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    • 5. 发明申请
    • Referenced Inspection Device
    • 参考检验装置
    • US20110069306A1
    • 2011-03-24
    • US12994793
    • 2009-05-29
    • Paul DoyleGuoheng ZhaoAlexander BelyaevJ. Rex Runyon
    • Paul DoyleGuoheng ZhaoAlexander BelyaevJ. Rex Runyon
    • G01N21/88G01R31/26
    • H01L21/6838
    • A tool for investigating a substrate, where the tool has a tool head for investigating the substrate, a chuck for disposing an upper surface of the substrate in proximity to the tool head, and an air bearing disposed on the tool head adjacent the substrate. The air bearing has a pressure source and a vacuum source, where the vacuum source draws the substrate toward the air bearing and the pressure source prevents the substrate from physically contacting the air bearing. The pressure source and the vacuum source work in cooperation to dispose the upper surface of the substrate at a known distance from the tool head. By using the air bearing as part of the tool in this manner, registration of the substrate to the tool head is accomplished relative to the upper surface of the substrate, not the back side of the substrate.
    • 一种用于调查基板的工具,其中该工具具有用于检查基板的工具头,用于将基板的上表面设置在工具头附近的卡盘以及设置在与基板相邻的工具头上的空气轴承。 空气轴承具有压力源和真空源,其中真空源将基板拉向空气轴承,并且压力源防止基板物理接触空气轴承。 压力源和真空源协同工作,将衬底的上表面设置在与工具头一段已知距离处。 通过以这种方式使用空气轴承作为工具的一部分,基板相对于基板的上表面而不是基板的背面完成对准工具头。
    • 10. 发明申请
    • Wafer Inspection
    • 晶圆检验
    • US20140009759A1
    • 2014-01-09
    • US13822281
    • 2011-12-07
    • Guoheng ZhaoJenn-Kuen LeongMehdi Vaez-Iravani
    • Guoheng ZhaoJenn-Kuen LeongMehdi Vaez-Iravani
    • G01N21/88
    • G01N21/9501G01N21/21G01N21/47G01N21/8806G01N2201/06113H01L22/12H01L2924/0002H01L2924/00
    • Systems and methods for inspecting a wafer are provided. One system includes an illumination subsystem configured to illuminate the wafer; a collection subsystem configured to collect light scattered from the wafer and to preserve the polarization of the scattered light; an optical element configured to separate the scattered light collected in different segments of the collection numerical aperture of the collection subsystem, where the optical element is positioned at a Fourier plane or a conjugate of the Fourier plane of the collection subsystem; a polarizing element configured to separate the scattered light in one of the different segments into different portions of the scattered light based on polarization; and a detector configured to detect one of the different. portions of the scattered light and to generate output responsive to the detected light, which is used to detect defects on the wafer.
    • 提供了用于检查晶片的系统和方法。 一个系统包括配置成照亮晶片的照明子系统; 收集子系统,被配置为收集从晶片散射的光并保持散射光的偏振; 光学元件,被配置为将收集在收集子系统的收集数值孔径的不同段中的散射光分离,其中所述光学元件位于所述收集子系统的傅立叶平面或所述傅立叶平面的共轭处; 偏振元件,被配置为基于极化将所述不同段中的一个中的散射光分离成所述散射光的不同部分; 以及检测器,被配置为检测不同的一个。 散射光的一部分并且响应于检测到的光而产生输出,用于检测晶片上的缺陷。