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1. 发明申请

US20080001275A1 Planar Array Contact Memory Cards 失效
标题翻译：平面阵列触点存储卡
公开(公告)号：US20080001275A1
公开(公告)日：2008-01-03
申请号：US11855356
申请日：2007-09-14
申请人： Paul Coteus , Kevin Gower , Shawn Hall , Gareth Hougham , Dale Pearson
发明人： Paul Coteus , Kevin Gower , Shawn Hall , Gareth Hougham , Dale Pearson
IPC分类号： H01L23/02
CPC分类号： G11C5/04 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15192 , H05K1/181 , H05K2201/10159 , H01L2224/0401
摘要： A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.
摘要翻译：一种平面存储器模块（PAMM）装置，包括大致平面的卡，包括第一侧和第二侧，所述第一侧具有多个耦合，所述第二侧具有多个连接器，多个存储器件耦合到所述卡经由所述多个联接器的第一部分以及经由所述多个联接器的第二部分耦合到所述卡的至少一个毂芯片。多个联接器中的每一个连接到多个连接器中的相关联的一个。

2. 发明申请

US20060274562A1 Planar array contact memory cards 有权
公开(公告)号：US20060274562A1
公开(公告)日：2006-12-07
申请号：US11146495
申请日：2005-06-06
申请人： Paul Coteus , Kevin Gower , Shawn Hall , Dale Pearson , Gareth Hougham
发明人： Paul Coteus , Kevin Gower , Shawn Hall , Dale Pearson , Gareth Hougham
IPC分类号： G11C5/04
CPC分类号： G11C5/04 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15192 , H05K1/181 , H05K2201/10159 , H01L2224/0401
摘要： A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

3. 发明申请

US20080045052A1 Planar Array Contact Memory Cards 有权
公开(公告)号：US20080045052A1
公开(公告)日：2008-02-21
申请号：US11855325
申请日：2007-09-14
申请人： Paul Coteus , Kevin Gower , Shawn Hall , Gareth Hougham , Dale Pearson
发明人： Paul Coteus , Kevin Gower , Shawn Hall , Gareth Hougham , Dale Pearson
IPC分类号： H01R12/20
CPC分类号： G11C5/04 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15192 , H05K1/181 , H05K2201/10159 , H01L2224/0401
摘要： A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

4. 发明申请

US20070054512A1 Topography compensating land grid array interposer 审中-公开
标题翻译：地形补偿地面阵列插值器
公开(公告)号：US20070054512A1
公开(公告)日：2007-03-08
申请号：US11327710
申请日：2006-01-05
申请人： Gareth Hougham , Brian Beaman , John Corbin , Paul Coteus , Shawn Hall , Kathleen Hinge , Theron Lewis , Frank Libsch , Amanda Mikhail
发明人： Gareth Hougham , Brian Beaman , John Corbin , Paul Coteus , Shawn Hall , Kathleen Hinge , Theron Lewis , Frank Libsch , Amanda Mikhail
IPC分类号： H01R12/00
CPC分类号： H05K3/368 , H01R12/52 , H01R12/714 , H05K1/0269 , H05K3/325 , H05K2201/10378 , Y10T29/49117 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149
摘要： LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating serfaces. For those LGA types made by molding techniques such as the metal-in-polymer type (eg. Tyco Electronics MPI, or Shin Etsu RP) or the Metal-on-Elastomer type (IBM), using molds with the desired topography provides the desired LGA topography. For those LGAs made of metal springs, cantilevers, armatures and the like, the desired topography is imposed by shaping of the buttons during or after fabrication using a sizing die with the desired topography.
摘要翻译： LGA连接器采用预制到不同高度的按钮或弹簧触点制成，以适应特定产品类型的典型模块或PCB的初始形貌。这是通过测量第一电子装置和第二电子装置的配合表面的形貌来制造的; 制造内插器触点以形成具有用于接触配合表面的相应反向形状的相对非平面侧; 并且将所述插入件夹在所述第一和第二电子设备之间，所述相对侧与相应的匹配塞线接触。对于通过成型技术（例如，Tyco Electronics MPI或Shin Etsu RP）或Metal-on-Elastomer型（IBM）等成型技术制造的LGA类型，使用具有所需形貌的模具可提供所需的 LGA地形。对于由金属弹簧，悬臂，电枢等制成的那些LGAs，通过使用具有所需形状的尺寸模具在制造期间或之后使按钮成形来施加所需的形状。

5. 发明申请

US20080055851A1 METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING 失效
公开(公告)号：US20080055851A1
公开(公告)日：2008-03-06
申请号：US11862289
申请日：2007-09-27
申请人： Shawn Hall , Shurong Tian , Paul Coteus , John Karidis , Evan Colgan , Robert Guernsey
发明人： Shawn Hall , Shurong Tian , Paul Coteus , John Karidis , Evan Colgan , Robert Guernsey
IPC分类号： H05K7/20
CPC分类号： H05K7/20754 , G06F1/20 , G06F2200/201
摘要： A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.

