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    • 1. 发明授权
    • Adhesive for silicone rubber
    • 硅胶胶
    • US06811650B2
    • 2004-11-02
    • US10044199
    • 2002-01-09
    • Osamu TakumanHideo ShinmiWataru Nishiumi
    • Osamu TakumanHideo ShinmiWataru Nishiumi
    • C09J18304
    • C09J183/04C08K3/26C08K9/04C08K2003/265C08L83/00
    • An adhesive for silicone rubber, comprising at least the following: A 100 parts by weight of an organopolysiloxane having an average of two or more alkenyl groups per molecule; B an organopolysiloxane having an average of two or more silicon bonded hydrogen atoms in each molecule, used in an amount such that the molar ratio of silicon bonded hydrogen atoms in component B to alkenyl groups in component A at which the molar ratio of the silicon bonded hydrogen atoms in this component to the alkenyl groups in component A is from 0.01 to 20 (i.e. from 1:100 to 20:1); C from 5 to 200 parts by weight of calcium carbonate powder with a BET specific surface area of from 5 to 50 m2g; and D a platinum-based catalyst, used in an amount capable of inducing curing in the present composition.
    • 一种用于硅橡胶的粘合剂,至少包括以下物质:每分子平均具有两个或更多个链烯基的有机聚硅氧烷100重量份; B是每个分子中平均具有两个或更多个硅键合氢原子的有机聚硅氧烷,其用量使得组分B中与硅键合的氢原子与组分A中的链烯基的摩尔比,其中硅键合的 该组分中的氢原子与组分A中的链烯基的摩尔比为0.01至20(即1:100至20:1); C 5〜200重量份BET比表面积为5〜50m 2 / g的碳酸钙粉末; 和D为在本发明组合物中能够诱导固化的量的铂基催化剂。
    • 9. 发明授权
    • Thermosetting silicone resin molding composition
    • 热固性硅树脂成型组合物
    • US4144222A
    • 1979-03-13
    • US820024
    • 1977-07-28
    • Hideo ShinmiTsuneo Hanada
    • Hideo ShinmiTsuneo Hanada
    • C08L83/00C08L83/04
    • C08K5/57C08K3/0016C08G77/12C08G77/16C08G77/70
    • An improved thermosetting silicone resin molding composition characterized by consisting essentially of 100 parts by weight of organopolysiloxane resin having organic radical: Si ratio of 1.0:1 to 1.7:1 and containing at least 0.2% by weight of silicon-bonded hydroxyl groups, organohydrogenpolysiloxane containing at least one silicon bonded hydrogen atom in each molecule thereof, said organohydrogenpolysiloxane being in such an amount that the number of the hydrogen atoms per hydroxyl group in said organopolysiloxane is between 0.001 and 0.30, 0.01 to 15 parts by weight of organotin oxide, and 50 to 700 parts by weight of an inorganic filler.
    • 一种改进的热固性硅树脂模塑组合物,其特征在于基本上由100重量份的有机基团硅比率为1.0:1至1.7:1的有机聚硅氧烷树脂组成,并含有至少0.2重量%的与硅键合的羟基,含有有机基聚硅氧烷的有机氢聚硅氧烷含有 每个分子中至少有一个硅键合的氢原子,所述有机氢聚硅氧烷的量使得所述有机聚硅氧烷中每个羟基的氢原子数为0.001至0.30,0.01至15重量份的有机锡氧化物,和50 至700重量份的无机填料。