专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07350469B2 Folding leg latch assembly 有权
标题翻译：折叠腿闩组件
公开(公告)号：US07350469B2
公开(公告)日：2008-04-01
申请号：US10833251
申请日：2004-04-27
申请人： Paul Koning , Matthew Ruster , Jack Nyenhuis
发明人： Paul Koning , Matthew Ruster , Jack Nyenhuis
IPC分类号： A47B3/00
CPC分类号： A47B3/0818
摘要： A latch assembly is disclosed comprising a handle pivotable from a first position to a second position, a slider movable in response to movement of the handle between the first position and the second position, and a pivot pivotable between an upright position and a foldable position, wherein when the handle is in the first position the pivot is locked in one of the upright position and the foldable position, and when the handle is moved to the second position the pivot is movable between the upright position and the foldable position.
摘要翻译：公开了一种闩锁组件，包括可从第一位置转动到第二位置的手柄，响应于手柄在第一位置和第二位置之间的移动而可移动的滑块以及可在直立位置和可折叠位置之间枢转的枢轴，其中当所述手柄处于所述第一位置时，所述枢轴锁定在所述直立位置和所述可折叠位置中的一个位置，并且当所述手柄移动到所述第二位置时，所述枢轴可在所述直立位置和所述可折叠位置之间移动。

2. 发明申请

US20080178778A1 LATCH ASSEMBLY WITH REMOTE RELEASE 审中-公开
标题翻译： LATCH组装与远程发布
公开(公告)号：US20080178778A1
公开(公告)日：2008-07-31
申请号：US12058795
申请日：2008-03-31
申请人： Paul Koning , Matthew Ruster , Jack Nyenhuis
发明人： Paul Koning , Matthew Ruster , Jack Nyenhuis
IPC分类号： A47B3/00
CPC分类号： A47B3/0818
摘要： A latch assembly connecting a leg of a table to a table top comprises a housing assembly comprising a housing and a cover, a pivot mounted on the housing and pivotable between an upright position and a pivoted position, wherein the pivot defines an upright slot and a pivoted position slot, a remote release mechanism located remote from the pivot outside the housing assembly and movable from a first position to a second position, and a slider connected to the remote release mechanism and movable in response to movement of the remote release mechanism. When the remote release mechanism is in the first position the pivot is locked with respect to the housing assembly in one of the upright position and the pivoted position, and when the remote release mechanism is moved to the second position the pivot is movable between the upright position and the pivoted position.
摘要翻译：将桌子的腿部连接到台面的闩锁组件包括壳体组件，其包括壳体和盖子，枢轴安装在壳体上并且可在直立位置和枢转位置之间枢转，其中枢轴限定直立狭槽和枢转定位槽，远离释放机构的位置远离壳体组件的枢轴并且可从第一位置移动到第二位置，滑块连接到远程释放机构并且响应于远程释放机构的移动而可移动。当远程释放机构处于第一位置时，枢轴在垂直位置和枢转位置中的一个中相对于壳体组件被锁定，并且当远程释放机构移动到第二位置时，枢轴可在立柱位置和枢轴位置。

3. 发明申请

US20050235886A1 Folding leg latch assembly 有权
标题翻译：折叠腿闩组件
公开(公告)号：US20050235886A1
公开(公告)日：2005-10-27
申请号：US10833251
申请日：2004-04-27
申请人： Paul Koning , Matthew Ruster , Jack Nyenhuis
发明人： Paul Koning , Matthew Ruster , Jack Nyenhuis
IPC分类号： A47B3/00 , A47B3/08 , B60N2/02
CPC分类号： A47B3/0818
摘要： A latch assembly is disclosed comprising a handle pivotable from a first position to a second position, a slider movable in response to movement of the handle between the first position and the second position, and a pivot pivotable between an upright position and a foldable position, wherein when the handle is in the first position the pivot is locked in one of the upright position and the foldable position, and when the handle is moved to the second position the pivot is movable between the upright position and the foldable position.
摘要翻译：公开了一种闩锁组件，包括可从第一位置转动到第二位置的手柄，响应于手柄在第一位置和第二位置之间的移动而可移动的滑块以及可在直立位置和可折叠位置之间枢转的枢轴，其中当所述手柄处于所述第一位置时，所述枢轴锁定在所述直立位置和所述可折叠位置中的一个位置，并且当所述手柄移动到所述第二位置时，所述枢轴可在所述直立位置和所述可折叠位置之间移动。

