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    • 4. 发明申请
    • Airflow Barriers for Efficient Cooling of Memory Modules
    • 用于高效冷却内存模块的气流障碍
    • US20110080700A1
    • 2011-04-07
    • US12572301
    • 2009-10-02
    • Patrick M. BlandVinod KamathJimmy G. Foster, SR.Ivan R. Zapata
    • Patrick M. BlandVinod KamathJimmy G. Foster, SR.Ivan R. Zapata
    • G06F1/20
    • G06F1/20
    • Method and apparatus providing airflow through a chassis including an upstream column of memory modules and a downstream column of memory modules. The airflow is divided into first and second separate airflow streams extending from an upstream end of the upstream column to a downstream end of the downstream column. The first airflow stream is guided into contact with a single memory module operably-installed in the upstream column and to avoid contact with any memory module in the downstream column. The second airflow stream is guided to avoid contact with any memory module in the upstream column and into contact with a single memory module operably-installed in the downstream column. The improved cooling enables the extended use of a single memory module per channel, even though the thermal load on such a memory module is greater. The result is an overall savings of power, since cooling requirements no longer dictate the installation of additional memory modules per channel in order to share and distribute the thermal load.
    • 提供通过包括存储器模块的上游列和存储器模块的下游列的底盘的气流的方法和装置。 气流被分为从上游塔的上游端延伸到下游塔的下游端的第一和第二分开的气流。 第一气流引导与可操作地安装在上游塔中的单个存储器模块接触,并且避免与下游塔中的任何存储器模块接触。 引导第二气流流以避免与上游塔中的任何存储器模块接触并与可操作地安装在下游塔中的单个存储器模块接触。 即使在这样的存储器模块上的热负载较大,改进的冷却也能够每通道扩展使用单个存储器模块。 结果是总体上节省了电力,因为冷却要求不再要求每个通道安装额外的内存模块,以便共享和分配热负载。
    • 5. 发明申请
    • Dynamically Allocating Communication Lanes For A Plurality Of Input/Output ('I/O') Adapter Sockets In A Point-To-Point, Serial I/O Expansion Subsystem Of A Computing System
    • 在计算系统的点对点串行I / O扩展子系统中动态分配多个输入/输出('I / O')适配器插座的通信通道
    • US20090157920A1
    • 2009-06-18
    • US11956026
    • 2007-12-13
    • Jimmy G. Foster, SR.
    • Jimmy G. Foster, SR.
    • G06F13/12
    • G06F13/409
    • Methods, systems, and products are disclosed for dynamically allocating communication lanes for a plurality of sockets in a point-to-point, serial I/O expansion subsystem of a computing system, the expansion subsystem including an switch that supports a maximum number of enabled communication lanes, each socket having a same form factor, each socket connected to the switch using a same predefined number of communication lanes, that include: identifying, during a boot process for the computing system, each of the sockets in which an adapter is installed; determining, for each installed adapter, a maximum link width for that adapter; and enabling, for each of the sockets in which an adapter is installed, a set of communication lanes for communications between the adapter installed in that socket and the expansion subsystem switch in dependence upon the maximum link width for each adapter and the maximum number of enabled communication lanes supported by the switch.
    • 公开了用于为计算系统的点对点串行I / O扩展子系统中的多个套接字动态分配通信通道的方法,系统和产品,该扩展子系统包括支持最大数目的启用的交换机 通信通道,每个插座具有相同的形状因子,每个插座使用相同的预定数量的通信线路连接到交换机,其包括:在计算系统的引导过程期间识别其中安装了适配器的每个插座 ; 为每个安装的适配器确定该适配器的最大链路宽度; 并且对于安装有适配器的每个插座,根据每个适配器的最大链路宽度和启用的最大数量,为安装在该套接字中的适配器和扩展子系统交换机之间的通信提供一组通信通道 交换机支持的通信通道。
    • 6. 发明申请
    • Integrated Circuit Die Stacks With Rotationally Symmetric Vias
    • 具有旋转对称通孔的集成电路模块
    • US20110109381A1
    • 2011-05-12
    • US12616563
    • 2009-11-11
    • Jimmy G. Foster, SR.Kyu-Hyoun Kim
    • Jimmy G. Foster, SR.Kyu-Hyoun Kim
    • H01L25/00H01L25/065H01L21/822
    • H01L23/5384H01L21/822H01L25/0657H01L2224/16H01L2225/06527H01L2225/06541H01L2225/06555
    • An integrated circuit die stack including a first integrated circuit die mounted upon a substrate, the first die including pass-through vias (‘PTVs’) composed of conductive pathways through the first die with no connection to any circuitry on the first die; and a second integrated circuit die, identical to the first die, rotated with respect to the first die and mounted upon the first die, with the PTVs in the first die connecting signal lines from the substrate through the first die to through silicon vias (TSVs') in the second die composed of conductive pathways through the second die connected to electronic circuitry on the second die; with the TSVs and PTVs disposed upon each identical die so that the positions of the TSVs and PTVs on each identical die are rotationally symmetrical with respect to the TSVs and PTVs on the other identical die.
    • 一种集成电路管芯堆叠,其包括安装在衬底上的第一集成电路管芯,所述第一管芯包括由通过所述第一管芯的导电通路组成的通孔(“PTV”),其没有连接到所述第一管芯上的任何电路; 以及第一集成电路管芯,与第一管芯相同,相对于第一管芯旋转并安装在第一管芯上,第一管芯中的PTV将来自衬底的信号线通过第一管芯连接到硅通孔(TSV) ')在由连接到第二管芯上的电子电路的第二管芯的导电通路组成的第二管芯中; 其中TSV和PTV设置在每个相同的管芯上,使得每个相同管芯上的TSV和PTV的位置相对于另一相同管芯上的TSV和PTV旋转对称。