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    • 3. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07796426B2
    • 2010-09-14
    • US12090375
    • 2005-10-17
    • Osamu TonomuraNorikatsu TakauraKenzo KurotsuchiNozomu Matsuzaki
    • Osamu TonomuraNorikatsu TakauraKenzo KurotsuchiNozomu Matsuzaki
    • G11C11/00
    • G11C13/0069G11C7/04G11C13/0004G11C2013/009G11C2013/0092G11C2213/79
    • A technique capable of improving speed of a set operation, which controls writing rate in a semiconductor device including a memory cell using a phase-change material. The technique uses means for setting a set-pulse voltage to be applied to the phase-change material to have two steps: the first-step voltage sets a temperature of the phase-change memory to a temperature at which the fastest nucleation is obtained; and the second pulse sets the temperature to a temperature at which the fastest crystal growth is obtained, thereby obtaining solid-phase growth of the phase-change material without melting. Moreover, the technique uses means for controlling the two-step voltage applied to the phase-change memory by a two-step voltage applied to a word line capable of reducing the drain current variation.
    • 一种能够提高设定操作速度的技术,其控制包括使用相变材料的存储单元的半导体器件的写入速度。 该技术使用用于设定要施加到相变材料的设定脉冲电压的装置以具有两个步骤:第一步骤电压将相变存储器的温度设置为获得最快成核的温度; 并且第二脉冲将温度设定为获得最快的晶体生长的温度,从而获得相变材料的固相生长而不熔化。 此外,该技术使用用于通过施加到能够减小漏极电流变化的字线的两级电压来控制施加到相变存储器的两级电压的装置。
    • 5. 发明授权
    • Manufacturing method of semiconductor integrated circuit
    • 半导体集成电路的制造方法
    • US07592272B2
    • 2009-09-22
    • US11692620
    • 2007-03-28
    • Osamu Tonomura
    • Osamu Tonomura
    • H01L21/26
    • H01L21/0228H01L21/02194H01L21/3141H01L21/31604H01L27/10852H01L28/90
    • An object of the present invention is to provide a method of depositing yttrium-stabilized hafnia use for a DRAM capacitor insulating film while controlling the composition at a high accuracy by an atomic layer deposition method. The atomic deposition method is performed by introducing a hafnium compound precursor, introducing a yttrium compound precursor and introducing an oxidant as one cycle. In the atomic deposition method, the addition amount of yttrium into hafnia is controlled accurately by controlling the time of introducing the hafnium compound precursor and the yttrium compound precursor and controlling the replacement ratio of OH groups on a sample surface by each of the precursors.
    • 本发明的目的是提供一种通过原子层沉积方法以高精度控制组合物的方法,其中用于DRAM电容器绝缘膜沉积用于钇稳定的铪的方法。 通过引入铪化合物前体,引入钇化合物前体并将氧化剂引入一个循环来进行原子沉积方法。 在原子沉积方法中,通过控制引入铪化合物前体和钇化合物前体的时间并且通过每种前体控制样品表面上的OH基的置换比,来准确地控制向铪中添加钇的添加量。