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    • 1. 发明授权
    • Integrated assist features for epitaxial growth
    • 用于外延生长的集成辅助功能
    • US08722519B2
    • 2014-05-13
    • US13182568
    • 2011-07-14
    • Omar ZiaRuiqi TianEdward O. Travis
    • Omar ZiaRuiqi TianEdward O. Travis
    • H01L27/07
    • H01L21/02595H01L21/02381H01L21/02532H01L21/02639
    • A method for making a semiconductor device is provided which comprises (a) creating a data set (301) which defines a set of tiles for a polysilicon deposition process; (b) deriving a polysilicon deposition mask set (311) from the data set, wherein the polysilicon deposition mask set includes a plurality of polysilicon tiles (303); (c) deriving an epitaxial growth mask set (321) from the data set, wherein the epitaxial growth mask set includes a plurality of epitaxial tiles (305); and (d) using the polysilicon deposition mask set and the epitaxial growth mask set to make a semiconductor device (331); wherein the epitaxial growth mask set is derived from the data set by using at least a portion of the tile pattern defined in the data set for at least a portion of the tile pattern defined in the epitaxial deposition mask set.
    • 提供一种制造半导体器件的方法,其包括(a)创建限定多晶硅沉积工艺的一组瓦片的数据集(301); (b)从所述数据集中导出多晶硅沉积掩模组(311),其中所述多晶硅沉积掩模组包括多个多晶硅瓦(303); (c)从所述数据集中导出外延生长掩模组(321),其中所述外延生长掩模组包括多个外延片(305); 和(d)使用所述多晶硅沉积掩模组和所述外延生长掩模组来制造半导体器件(331); 其中通过使用在外延沉积掩模组中限定的瓦片图案的至少一部分的数据集中定义的瓦片图案的至少一部分,从所述数据集中导出所述外延生长掩模组。
    • 2. 发明申请
    • SEMICONDUCTOR DEVICE HAVING TILES FOR DUAL-TRENCH INTEGRATION AND METHOD THEREFOR
    • 具有双路整合的电路的半导体器件及其方法
    • US20080217714A1
    • 2008-09-11
    • US11683236
    • 2007-03-07
    • Omar ZiaRuiqi Tian
    • Omar ZiaRuiqi Tian
    • H01L29/00H01L21/76
    • H01L21/76229H01L21/76283H01L21/823878H01L21/8249H01L21/84
    • A method for forming a semiconductor device includes providing a semiconductor substrate having a first region and a second region. The first region has one or more first elements and the second region has one or more second elements. The first elements are different from the second elements. A tile location and a first tile surface area for a tile feature on the semiconductor device is defined. An active semiconductor layer is formed over both the first region and the second region of the semiconductor substrate. A first trench is formed in the active semiconductor layer at the tile location using a negative tone mask. The first trench has a first depth and forms at least a portion of the tile feature. A second trench is formed in the active semiconductor layer using a positive tone mask. The second trench has a second depth different than the first depth.
    • 一种形成半导体器件的方法包括提供具有第一区域和第二区域的半导体衬底。 第一区域具有一个或多个第一元件,而第二区域具有一个或多个第二元件。 第一个元素与第二个元素不同。 定义了半导体器件上的瓦片特征的瓦片位置和第一瓦片表面区域。 半导体衬底的第一区域和第二区域都形成有源半导体层。 使用负色调掩模在瓷砖位置的有源半导体层中形成第一沟槽。 第一沟槽具有第一深度并且形成瓷砖特征的至少一部分。 使用正色调掩模在有源半导体层中形成第二沟槽。 第二沟槽具有与第一深度不同的第二深度。
    • 3. 发明授权
    • Semiconductor device having tiles for dual-trench integration and method therefor
    • 具有用于双沟槽集成的瓦片的半导体器件及其方法
    • US07785983B2
    • 2010-08-31
    • US11683236
    • 2007-03-07
    • Omar ZiaRuiqi Tian
    • Omar ZiaRuiqi Tian
    • H01L21/76H01L21/336
    • H01L21/76229H01L21/76283H01L21/823878H01L21/8249H01L21/84
    • A method for forming a semiconductor device includes providing a semiconductor substrate having a first region and a second region. The first region has one or more first elements and the second region has one or more second elements. The first elements are different from the second elements. A tile location and a first tile surface area for a tile feature on the semiconductor device is defined. An active semiconductor layer is formed over both the first region and the second region of the semiconductor substrate. A first trench is formed in the active semiconductor layer at the tile location using a negative tone mask. The first trench has a first depth and forms at least a portion of the tile feature. A second trench is formed in the active semiconductor layer using a positive tone mask. The second trench has a second depth different than the first depth.
