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    • 2. 发明授权
    • Method of fabrication of display pixels driven by silicon thin film
transistors
    • 由硅薄膜晶体管驱动的显示像素的制造方法
    • US5994174A
    • 1999-11-30
    • US940104
    • 1997-09-29
    • Paul G. CareyPatrick M. Smith
    • Paul G. CareyPatrick M. Smith
    • G02F1/1333G02F1/1362G02F1/1368H01L21/336H01L29/786H01L21/268
    • H01L29/66765G02F1/1368H01L27/1218H01L29/78603G02F1/133305G02F1/136213
    • Display pixels driven by silicon thin film transistors are fabricated on plastic substrates for use in active matrix displays, such as flat panel displays. The process for forming the pixels involves a prior method for forming individual silicon thin film transistors on low-temperature plastic substrates. Low-temperature substrates are generally considered as being incapable of withstanding sustained processing temperatures greater than about 200.degree. C. The pixel formation process results in a complete pixel and active matrix pixel array. A pixel (or picture element) in an active matrix display consists of a silicon thin film transistor (TFT) and a large electrode, which may control a liquid crystal light valve, an emissive material (such as a light emitting diode or LED), or some other light emitting or attenuating material. The pixels can be connected in arrays wherein rows of pixels contain common gate electrodes and columns of pixels contain common drain electrodes. The source electrode of each pixel TFT is connected to its pixel electrode, and is electrically isolated from every other circuit element in the pixel array.
    • 由硅薄膜晶体管驱动的显示像素被制造在用于有源矩阵显示器(例如平板显示器)中的塑料基板上。 用于形成像素的工艺涉及用于在低温塑料基板上形成各个硅薄膜晶体管的现有方法。 低温基底通常被认为不能承受大于约200℃的持续处理温度。像素形成过程导致完整的像素和有源矩阵像素阵列。 有源矩阵显示器中的像素(或像素)由可以控制液晶光阀,发光材料(例如发光二极管或LED)的硅薄膜晶体管(TFT)和大电极组成, 或一些其他发光或衰减材料。 像素可以以阵列的形式连接,其中像素行包含公共栅电极,并且像素列包含公共漏电极。 每个像素TFT的源电极连接到其像素电极,并且与像素阵列中的每隔一个电路元件电隔离。
    • 3. 发明授权
    • Plastic substrates for active matrix liquid crystal display incapable of
withstanding processing temperature of over 200.degree. C and method of
fabrication
    • 用于有源矩阵液晶显示器的塑料基板不能承受超过200℃的加工温度和制造方法
    • US5856858A
    • 1999-01-05
    • US980837
    • 1997-12-01
    • Paul G. CareyPatrick M. SmithJohn HavensPhil Jones
    • Paul G. CareyPatrick M. SmithJohn HavensPhil Jones
    • G02F1/1333G02F1/1334G02F1/1368G02F1/133
    • G02F1/133305G02F1/1334G02F1/1368
    • Bright-polarizer-free, active-matrix liquid crystal displays (AMLCDs) are formed on plastic substrates. The primary components of the display are a pixel circuit fabricated on one plastic substrate, an intervening liquid-crystal material, and a counter electrode on a second plastic substrate. The-pixel circuit contains one or more thin-film transistors (TFTs) and either a transparent or reflective pixel electrode manufactured at sufficiently low temperatures to avoid damage to the plastic substrate. Fabrication of the TFTs can be carried out at temperatures less than 100.degree. C. The liquid crystal material is a commercially made nematic curvilinear aligned phase (NCAP) film. The counter electrode is comprised of a plastic substrate coated with a transparent conductor, such as indium-doped tin oxide (ITO). By coupling the active matrix with NCAP, a high-information content can be provided in a bright, fully plastic package. Applications include any low cost portable electronics containing flat displays where ruggedization of the display is desired.
