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1. 发明授权

US09452572B2 Transfer molding method and transfer molding apparatus 有权
标题翻译：传递成型法和传递成型设备
公开(公告)号：US09452572B2
公开(公告)日：2016-09-27
申请号：US13762766
申请日：2013-02-08
申请人： OMRON Corporation
发明人： Koichi Takemura , Tomofusa Shibata , Yoshihisa Yamanaka , Kenji Suzuki , Kazutaka Kaneko , Yoshikaga Taguchi , Masayuki Kojima
IPC分类号： B29C33/00 , B29D11/00 , B29C59/02 , B29C35/16
CPC分类号： B29D11/00663 , B29C35/16 , B29C59/02 , B29C2035/1616 , B29C2035/1658
摘要： A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.
摘要翻译：传递模塑方法具有传递模塑步骤，其通过加热第一和第二模具中的至少一个，并且相互面对地设置在第一模具和第二模具之间的树脂薄片上进行传递模塑，以及冷却步骤冷却树脂片。冷却步骤包括冷却树脂片的第一冷却步骤，同时施加的压力保持在小于传送成型步骤中的施加压力值的第一设定值，以及冷却树脂片的第二冷却步骤，同时施加的压力降低到小于第一设定值的第二设定值。

2. 发明授权

US09162405B2 Die structure, transfer molding apparatus, transfer molding method, optical member, area light source device, liquid crystal display device, and mobile device 有权
标题翻译：模具结构，传递成型装置，传递成型方法，光学部件，区域光源装置，液晶显示装置和移动装置
公开(公告)号：US09162405B2
公开(公告)日：2015-10-20
申请号：US13763014
申请日：2013-02-08
申请人： OMRON Corporation
发明人： Koichi Takemura , Tomofusa Shibata , Yoshihisa Yamanaka , Kazutaka Kaneko , Yuzuru Fujie , Naoki Hashimoto , Taichi Suzuki , Masayuki Kojima
IPC分类号： G02F1/1335 , B29D11/00 , B29C35/16 , B29C37/00 , B29C59/02 , B29C33/10
CPC分类号： B29D11/00663 , B29C33/10 , B29C35/16 , B29C37/006 , B29C59/02 , B29C2035/1658
摘要： A transfer molding method includes an insertion step of inserting a resin sheet between a first die and a second die, which are disposed opposite each other, a sandwiching step of sandwiching the resin sheet between the first and second dies while a transfer surface of a transfer member is brought into contact with at least one of surfaces of the resin sheet, and a transfer molding step of heating at least one of the first and second dies to melt at least a surface portion of the resin sheet with which the transfer surface of the transfer member is brought into contact, and exhausting residual air remaining in a recess through a groove portion connected to the recess when a thick portion is formed by the recess formed in the transfer surface.
摘要翻译：传递成型方法包括将树脂片插入相对设置的第一管芯和第二管芯之间的插入步骤，将树脂片夹在第一和第二管芯之间的夹持步骤，同时转印的转印面与树脂片的至少一个表面接触的部件和传递模塑步骤，加热第一和第二模具中的至少一个，以至少使树脂片材的表面部分并且当通过形成在转印表面中的凹部形成厚部时，通过与凹部连接的凹槽部分，残留在凹部中的剩余空气排出。

3. 发明授权

US10093043B2 Mold structure, transfer molding apparatus, and transfer molding method 有权
公开(公告)号：US10093043B2
公开(公告)日：2018-10-09
申请号：US14704276
申请日：2015-05-05
申请人： OMRON Corporation
发明人： Koichi Takemura , Tomofusa Shibata , Yoshinori Ito , Yoshikaga Taguchi
IPC分类号： B29C43/36 , B29C43/52 , B29C59/02 , B29C51/08 , B29C43/02
摘要： A mold structure has a first mold, a second mold relatively connectable to and disconnectable from the first mold, a heater on at least one of the first and second molds, a transfer member on at least one of the first and second molds, that is relatively movable and separable from the at least one of the first and second molds on which the transfer member is disposed, a transfer surface formed on the transfer member that is placed in contact with a resin sheet fed between the first and second molds to perform transfer molding onto the resin sheet, and a moving mechanism that moves the at least one of the first and second molds on which the transfer member is disposed and the transfer member relative to each other.

