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    • 7. 发明授权
    • Managing bubbles in a fluid-delivery device
    • 管理流体输送装置中的气泡
    • US07093930B2
    • 2006-08-22
    • US10666749
    • 2003-09-18
    • Ozgur YildirimGilbert G. SmithMike Steed
    • Ozgur YildirimGilbert G. SmithMike Steed
    • B41J2/19
    • B41J2/0458B41J2/04581B41J2/04596B41J2/14056B41J2/14145B41J2/17563B41J2002/14403B41J2202/07
    • Methods and systems for managing bubbles in a micro electro mechanical systems device are described. One exemplary system includes a fluid-feed channel configured to supply fluid to a plurality of ejection chambers, individual ejection chambers comprising a resistor configured to eject fluid from the individual ejection chamber. The system further includes a processor configured to cause an individual resistor to be energized at a first intensity sufficient to eject fluid from a respective ejection chamber, the processor further configured to cause the resistor to be energized at a second lower intensity which heats the resistor but does not cause fluid to be ejected from the respective ejection chamber, and wherein the processor can energize, at the second lower intensity level, individual resistors in a pattern designed to detach a bubble from a surface defining a portion of the fluid-feed channel.
    • 描述了用于在微机电系统装置中管理气泡的方法和系统。 一个示例性系统包括被配置为向多个喷射室供应流体的流体供给通道,各个喷射室包括被配置为从各个喷射室喷出流体的电阻器。 该系统还包括处理器,其被配置为使得单个电阻器以足以从相应喷射室排出流体的第一强度通电,所述处理器还被配置为使得电阻器以第二较低强度通电,所述第二较低强度加热所述电阻器但是 不会导致流体从相应的喷射室喷出,并且其中处理器可以以第二较低强度水平激励设计成从限定流体供给通道的一部分的表面分离气泡的图案中的各个电阻器。
    • 8. 发明申请
    • Managing bubbles in a fluid-delivery device
    • 管理流体输送装置中的气泡
    • US20050062816A1
    • 2005-03-24
    • US10666749
    • 2003-09-18
    • Ozgur YildirimGilbert SmithMike Steed
    • Ozgur YildirimGilbert SmithMike Steed
    • B67D7/76B01D19/00B41J2/05B41J2/14B41J2/175B67D7/80B81B1/00B41J2/19
    • B41J2/0458B41J2/04581B41J2/04596B41J2/14056B41J2/14145B41J2/17563B41J2002/14403B41J2202/07
    • Methods and systems for managing bubbles in a micro electro mechanical systems device are described. One exemplary system includes a fluid-feed channel configured to supply fluid to a plurality of ejection chambers, individual ejection chambers comprising a resistor configured to eject fluid from the individual ejection chamber. The system further includes a processor configured to cause an individual resistor to be energized at a first intensity sufficient to eject fluid from a respective ejection chamber, the processor further configured to cause the resistor to be energized at a second lower intensity which heats the resistor but does not cause fluid to be ejected from the respective ejection chamber, and wherein the processor can energize, at the second lower intensity level, individual resistors in a pattern designed to detach a bubble from a surface defining a portion of the fluid-feed channel.
    • 描述了用于在微机电系统装置中管理气泡的方法和系统。 一个示例性系统包括被配置为向多个喷射室供应流体的流体供给通道,各个喷射室包括被配置为从各个喷射室喷出流体的电阻器。 该系统还包括处理器,其被配置为使得单个电阻器以足以从相应喷射室排出流体的第一强度通电,所述处理器还被配置为使得电阻器以第二较低强度通电,所述第二较低强度加热所述电阻器但是 不会导致流体从相应的喷射室喷出,并且其中处理器可以以第二较低强度水平激励设计成从限定流体供给通道的一部分的表面分离气泡的图案中的各个电阻器。