    • 在塑料基板上形成无偏光镜的有源矩阵液晶显示器(AMLCD)。 显示器的主要部件是在一个塑料基板,中间液晶材料和第二塑料基板上的对电极上制造的像素电路。 像素电路包含一个或多个薄膜晶体管(TFT)以及在足够低的温度下制造的透明或反射像素电极,以避免损坏塑料基板。 TFT的制造可以在低于100℃的温度下进行。液晶材料是商业上制作的向列线性对准相(NCAP)膜。 对电极由涂覆有透明导体的诸如铟掺杂氧化锡(ITO)的塑料基板组成。 通过将有源矩阵与NCAP耦合,可以在明亮的全塑料封装中提供高信息含量。 应用包括任何低成本便携式电子产品,其中包含需要显示器加固的平板显示器。
    • 5. 发明授权
    • Thin film transistors on plastic substrates
    • 塑料基板上的薄膜晶体管
    • US06680485B1
    • 2004-01-20
    • US09025006
    • 1998-02-17
    • Paul G. CareyPatrick M. SmithThomas W. SigmonRandy C. Aceves
    • Paul G. CareyPatrick M. SmithThomas W. SigmonRandy C. Aceves
    • H01L2904
    • H01L27/1285H01L21/02422H01L21/02488H01L21/02532H01L21/02686H01L21/268H01L27/1214H01L29/66757H01L29/78603H01L29/78666H01L29/78675
    • A process for formation of thin film transistors (TFTs) on plastic substrates replaces standard thin film transistor fabrication techniques, and uses sufficiently lower processing temperatures so that inexpensive plastic substrates may be used in place of standard glass, quartz, and silicon wafer-based substrates. The silicon based thin film transistor produced by the process includes a low temperature substrate incapable of withstanding sustained processing temperatures greater than about 250° C., an insulating layer on the substrate, a layer of silicon on the insulating layer having sections of doped silicon, undoped silicon, and poly-silicon, a gate dielectric layer on the layer of silicon, a layer of gate metal on the dielectric layer, a layer of oxide on sections of the layer of silicon and the layer of gate metal, and metal contacts on sections of the layer of silicon and layer of gate metal defining source, gate, and drain contacts, and interconnects.
    • 用于在塑料基板上形成薄膜晶体管(TFT)的工艺代替标准薄膜晶体管制造技术,并且使用足够低的处理温度,以便可以使用便宜的塑料基板代替标准玻璃,石英和硅晶片基板 。 通过该方法制造的基于硅的薄膜晶体管包括不能承受大于约250℃的持续处理温度的低温衬底,衬底上的绝缘层,具有掺杂硅的部分的绝缘层上的硅层, 未掺杂的硅和多晶硅,硅层上的栅极介电层,电介质层上的栅极金属层,在硅层和栅极金属层上的部分上的氧化物层,以及金属接触 限定源极,栅极和漏极触点以及互连的硅层和栅极金属层的部分。
    • 9. 发明授权
    • Thick adherent dielectric films on plastic substrates and method for depositing same
    • 塑料基底上的厚粘附介质膜及其沉积方法
    • US06436739B1
    • 2002-08-20
    • US09560058
    • 2000-04-27
    • Paul WickboldtAlbert R. EllingboeSteven D. TheissPatrick M. Smith
    • Paul WickboldtAlbert R. EllingboeSteven D. TheissPatrick M. Smith
    • H01L2184
    • C23C16/402C23C14/10C23C14/541C23C16/46
    • Thick adherent dielectric films deposited on plastic substrates for use as a thermal barrier layer to protect the plastic substrates from high temperatures which, for example, occur during laser annealing of layers subsequently deposited on the dielectric films. It is desirable that the barrier layer has properties including: a thickness of 1 &mgr;m or greater, adheres to a plastic substrate, does not lift-off when cycled in temperature, has few or no cracks and does not crack when subjected to bending, resistant to lift-off when submersed in fluids, electrically insulating and preferably transparent. The thick barrier layer may be composed, for example, of a variety of dielectrics and certain metal oxides, and may be deposited on a variety of plastic substrates by various known deposition techniques. The key to the method of forming the thick barrier layer on the plastic substrate is maintaining the substrate cool during deposition of the barrier layer. Cooling of the substrate maybe accomplished by the use of a cooling chuck on which the plastic substrate is positioned, and by directing cooling gas, such as He, Ar and N2, between the plastic substrate and the cooling chucks. Thick adherent dielectric films up to about 5 &mgr;m have been deposited on plastic substrates which include the above-referenced properties, and which enable the plastic substrates to withstand laser processing temperatures applied to materials deposited on the dielectric films.
    • 沉积在塑料基板上的厚粘附介质膜用作热障层以保护塑料基板免受高温的影响,例如在随后沉积在电介质膜上的层的激光退火期间发生。 优选的是,阻隔层具有以下特性:1μm以上的厚度,粘附在塑料基板上,在温度循环时不会剥离,在受到弯曲时具有很少或没有裂纹并且不会发生裂纹 当浸没在流体中时剥离,电绝缘并且优选是透明的。 厚的阻挡层可以由各种电介质和某些金属氧化物构成,并且可以通过各种已知的沉积技术沉积在各种塑料基板上。 在塑料基板上形成厚的阻挡层的方法的关键是在阻挡层的沉积过程中保持基板的冷却。 衬底的冷却可以通过使用其上定位有塑料衬底的冷却卡盘,并且通过引导诸如He,Ar和N2之类的冷却气体在塑料衬底和冷却卡盘之间来实现。 高达约5μm的厚粘附介质膜已经沉积在包括上述属性的塑料基板上,并且使得塑料基板能够承受施加到沉积在电介质膜上的材料的激光加工温度。