4. 发明授权

US08632238B2 Surface light source device 有权
标题翻译：表面光源装置
公开(公告)号：US08632238B2
公开(公告)日：2014-01-21
申请号：US13771761
申请日：2013-02-20
申请人： OMRON Corporation
发明人： Gouo Kurata , Koichi Takemura , Tomofusa Shibata , Masayuki Shinohara
IPC分类号： F21V8/00 , G02B6/00
CPC分类号： G02B6/0028 , G02B6/0018 , G02B6/002 , G02B6/0036 , G02B6/0046
摘要： A surface light source device has a point light source disposed opposite a light incident surface of a light guide plate. The light guide plate includes a light introduction part, and a light guide plate body having a thickness smaller than a maximum thickness of the light introduction part. The light introduction part includes an inclined surface inclined from a surface in a portion having a thickness larger than the thickness of the light guide plate body toward an end of the surface of the light guide plate body. The light guide plate body has a light exit pattern for reflecting the light in the light guide plate body to output the light from a light exit surface. In a region close to the point light source of the light guide plate body, the thickness of the light guide plate body increases gradually with distance from the point light source.
摘要翻译：面光源装置具有与导光板的光入射面相对配置的点光源。导光板包括光导入部和厚度小于光导入部的最大厚度的导光板体。光引入部包括从具有比导光板体的厚度大的部分的表面朝向导光板主体的表面的端部的表面倾斜的倾斜面。导光板体具有用于反射导光板体中的光以从光出射面输出光的光出射图案。在靠近导光板体的点光源的区域中，导光板体的厚度随着距离点光源的距离而逐渐增大。

5. 发明申请

US20150343678A1 MOLD STRUCTURE, TRANSFER MOLDING APPARATUS, AND TRANSFER MOLDING METHOD 审中-公开
标题翻译：模具结构，转印成型设备和转印成型方法
公开(公告)号：US20150343678A1
公开(公告)日：2015-12-03
申请号：US14704276
申请日：2015-05-05
申请人： OMRON Corporation
发明人： Koichi Takemura , Tomofusa Shibata , Yoshinori Ito , Yoshikaga Taguchi
IPC分类号： B29C43/36 , B29C59/02 , B29C43/52
CPC分类号： B29C43/36 , B29C43/361 , B29C43/52 , B29C51/082 , B29C51/087 , B29C59/02 , B29C59/026 , B29C2043/025 , B29C2059/023
摘要： A mold structure has a first mold, a second mold relatively connectable to and disconnectable from the first mold, a heater on at least one of the first and second molds, a transfer member on at least one of the first and second molds, that is relatively movable and separable from the at least one of the first and second molds on which the transfer member is disposed, a transfer surface formed on the transfer member that is placed in contact with a resin sheet fed between the first and second molds to perform transfer molding onto the resin sheet, and a moving mechanism that moves the at least one of the first and second molds on which the transfer member is disposed and the transfer member relative to each other.
摘要翻译：模具结构具有第一模具，第二模具，其相对可连接到第一模具并且可与第一模具断开，第一模具和第二模具中的至少一个上的加热器，第一模具和第二模具中的至少一个上的转移构件，即相对移动并且能够与设置有转印部件的第一和第二模具中的至少一个分离，形成在转印部件上的转印面，该转印部件与供给在第一和第二模具之间的树脂片接触，以进行转印模塑到树脂片上，以及移动机构，其使配置有转印部件的第一和第二模具中的至少一个与转印部件相对移动。