4. 发明授权

US07794623B2 Microelectronic device having liquid crystalline epoxy resins 有权
标题翻译：具有液晶环氧树脂的微电子器件
公开(公告)号：US07794623B2
公开(公告)日：2010-09-14
申请号：US12151332
申请日：2008-05-06
申请人： James Christopher Matayabas, Jr. , Paul Koning
发明人： James Christopher Matayabas, Jr. , Paul Koning
IPC分类号： G03C5/00 , C09K19/52 , H01L27/15 , H01L23/28 , C08G59/00
CPC分类号： C09K19/3411 , Y10T428/10 , Y10T428/25
摘要： Liquid crystalline epoxy compounds, compositions including the compounds, and methods of using the compositions are disclosed. In one aspect, an epoxy compound may have a melting point that is less than 140° C. and may be liquid crystalline at a temperature greater than 150° C.
摘要翻译：公开了液晶环氧化合物，包括该化合物的组合物和使用该组合物的方法。一方面，环氧化合物的熔点可以低于140℃，并且在大于150℃的温度下可以是液晶。

5. 外观设计

USD569663S1 Table foot 有权
公开(公告)号：USD569663S1
公开(公告)日：2008-05-27
申请号：US29297897
申请日：2007-11-21
申请人： Errol Pearsons , Paul Koning
设计人： Errol Pearsons , Paul Koning

6. 发明申请

US20070182010A1 Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor 审中-公开
公开(公告)号：US20070182010A1
公开(公告)日：2007-08-09
申请号：US11724887
申请日：2007-03-16
申请人： Paul Koning
发明人： Paul Koning
IPC分类号： H01L23/48
CPC分类号： H01L24/81 , H01L21/563 , H01L24/11 , H01L2224/05571 , H01L2224/05573 , H01L2224/1131 , H01L2224/1147 , H01L2224/13099 , H01L2224/16 , H01L2224/2929 , H01L2224/29386 , H01L2224/73203 , H01L2224/8121 , H01L2224/81815 , H01L2224/81903 , H01L2224/8385 , H01L2224/9211 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H05K3/305 , H05K3/3436 , H05K2201/0209 , H05K2201/10977 , H05K2203/0108 , H05K2203/1189 , Y02P70/613 , H01L2224/81 , H01L2224/83 , H01L2924/05442 , H01L2224/29075 , H01L2224/83851 , H01L2924/00 , H01L2224/05599
摘要： A mounting substrate includes an imprinted structure on one side for containing electrical bumps. The imprinted structure is imprinted and also cured under conditions that allow retention of significant features of the cured polymer film. A chip package is also made of the imprinted structure. A computing system is also disclosed that includes the imprinted structure.

7. 发明申请

US20050287714A1 Enhancing epoxy strength using kaolin filler 审中-公开
标题翻译：使用高岭土填料提高环氧强度
公开(公告)号：US20050287714A1
公开(公告)日：2005-12-29
申请号：US10881377
申请日：2004-06-29
申请人： Michael Walk , Paul Koning
发明人： Michael Walk , Paul Koning
IPC分类号： H01L21/44 , H01L21/48 , H01L23/14 , H01L23/498
CPC分类号： H01L23/145 , H01L21/481 , H01L21/486 , H01L23/49827 , H01L23/49894 , H01L2224/16 , H01L2924/12044
摘要： An embodiment of the present invention is a technique to provide a substrate with enhanced strength. A kaolin filler is added to an epoxy resin. The kaolin filler is mixed with the epoxy resin to form a mixture. A substrate is formed from the mixture. The substrate is processed in a package containing a semiconductor device.
摘要翻译：本发明的一个实施方案是提供具有增强强度的基材的技术。向环氧树脂中加入高岭土填料。将高岭土填料与环氧树脂混合以形成混合物。由混合物形成基材。在包含半导体器件的封装中处理衬底。

