：US20060245906A1
公开(公告)日：2006-11-02
申请号：US11333727
申请日：2006-01-17
申请人： Arthur Pelzmann , Martin Drechsler , Jurgen Niess , Michael Grandy , Hin Chung , Paul Mantz , Ottmar Graf
发明人： Arthur Pelzmann , Martin Drechsler , Jurgen Niess , Michael Grandy , Hin Chung , Paul Mantz , Ottmar Graf
IPC分类号： B66C23/00
CPC分类号： H01L21/68735 , H01L21/67109 , H01L21/6835 , H01L21/68742 , H01L21/68764 , H01L21/68771 , H01L2221/68313
摘要： A device is provided for accommodating disk-shaped objects, preferably semiconductor wafers for a thermal treatment thereof. The device has a carrier with at least two recesses for respective objects, and at least one cover for covering at least one of the recesses. A handling apparatus is also provided and has at least one transport arm, at least one support arm, at least one support drive provided on the arm for supporting, via vacuum, at least one object that is to be handled, a device for determining the individual weight of an object, and a vacuum control device for altering the vacuum as a function of the individual weight of an object.
摘要翻译：提供了用于容纳盘形物体的装置，优选用于其热处理的半导体晶片。该装置具有用于相应物体的至少两个凹部的载体，以及用于覆盖至少一个凹部的至少一个盖。还提供了处理装置，并且具有至少一个输送臂，至少一个支撑臂，设置在臂上的至少一个支撑驱动器，用于经由真空支撑待处理的至少一个物体，用于确定物体的个体重量，以及用于根据物体的个体重量来改变真空度的真空控制装置。

5. 发明申请

US20050006916A1 Endeffectors for handling semiconductor wafers 有权
标题翻译：用于处理半导体晶圆的处理器
公开(公告)号：US20050006916A1
公开(公告)日：2005-01-13
申请号：US10781323
申请日：2004-02-18
申请人： Paul Mantz
发明人： Paul Mantz
IPC分类号： H01L21/687 , B65G49/07
CPC分类号： H01L21/68707 , Y10S414/141
摘要： Various endeffector designs are disclosed for handling semiconductor wafers. For instance, an endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include uniquely designed support members that are configured to only contact a wafer at the wafer's edge. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector. As designed, the endeffectors may have a very slim profile making the endeffectors easily maneuverable.
摘要翻译：公开了用于处理半导体晶片的各种设计。例如，在相对较低的温度下处理用于处理晶片的用于处理相对低温度的晶片的封口器被公开。两个消除器都包括独特设计的支撑构件，其构造成仅在晶片的边缘处接触晶片。消除器还可以包括晶片检测系统。用于在较低温度下处理晶片的落料器还可以包括推动装置，该推动装置不仅用于定位晶片，而且用于在由附接到止血器的机械手臂引起的止血器的加速或减速期间将晶片保持在封闭器上。根据设计，减压罩可以具有非常纤薄的轮廓，使得能够容易地操纵能量。

6. 发明申请

US20120126555A1 ENDEFFECTORS FOR HANDLING SEMICONDUCTOR WAFERS 有权
标题翻译：用于处理半导体波形的负责人
公开(公告)号：US20120126555A1
公开(公告)日：2012-05-24
申请号：US13356820
申请日：2012-01-24
申请人： Paul Mantz
发明人： Paul Mantz
IPC分类号： B25J15/00
CPC分类号： H01L21/68707 , Y10S414/141
摘要： Various endeffector designs are disclosed for handling semiconductor wafers. For instance, an endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include uniquely designed support members that are configured to only contact a wafer at the wafer's edge. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector. As designed, the endeffectors may have a very slim profile making the endeffectors easily maneuverable.
摘要翻译：公开了用于处理半导体晶片的各种设计。例如，在相对较低的温度下处理用于处理晶片的用于处理相对低温度的晶片的封口器被公开。两个消除器都包括独特设计的支撑构件，其构造成仅在晶片的边缘处接触晶片。消除器还可以包括晶片检测系统。用于在较低温度下处理晶片的落料器还可以包括推动装置，该推动装置不仅用于定位晶片，而且用于在由附接到止血器的机械手臂引起的止血器的加速或减速期间将晶片保持在封闭器上。根据设计，减压罩可以具有非常纤薄的轮廓，使得能够容易地操纵能量。

7. 发明授权

US08622451B2 Endeffectors for handling semiconductor wafers 有权
标题翻译：用于处理半导体晶圆的处理器
公开(公告)号：US08622451B2
公开(公告)日：2014-01-07
申请号：US13356820
申请日：2012-01-24
申请人： Paul Mantz
发明人： Paul Mantz
IPC分类号： B65G49/07 , B66C1/02
CPC分类号： H01L21/68707 , Y10S414/141
摘要： An endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include a base member and uniquely designed support members that are configured to only contact a wafer at the wafer's edge. Further, the support members have an arcuate shape that generally matches a radius of a semiconductor wafer. More specifically, each support member has a curved wafer contact surface that tapers from a maximum radius at a top surface to a minimum radius at a bottom surface. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector.
摘要翻译：公开了一种用于在较低温度下处理晶片的封隔器以及用于在较高温度下处理晶片的封口器。两个消除器都包括底座部件和独特设计的支撑部件，其构造成仅在晶片边缘处接触晶片。此外，支撑构件具有通常与半导体晶片的半径匹配的弓形形状。更具体地，每个支撑构件具有弯曲的晶片接触表面，其从顶表面处的最大半径逐渐变细到底表面处的最小半径。消除器还可以包括晶片检测系统。用于在较低温度下处理晶片的落料器还可以包括推动装置，该推动装置不仅用于定位晶片，而且用于在由附接到止血器的机械手臂引起的止血器的加速或减速期间将晶片保持在封闭器上。