6. 发明申请

US20140125917A1 LIGHT GUIDE PLATE PRODUCING METHOD, DIE STRUCTURE, TRANSFER MOLDING APPARATUS, LIGHT GUIDE PLATE, AREA LIGHT SOURCE DEVICE, LIQUID CRYSTAL DISPLAY DEVICE, AND MOBILE DEVICE 有权
标题翻译：光导板生产方法，模具结构，转印模具，光导板，区域光源装置，液晶显示装置和移动装置
公开(公告)号：US20140125917A1
公开(公告)日：2014-05-08
申请号：US13762869
申请日：2013-02-08
申请人： OMRON CORPORATION
发明人： Isao Makuta , Koichi Takemura , Tomofusa Shibata , Yoshihisa Yamanaka , Norikazu Kitamura , Masayuki Shinohara , Kazuhide Hirota , Yoshikaga Taguchi , Masayuki Kojima , Yukihiro Takahashi
IPC分类号： G02F1/1335 , F21V8/00
CPC分类号： G02B6/0011 , B32B38/06 , B32B2309/02 , B32B2309/12 , B32B2457/202 , G02B6/0028 , G02B6/0038 , G02B6/0046 , G02B6/0065
摘要： A method for producing a light guide plate includes forming a light introduction part that introduces light incident through an end face, and forming a light guide plate body that has a thickness less than a maximum thickness of the light introduction part, forming the light guide plate body to be continuously joined to the light introduction part, and forming the light guide plate body so as to cause a light controller to output the incident light to an outside. The light guide plate producing method further includes a conveying step of conveying a resin sheet between a first die and a second die, which are disposed while facing each other, wherein a transfer surface is provided in at least one of surfaces facing each other in the first and second dies.
摘要翻译：导光板的制造方法包括：形成引入通过端面入射的光的光导入部，形成厚度小于所述光导入部的最大厚度的导光板体，形成所述导光板主体被连续地连接到光引入部分，并且形成导光板体，以使光控制器将入射光输出到外部。导光板的制造方法还包括：传送步骤，在第一模具和第二模具之间输送树脂片材，所述第一模具和第二模具彼此相对配置，其中，在所述第一模具和所述第二模具之间的至少一个表面中设置有转印面，第一和第二模具。

7. 发明申请

US20150251341A1 TRANSFER MOLDING METHOD, DIE STRUCTURE, TRANSFER MOLDING DEVICE, AND OPTICAL MEMBER 有权
标题翻译：转印成型方法，模具结构，转印成型装置及光学部件
公开(公告)号：US20150251341A1
公开(公告)日：2015-09-10
申请号：US14440644
申请日：2013-02-08
申请人： OMRON CORPORATION
发明人： Isao Makuta , Koichi Takemura , Tomofusa Shibata , Yoshihisa Yamanaka , Norikazu Kitamura , Masayuki Shinohara , Kazuhide Hirota , Toshikaga Taguchi , Masayuki Kojima , Yukihiro Takahashi
IPC分类号： B29C43/02 , F21V8/00
CPC分类号： B29C43/021 , B29C59/02 , B29C2043/025 , B29C2059/023 , B29L2011/00 , B29L2011/0016 , B44C1/1712 , G02B6/0036 , G02B6/0038 , G02B6/0046 , G02B6/0053 , G02B6/0065 , Y10T428/24479
摘要： A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the first and second dies into contact with a transfer surface and carrying out transfer molding, and a recess site formed on the transfer member near the transfer surface.
摘要翻译：模具结构具有第一模具，与第一模具接触并分离的第二模具，设置在第一模具和第二模具中的至少一个模具中的加热单元，以及设置在第一模具中的至少一个模具以及第二模具，其使提供在第一和第二模具之间的树脂片材与转印面接触并进行传递模塑，以及形成在转印部件附近的转印表面上的凹部。