    • 一种形成半导体器件的方法包括提供具有第一区域和第二区域的半导体衬底。 第一区域具有一个或多个第一元件,而第二区域具有一个或多个第二元件。 第一个元素与第二个元素不同。 定义了半导体器件上的瓦片特征的瓦片位置和第一瓦片表面区域。 半导体衬底的第一区域和第二区域都形成有源半导体层。 使用负色调掩模在瓷砖位置的有源半导体层中形成第一沟槽。 第一沟槽具有第一深度并且形成瓷砖特征的至少一部分。 使用正色调掩模在有源半导体层中形成第二沟槽。 第二沟槽具有与第一深度不同的第二深度。
    • 4. 发明申请
    • Integrated Assist Features for Epitaxial Growth
    • 外延生长的综合辅助特征
    • US20110269300A1
    • 2011-11-03
    • US13182568
    • 2011-07-14
    • Omar ZiaRuiqi TianEdward O. Travis
    • Omar ZiaRuiqi TianEdward O. Travis
    • H01L21/20G06F17/50
    • H01L21/02595H01L21/02381H01L21/02532H01L21/02639
    • A method for making a semiconductor device is provided which comprises (a) creating a data set (301) which defines a set of tiles for a polysilicon deposition process; (b) deriving a polysilicon deposition mask set (311) from the data set, wherein the polysilicon deposition mask set includes a plurality of polysilicon tiles (303); (c) deriving an epitaxial growth mask set (321) from the data set, wherein the epitaxial growth mask set includes a plurality of epitaxial tiles (305); and (d) using the polysilicon deposition mask set and the epitaxial growth mask set to make a semiconductor device (331); wherein the epitaxial growth mask set is derived from the data set by using at least a portion of the tile pattern defined in the data set for at least a portion of the tile pattern defined in the epitaxial deposition mask set.
    • 提供一种制造半导体器件的方法,其包括(a)创建限定多晶硅沉积工艺的一组瓦片的数据集(301); (b)从所述数据集中导出多晶硅沉积掩模组(311),其中所述多晶硅沉积掩模组包括多个多晶硅瓦(303); (c)从所述数据集中导出外延生长掩模组(321),其中所述外延生长掩模组包括多个外延片(305); 和(d)使用所述多晶硅沉积掩模组和所述外延生长掩模组来制造半导体器件(331); 其中通过使用在外延沉积掩模组中限定的瓦片图案的至少一部分的数据集中定义的瓦片图案的至少一部分,从所述数据集中导出所述外延生长掩模组。
    • 5. 发明授权
    • Integrated assist features for epitaxial growth
    • 用于外延生长的集成辅助功能
    • US08003539B2
    • 2011-08-23
    • US11650253
    • 2007-01-04
    • Omar ZiaRuiqi TianEdward O. Travis
    • Omar ZiaRuiqi TianEdward O. Travis
    • H01L21/311
    • H01L21/02595H01L21/02381H01L21/02532H01L21/02639
    • A method for making a semiconductor device is provided which comprises (a) creating a data set (301) which defines a set of tiles for a polysilicon deposition process; (b) deriving a polysilicon deposition mask set (311) from the data set, wherein the polysilicon deposition mask set includes a plurality of polysilicon tiles (303); (c) deriving an epitaxial growth mask set (321) from the data set, wherein the epitaxial growth mask set includes a plurality of epitaxial tiles (305); and (d) using the polysilicon deposition mask set and the epitaxial growth mask set to make a semiconductor device (331); wherein the epitaxial growth mask set is derived from the data set by using at least a portion of the tile pattern defined in the data set for at least a portion of the tile pattern defined in the epitaxial deposition mask set.
    • 提供一种制造半导体器件的方法,其包括(a)创建限定多晶硅沉积工艺的一组瓦片的数据集(301); (b)从所述数据集中导出多晶硅沉积掩模组(311),其中所述多晶硅沉积掩模组包括多个多晶硅瓦(303); (c)从所述数据集中导出外延生长掩模组(321),其中所述外延生长掩模组包括多个外延片(305); 和(d)使用所述多晶硅沉积掩模组和所述外延生长掩模组来制造半导体器件(331); 其中通过使用在外延沉积掩模组中限定的瓦片图案的至少一部分的数据集中定义的瓦片图案的至少一部分,从所述数据集中导出所述外延生长掩模组。
    • 9. 发明申请
    • Integrated assist features for epitaxial growth
    • 用于外延生长的集成辅助功能
    • US20080164559A1
    • 2008-07-10
    • US11650253
    • 2007-01-04
    • Omar ZiaRuiqi TianEdward O. Travis
    • Omar ZiaRuiqi TianEdward O. Travis
    • H01L21/763H01L29/02
    • H01L21/02595H01L21/02381H01L21/02532H01L21/02639
    • A method for making a semiconductor device is provided which comprises (a) creating a data set (301) which defines a set of tiles for a polysilicon deposition process; (b) deriving a polysilicon deposition mask set (311) from the data set, wherein the polysilicon deposition mask set includes a plurality of polysilicon tiles (303); (c) deriving an epitaxial growth mask set (321) from the data set, wherein the epitaxial growth mask set includes a plurality of epitaxial tiles (305); and (d) using the polysilicon deposition mask set and the epitaxial growth mask set to make a semiconductor device (331); wherein the epitaxial growth mask set is derived from the data set by using at least a portion of the tile pattern defined in the data set for at least a portion of the tile pattern defined in the epitaxial deposition mask set.
    • 提供一种制造半导体器件的方法,其包括(a)创建限定多晶硅沉积工艺的一组瓦片的数据集(301); (b)从所述数据集中导出多晶硅沉积掩模组(311),其中所述多晶硅沉积掩模组包括多个多晶硅瓦(303); (c)从所述数据集中导出外延生长掩模组(321),其中所述外延生长掩模组包括多个外延片(305); 和(d)使用所述多晶硅沉积掩模组和所述外延生长掩模组来制造半导体器件(331); 其中通过使用在外延沉积掩模组中限定的瓦片图案的至少一部分的数据集中定义的瓦片图案的至少一部分,从所述数据集中导出所述外延生长掩模组。