8. 发明申请

US20050221597A1 Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor 失效
标题翻译：用于衬底压印的压花工艺，由此制成的结构以及用于其的聚合物
公开(公告)号：US20050221597A1
公开(公告)日：2005-10-06
申请号：US10815561
申请日：2004-03-31
申请人： Paul Koning
发明人： Paul Koning
IPC分类号： H01L21/50 , H01L21/56 , H05K3/30 , H05K3/34
CPC分类号： H01L24/81 , H01L21/563 , H01L24/11 , H01L2224/05571 , H01L2224/05573 , H01L2224/1131 , H01L2224/1147 , H01L2224/13099 , H01L2224/16 , H01L2224/2929 , H01L2224/29386 , H01L2224/73203 , H01L2224/8121 , H01L2224/81815 , H01L2224/81903 , H01L2224/8385 , H01L2224/9211 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H05K3/305 , H05K3/3436 , H05K2201/0209 , H05K2201/10977 , H05K2203/0108 , H05K2203/1189 , Y02P70/613 , H01L2224/81 , H01L2224/83 , H01L2924/05442 , H01L2224/29075 , H01L2224/83851 , H01L2924/00 , H01L2224/05599
摘要： A mounting substrate includes an imprinted structure on one side for containing electrical bumps. The imprinted structure is imprinted and also cured under conditions that allow retention of significant features of the cured polymer film. A chip package is also made of the imprinted structure. A computing system is also disclosed that includes the imprinted structure.
摘要翻译：安装基板在一侧包括用于容纳电凸起的压印结构。印迹结构被印记并且在允许保留固化的聚合物膜的显着特征的条件下固化。芯片封装也由印刷结构制成。还公开了包括打印结构的计算系统。

9. 发明申请

US20050116387A1 Component packaging apparatus, systems, and methods 审中-公开
标题翻译：组件包装设备，系统和方法
公开(公告)号：US20050116387A1
公开(公告)日：2005-06-02
申请号：US10750534
申请日：2003-12-31
申请人： Peter Davison , Paul Koning
发明人： Peter Davison , Paul Koning
IPC分类号： B05C1/00 , B05D3/12 , H01L21/44 , H05K1/03 , H05K3/00 , H05K3/10 , H05K3/12 , H05K3/46
CPC分类号： H05K3/005 , H01L2224/16225 , H01L2924/1461 , H01L2924/15311 , H05K1/0373 , H05K3/107 , H05K3/1258 , H05K3/4664 , H05K2201/09036 , H05K2203/0108 , H05K2203/1189 , H05K2203/122 , H01L2924/00
摘要： A method and apparatus to imprint or emboss dielectric substrates for high-density electronic circuitry using tool foils having a special release coating.
摘要翻译：一种用于使用具有特殊释放涂层的工具箔来压印或压印用于高密度电子电路的电介质基片的方法和装置。

10. 发明申请

US20050087891A1 No-flow underfill composition and method 失效
标题翻译：无流动底层填料的组成和方法
公开(公告)号：US20050087891A1
公开(公告)日：2005-04-28
申请号：US10692062
申请日：2003-10-23
申请人： Christopher Rumer , Tian-An Chen , Vijay Wakharkar , Paul Koning
发明人： Christopher Rumer , Tian-An Chen , Vijay Wakharkar , Paul Koning
IPC分类号： H01L21/56 , H01L21/60 , H01L23/29
CPC分类号： H01L24/31 , H01L21/563 , H01L23/295 , H01L24/29 , H01L24/81 , H01L2224/16225 , H01L2224/29499 , H01L2224/32225 , H01L2224/32505 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/81801 , H01L2224/83192 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01021 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： In some embodiments, a method includes providing a composition which includes a base at least partially filled with filler particles and applying the composition as an underfill composition. At least some of the filler particles are electrically conductive.
摘要翻译：在一些实施方案中，一种方法包括提供一种组合物，其包括至少部分填充有填料颗粒的基质并将该组合物作为底部填充剂组合物施用。至少一些填料颗粒是导电的。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式