8. 发明授权

US09116264B2 Light guide plate producing method, die structure, transfer molding apparatus, light guide plate, area light source device, liquid crystal display device, and mobile device 有权
标题翻译：导光板制造方法，模具结构，传递成型装置，导光板，区域光源装置，液晶显示装置和移动装置
公开(公告)号：US09116264B2
公开(公告)日：2015-08-25
申请号：US13762869
申请日：2013-02-08
申请人： OMRON Corporation
发明人： Isao Makuta , Koichi Takemura , Tomofusa Shibata , Yoshihisa Yamanaka , Norikazu Kitamura , Masayuki Shinohara , Kazuhide Hirota , Yoshikaga Taguchi , Masayuki Kojima , Yukihiro Takahashi
IPC分类号： G02F1/1335 , F21V8/00 , B32B38/06
CPC分类号： G02B6/0011 , B32B38/06 , B32B2309/02 , B32B2309/12 , B32B2457/202 , G02B6/0028 , G02B6/0038 , G02B6/0046 , G02B6/0065
摘要： A method for producing a light guide plate includes forming a light introduction part that introduces light incident through an end face, and forming a light guide plate body that has a thickness less than a maximum thickness of the light introduction part, forming the light guide plate body to be continuously joined to the light introduction part, and forming the light guide plate body so as to cause a light controller to output the incident light to an outside. The light guide plate producing method further includes a conveying step of conveying a resin sheet between a first die and a second die, which are disposed while facing each other, wherein a transfer surface is provided in at least one of surfaces facing each other in the first and second dies.
摘要翻译：导光板的制造方法包括：形成引入通过端面入射的光的光导入部，形成厚度小于光导入部的最大厚度的导光板体，形成导光板主体被连续地连接到光引入部分，并且形成导光板体，以使光控制器将入射光输出到外部。导光板的制造方法还包括：传送步骤，在第一模具和第二模具之间输送树脂片材，所述第一模具和第二模具彼此相对配置，其中，在所述第一模具和所述第二模具之间的至少一个表面中设置有转印面，第一和第二模具。

9. 发明申请

US20140124965A1 TRANSFER MOLDING METHOD AND TRANSFER MOLDING APPARATUS 有权
标题翻译：转印成型方法和转印成型设备
公开(公告)号：US20140124965A1
公开(公告)日：2014-05-08
申请号：US13762766
申请日：2013-02-08
申请人： OMRON Corporation
发明人： Koichi Takemura , Tomofusa Shibata , Yoshihisa Yamanaka , Kenji Suzuki , Kazutaka Kaneko , Yoshikaga Taguchi , Masayuki Kojima
IPC分类号： B29D11/00 , B29C59/02
CPC分类号： B29D11/00663 , B29C35/16 , B29C59/02 , B29C2035/1616 , B29C2035/1658
摘要： A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.
摘要翻译：传递模塑方法具有传递模塑步骤，其通过加热第一和第二模具中的至少一个，并且相互面对地设置在第一模具和第二模具之间的树脂薄片上进行传递模塑，以及冷却步骤冷却树脂片。冷却步骤包括冷却树脂片的第一冷却步骤，同时施加的压力保持在小于传送成型步骤中的施加压力值的第一设定值，以及冷却树脂片的第二冷却步骤，同时施加的压力降低到小于第一设定值的第二设定值。

10. 发明授权

US10022897B2 Transfer molding method, die structure, transfer molding device, and optical member 有权
公开(公告)号：US10022897B2
公开(公告)日：2018-07-17
申请号：US14440644
申请日：2013-02-08
申请人： OMRON Corporation
发明人： Isao Makuta , Koichi Takemura , Tomofusa Shibata , Yoshihisa Yamanaka , Norikazu Kitamura , Masayuki Shinohara , Kazuhide Hirota , Toshikaga Taguchi , Masayuki Kojima , Yukihiro Takahashi
IPC分类号： B29C43/02 , B29C59/02 , B44C1/17 , F21V8/00 , B29L11/00
摘要： A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the first and second dies into contact with a transfer surface and carrying out transfer molding, and a recess site formed on the transfer member near the transfer surface.

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