8. 发明申请

US20100096869A1 ENDEFFECTORS FOR HANDLING SEMICONDUCTOR WAFERS 有权
标题翻译：用于处理半导体波形的负责人
公开(公告)号：US20100096869A1
公开(公告)日：2010-04-22
申请号：US12640135
申请日：2009-12-17
申请人： Paul Mantz
发明人： Paul Mantz
IPC分类号： H01L21/687 , B66C1/42 , B25J15/00 , H01L21/683
CPC分类号： H01L21/68707 , Y10S414/141
摘要： Various endeffector designs are disclosed for handling semiconductor wafers. For instance, an endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include uniquely designed support members that are configured to only contact a wafer at the wafer's edge. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector. As designed, the endeffectors may have a very slim profile making the endeffectors easily maneuverable.
摘要翻译：公开了用于处理半导体晶片的各种设计。例如，在相对较低的温度下处理用于处理晶片的用于处理相对低温度的晶片的封口器被公开。两个消除器都包括独特设计的支撑构件，其构造成仅在晶片的边缘处接触晶片。消除器还可以包括晶片检测系统。用于在较低温度下处理晶片的落料器还可以包括推动装置，该推动装置不仅用于定位晶片，而且用于在由附接到止血器的机械手臂引起的止血器的加速或减速期间将晶片保持在封闭器上。根据设计，减压罩可以具有非常纤薄的轮廓，使得能够容易地操纵能量。

9. 发明授权

US07682226B2 Vane pump 有权
标题翻译：叶片泵
公开(公告)号：US07682226B2
公开(公告)日：2010-03-23
申请号：US11714512
申请日：2007-03-06
申请人： Bernd Maile , Paul Mantz , Martin Staudenrausch
发明人： Bernd Maile , Paul Mantz , Martin Staudenrausch
IPC分类号： A22C11/08
CPC分类号： A22C11/08 , F04C13/002 , F04C15/0011
摘要： A vane pump for delivering pasty masses, in particular sausage meat, with a pump case 6 and a rotatably held rotor 3 comprising vanes 2 held so as to be radially movable which form delivery cells 4 together with the wall 5 of the pump case 6, with a suction area, a pressure area and a sealing area separating the pressure area from the suction area. For a better sealing between the suction area and the sealing area, in particular in case of high pressures in the pressure area, and for increasing the service life of the vane pump, in the sealing area at least one sealing element is provided for sealing a gap between the rotor and the wall of the pump case.
摘要翻译：用于通过泵壳6和可旋转地保持的转子3输送糊状物质，特别是香肠肉的叶片泵，其包括被保持为可径向移动的叶片2，其与泵壳体6的壁5一起形成输送单元4，具有吸入区域，压力区域和将压力区域与吸入区域分开的密封区域。为了在吸入区域和密封区域之间更好地密封，特别是在压力区域中的高压力的情况下，并且为了增加叶片泵的使用寿命，在密封区域中提供至少一个密封元件用于密封转子与泵壳壁之间的间隙。

10. 发明申请

US20080045129A1 Vane pump 有权
标题翻译：叶片泵
公开(公告)号：US20080045129A1
公开(公告)日：2008-02-21
申请号：US11714512
申请日：2007-03-06
申请人： Bernd Maile , Paul Mantz , Martin Staudenrausch
发明人： Bernd Maile , Paul Mantz , Martin Staudenrausch
IPC分类号： A22C11/08
CPC分类号： A22C11/08 , F04C13/002 , F04C15/0011
摘要： A vane pump for delivering pasty masses, in particular sausage meat, with a pump case 6 and a rotatably held rotor 3 comprising vanes 2 held so as to be radially movable which form deliver cells 4 together with the wall 5 of the pump case 6, with a suction area, a pressure area and a sealing area separating the pressure area from the suction area. For a better sealing between the suction area and the sealing area, in particular in case of high pressures in the pressure area, and for increasing the service life of the vane pump, in the sealing area at least one sealing element is provided for sealing a gap between the rotor and the wall of the pump case.
摘要翻译：一种用于输送糊状物质，特别是香肠肉的叶片泵，其具有泵壳体6和可旋转地保持的转子3，转子3包括被保持为可径向移动的叶片2，其形成与泵壳体6的壁5一起输送细胞4，具有吸入区域，压力区域和将压力区域与吸入区域分开的密封区域。为了在吸入区域和密封区域之间更好地密封，特别是在压力区域中的高压力的情况下，并且为了增加叶片泵的使用寿命，在密封区域中提供至少一个密封元件用于密封转子与泵壳壁之间的间隙。

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