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    • 1. 发明授权
    • Semiconductor device fabrication process
    • 半导体器件制造工艺
    • US4708768A
    • 1987-11-24
    • US24238
    • 1987-03-10
    • Osaomi EnomotoKatsuo Komatsuzaki
    • Osaomi EnomotoKatsuo Komatsuzaki
    • H01L21/76C23C16/04H01L21/316H01L21/32H01L21/762B44C1/22C03C15/00C03C25/06
    • H01L21/76216C23C16/042H01L21/32
    • A semiconductor device fabrication process comprising the following sequential steps:Sequential formation of an oxide layer and first layer of masking material resistant both to oxidation (particularly preventing the action of oxidants, such as water vapors and O.sub.2) and heat, on a principal plane of semiconductor substrate;Patternwise removal of these two layers in overlapping positions to form wells with the above semiconductor substrate exposed at bottom;Selective removal of the above oxide layer only around the wells thus formed to leave recesses;Deposition of the second layer of masking material resistant both oxidation and heat on the exposed surfaces of semiconductor substrate at the bottom of the above wells and in the recesses that are left after the above selective removal of oxide layer;Removal of the above second layer of masking material from the bottom of wells with the masking material left in the above recesses; andSelective oxidation of exposed surfaces of above semiconductor substrate under masking with the first and second layers of masking material that remain.
    • 一种半导体器件制造方法,包括以下顺序步骤:顺序形成氧化物层和掩蔽材料的第一层,其能够抵抗氧化(特别是防止氧化剂如水蒸汽和氧气的作用)和热,在主平面上 半导体衬底; 在重叠位置上以图形方式去除这两层以形成具有暴露在底部的上述半导体衬底的阱; 选择性地去除上述氧化物层,仅在由此形成的孔留下凹槽; 在上述孔的底部和在上述选择性去除氧化物层之后留下的凹槽中,在半导体衬底的暴露表面上沉积第二层掩模材料,以抵抗氧化和加热; 从孔的底部去除上述第二层掩模材料,其中掩蔽材料留在上述凹槽中; 以及在保留的第一和第二掩蔽材料层掩蔽下的上述半导体衬底的暴露表面的选择性氧化。
    • 3. 发明授权
    • Shared data buffer in FeRAM utilizing word line direction segmentation
    • FeRAM中的共享数据缓冲区利用字线方向分割
    • US06873536B2
    • 2005-03-29
    • US10126394
    • 2002-04-19
    • Katsuo Komatsuzaki
    • Katsuo Komatsuzaki
    • G11C11/22
    • G11C11/22
    • A ferro-electric memory device system and method is described for accessing and sensing memory cells of an FeRAM memory array with an open bit line architecture. The memory device permits the sharing of certain memory circuits such as, a data buffer, and a sense amplifier between several segments of an array of FeRAM memory cells associated with a plurality of plate lines and/or word lines of the array. Various combinations of segmented bit lines, segmented plate lines and/or segmented word lines facilitate sharing the memory circuits of the device between the array segments or multiple arrays of memory cells.
    • 描述了一种用于访问和感测具有开放位线架构的FeRAM存储器阵列的存储单元的铁电存储器件系统和方法。 存储器件允许在与阵列的多个板条线和/或字线相关联的FeRAM存储器单元阵列的几个段之间共享某些存储器电路,例如数据缓冲器和读出放大器。 分段位线,分段板线和/或分段字线的各种组合便于在阵列段或多个存储单元阵列之间共享设备的存储器电路。
    • 4. 发明授权
    • Shared sense amplifier for ferro-electric memory cell
    • 用于铁电存储单元的共享读出放大器
    • US06574135B1
    • 2003-06-03
    • US10126844
    • 2002-04-19
    • Katsuo Komatsuzaki
    • Katsuo Komatsuzaki
    • G11C1122
    • G11C11/22G11C7/06G11C7/18G11C2211/4013
    • A ferro-electric memory device system and method is described for accessing and sensing memory cells of an FeRAM memory array with an open bit line architecture. The memory device permits the sharing of certain memory circuits such as, a sense amplifier, a data buffer, and a dummy cell between several segments of an array of FeRAM memory cells associated with a pair of bitlines of the array. Various combinations of segmented bit lines and/or segmented word lines facilitate sharing the memory circuits of the device between the array segments or multiple arrays of memory cells.
    • 描述了一种用于访问和感测具有开放位线架构的FeRAM存储器阵列的存储单元的铁电存储器件系统和方法。 存储器件允许在与阵列的一对位线相关联的FeRAM存储器单元阵列的几个段之间共享某些存储器电路,例如读出放大器,数据缓冲器和虚拟单元。 分段位线和/或分段字线的各种组合便于在阵列段或多个存储单元阵列之间共享器件的存储器电路。
    • 7. 发明授权
    • Matched delay word line strap
    • 匹配延迟字线条
    • US5841688A
    • 1998-11-24
    • US883738
    • 1997-06-27
    • Shunichi SukegawaHugh P. McAdamsTadashi TachibanaKatsuo KomatsuzakiTakeshi Sakai
    • Shunichi SukegawaHugh P. McAdamsTadashi TachibanaKatsuo KomatsuzakiTakeshi Sakai
    • G11C5/06G11C8/14G11C11/408H01L21/8242H01L27/108G11C5/00
    • H01L27/10891G11C11/408G11C5/063G11C8/14H01L27/10897
    • A circuit is designed with a first lower conductor (500) having two ends. One end of the first lower conductor is coupled to a first signal source (386). A first upper conductor (544) has two ends and is spaced apart from the first lower conductor by a distance less than an allowable spacing between adjacent lower conductors. One end of the first upper conductor is coupled to a second signal source (384). A second upper conductor (508) has two ends. One end of the second upper conductor is coupled to another end of the first lower conductor for receiving a signal from the first signal source. A second lower conductor (552) has two ends and is spaced apart from the second upper conductor by a distance less than the allowable spacing between adjacent lower conductors. One end of the second lower conductor is coupled to another end of the first upper conductor for receiving a signal from the second signal source. Since the upper and lower conductors are spaced apart by a distance less than an allowable spacing between adjacent lower conductors, layout area is conserved. Total resistance of conductors connected to each signal source is the same, so signal delay is the same.
    • 电路设计有具有两端的第一下导体(500)。 第一下导体的一端耦合到第一信号源(386)。 第一上导体(544)具有两个端部,并且与第一下导体间隔一个小于相邻下导体之间允许间隔的距离。 第一上导体的一端耦合到第二信号源(384)。 第二上导体(508)具有两端。 第二上导体的一端耦合到第一下导体的另一端,用于接收来自第一信号源的信号。 第二下导体(552)具有两个端部,并且与第二上导体间隔一个小于相邻下导体之间允许间隔的距离。 第二下导体的一端耦合到第一上导体的另一端,用于从第二信号源接收信号。 由于上导体和下导体间隔距离小于相邻下导体之间的允许间距,所以布局面积是保守的。 连接到每个信号源的导体的总电阻是相同的,因此信号延迟是相同的。