6. 发明申请

US20080055856A1 METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING 审中-公开
标题翻译：通过闭环液体辅助空气冷却与直接液体冷却组合来冷却设备外壳的方法和装置
公开(公告)号：US20080055856A1
公开(公告)日：2008-03-06
申请号：US11862308
申请日：2007-09-27
申请人： Shawn Hall , Shurong Tian , Paul Coteus , John Karidis , Evan Colgan , Robert Guernsey
发明人： Shawn Hall , Shurong Tian , Paul Coteus , John Karidis , Evan Colgan , Robert Guernsey
IPC分类号： H05K7/20 , H05K5/02
CPC分类号： H05K7/20754 , G06F1/20 , G06F2200/201
摘要： A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.
摘要翻译：优选地在外壳内冷却发热部件的多样性的方法和装置，其中至少一些部件具有高功率密度，而其它部件具有低功率密度。由基本相对较少的高功率密度组件（例如微处理器芯片）产生的热量通过直接液体冷却而被去除，而由更多的低功率或低功率密度组件产生的热量，例如存储芯片例如，通过液体辅助空气冷却以封闭回路的形式除去，包括沿着空气路径交替的多个加热和冷却区域。

7. 发明申请

US20070002536A1 METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP, LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING 有权
标题翻译：用于通过闭环冷却设备外壳的方法和装置，液体辅助的空气冷却与直接液体冷却的组合
公开(公告)号：US20070002536A1
公开(公告)日：2007-01-04
申请号：US11427384
申请日：2006-06-29
申请人： Shawn Hall , Shurong Tian , Paul Coteus , John Karidis , Evan Colgan , Robert Guernsey
发明人： Shawn Hall , Shurong Tian , Paul Coteus , John Karidis , Evan Colgan , Robert Guernsey
IPC分类号： H05K7/20
CPC分类号： H05K7/20754 , G06F1/20 , G06F2200/201
摘要： A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.
摘要翻译：优选地在外壳内冷却发热部件的多样性的方法和装置，其中至少一些部件具有高功率密度，而其它部件具有低功率密度。由基本相对较少的高功率密度组件（例如微处理器芯片）产生的热量通过直接液体冷却而被去除，而由更多的低功率或低功率密度组件产生的热量，例如存储芯片例如，通过液体辅助空气冷却以封闭回路的形式除去，包括沿着空气路径交替的多个加热和冷却区域。

8. 发明授权

US06384821B1 Method and apparatus for delivering 3D graphics in a networked environment using transparent video 有权
标题翻译：使用透明视频在网络环境中传送3D图形的方法和装置
公开(公告)号：US06384821B1
公开(公告)日：2002-05-07
申请号：US09411312
申请日：1999-10-04
申请人： Paul Borrel , Shawn Hall , William P. Horn , James T. Klosowski , William L. Luken , Ioana M. Martin , Frank Suits
发明人： Paul Borrel , Shawn Hall , William P. Horn , James T. Klosowski , William L. Luken , Ioana M. Martin , Frank Suits
IPC分类号： G06T1700
CPC分类号： H04L65/607 , G06T15/00 , H04L29/06 , H04L29/06027 , H04L65/80 , H04L67/38 , H04L67/42 , H04N21/234327 , H04N21/25833 , H04N21/2662 , H04N21/4621 , H04N21/6373 , H04N21/8146
摘要： A system and method for seamlessly combining client-only rendering techniques with server-only rendering techniques. The approach uses a composite stream containing three distinct streams. One stream is available to send geometry from the server to the client. Another stream contains video with transparent pixels that allow the client-rendered object to appear in the context of the server rendered objects. The third stream contains camera information. The invention can satisfy a number of viewing applications. For example, initially the most relevant geometry can stream to the client for high quality local rendering while the server delivers renderings of less relevant geometry at lower resolutions. After the most relevant geometry has been delivered to the client, the less important geometry can be optionally streamed to the client to increase the fidelity of the entire scene. In the limit, all of the geometry is transferred to the client and the situation corresponds to client-only rendering system where local graphics hardware is used to improve fidelity and reduce bandwidth. Alternatively, if a client does not have local three-dimensional graphics capability then the server can transmit only the video of the server-rendered object and drop the other two streams. In either case, the approach also permits for a progressive improvement in the server-rendered image whenever the scene becomes static. Bandwidth that was previously used to represent changing images is allocated to improving the fidelity of the server-rendered image whenever the scene becomes static.
摘要翻译：一种用于将仅客户端渲染技术与仅服务器渲染技术无缝组合的系统和方法。该方法使用包含三个不同流的复合流。一个流可用于从服务器向客户端发送几何。另一个流包含具有透明像素的视频，允许客户端呈现的对象出现在服务器渲染对象的上下文中。第三个流包含相机信息。本发明可以满足多种观看应用。例如，最初最相关的几何可以流式传输到客户端以进行高质量的本地呈现，而服务器以较低分辨率提供不相关几何的渲染。在最相关的几何体已经传送到客户端之后，不太重要的几何可以选择性地流式传输给客户端，以增加整个场景的保真度。在极限情况下，所有的几何都被传送到客户端，并且这种情况对应于仅客户机渲染系统，其中使用本地图形硬件来提高保真度并减少带宽。或者，如果客户端不具有本地三维图形能力，则服务器可以仅传送服务器渲染对象的视频并丢弃其他两个流。无论哪种情况，当场景变得静态时，该方法还允许在服务器呈现的图像中逐渐改进。分配先前用于表示更改图像的带宽，以便在场景变为静态时提高服务器渲染图像的保真度。

