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    • 2. 发明授权
    • Thin film transistors on plastic substrates
    • 塑料基板上的薄膜晶体管
    • US06680485B1
    • 2004-01-20
    • US09025006
    • 1998-02-17
    • Paul G. CareyPatrick M. SmithThomas W. SigmonRandy C. Aceves
    • Paul G. CareyPatrick M. SmithThomas W. SigmonRandy C. Aceves
    • H01L2904
    • H01L27/1285H01L21/02422H01L21/02488H01L21/02532H01L21/02686H01L21/268H01L27/1214H01L29/66757H01L29/78603H01L29/78666H01L29/78675
    • A process for formation of thin film transistors (TFTs) on plastic substrates replaces standard thin film transistor fabrication techniques, and uses sufficiently lower processing temperatures so that inexpensive plastic substrates may be used in place of standard glass, quartz, and silicon wafer-based substrates. The silicon based thin film transistor produced by the process includes a low temperature substrate incapable of withstanding sustained processing temperatures greater than about 250° C., an insulating layer on the substrate, a layer of silicon on the insulating layer having sections of doped silicon, undoped silicon, and poly-silicon, a gate dielectric layer on the layer of silicon, a layer of gate metal on the dielectric layer, a layer of oxide on sections of the layer of silicon and the layer of gate metal, and metal contacts on sections of the layer of silicon and layer of gate metal defining source, gate, and drain contacts, and interconnects.
    • 用于在塑料基板上形成薄膜晶体管(TFT)的工艺代替标准薄膜晶体管制造技术,并且使用足够低的处理温度,以便可以使用便宜的塑料基板代替标准玻璃,石英和硅晶片基板 。 通过该方法制造的基于硅的薄膜晶体管包括不能承受大于约250℃的持续处理温度的低温衬底,衬底上的绝缘层,具有掺杂硅的部分的绝缘层上的硅层, 未掺杂的硅和多晶硅,硅层上的栅极介电层,电介质层上的栅极金属层,在硅层和栅极金属层上的部分上的氧化物层,以及金属接触 限定源极,栅极和漏极触点以及互连的硅层和栅极金属层的部分。