9. 发明授权

US08799244B2 Establishing parse scope 有权
标题翻译：建立分析范围
公开(公告)号：US08799244B2
公开(公告)日：2014-08-05
申请号：US13462861
申请日：2012-05-03
申请人： Jeffrey Vincent Tofano , Shawn Hall
发明人： Jeffrey Vincent Tofano , Shawn Hall
IPC分类号： G06F17/30 , G06F3/06
CPC分类号： G06F17/30303 , G06F3/0641 , G06F17/30159 , H03M7/30
摘要： Example apparatus, methods, and computers control establishing a shared parse scope between two computers that intend to be involved in a shared de-duplication action. One example method includes, upon determining that a first de-duplication logic and a second de-duplication logic are to participate in a shared de-duplication action for an object, controlling the first de-duplication logic to establish a shared parse scope with the second de-duplication logic. Establishing the shared parse scope may include negotiations between the computers, where the negotiations transfer dialect information. The dialect information may take the form of rules. The method may also include persisting the shared parse scope.
摘要翻译：控制示例性的设备，方法和计算机控制在打算参与共享重复数据删除操作的两台计算机之间建立共享解析范围。一个示例性方法包括：在确定第一重复数据消除逻辑和第二重复数据删除逻辑参与对象的共享重复数据删除操作时，控制第一重复数据删除逻辑以建立共享解析范围，第二个重复数据删除逻辑。建立共享解析范围可以包括计算机之间的协商，其中谈判转移方言信息。方言信息可以采取规则的形式。该方法还可以包括持久化共享解析范围。

10. 发明授权

US07761687B2 Ultrascalable petaflop parallel supercomputer 失效
标题翻译：超平面petaflop平行超级计算机
公开(公告)号：US07761687B2
公开(公告)日：2010-07-20
申请号：US11768905
申请日：2007-06-26
申请人： Matthias A. Blumrich , Dong Chen , George Chiu , Thomas M. Cipolla , Paul W. Coteus , Alan G. Gara , Mark E. Giampapa , Shawn Hall , Rudolf A. Haring , Philip Heidelberger , Gerard V. Kopcsay , Martin Ohmacht , Valentina Salapura , Krishnan Sugavanam , Todd Takken
发明人： Matthias A. Blumrich , Dong Chen , George Chiu , Thomas M. Cipolla , Paul W. Coteus , Alan G. Gara , Mark E. Giampapa , Shawn Hall , Rudolf A. Haring , Philip Heidelberger , Gerard V. Kopcsay , Martin Ohmacht , Valentina Salapura , Krishnan Sugavanam , Todd Takken
IPC分类号： G06F15/173
CPC分类号： G06F15/17337
摘要： A massively parallel supercomputer of petaOPS-scale includes node architectures based upon System-On-a-Chip technology, where each processing node comprises a single Application Specific Integrated Circuit (ASIC) having up to four processing elements. The ASIC nodes are interconnected by multiple independent networks that optimally maximize the throughput of packet communications between nodes with minimal latency. The multiple networks may include three high-speed networks for parallel algorithm message passing including a Torus, collective network, and a Global Asynchronous network that provides global barrier and notification functions. These multiple independent networks may be collaboratively or independently utilized according to the needs or phases of an algorithm for optimizing algorithm processing performance. The use of a DMA engine is provided to facilitate message passing among the nodes without the expenditure of processing resources at the node.
摘要翻译： petaOPS规模的大规模并行超级计算机包括基于片上系统技术的节点架构，其中每个处理节点包括具有多达四个处理元件的单个专用集成电路（ASIC）。 ASIC节点通过多个独立网络互连，以最小的延迟最大化节点之间的数据包通信的吞吐量。多个网络可以包括用于并行算法消息传递的三个高速网络，包括Torus，集合网络和提供全局障碍和通知功能的全球异步网络。这些多个独立网络可以根据用于优化算法处理性能的算法的需求或阶段来协同或独立地利用。提供DMA引擎的使用以促进节点之间的消息传递，而不需要节点处理资源。

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