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1. 发明授权

US06844220B2 Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component 有权
标题翻译：多层陶瓷电子部件，电子部件集合体以及多层陶瓷电子部件的制造方法
公开(公告)号：US06844220B2
公开(公告)日：2005-01-18
申请号：US10637632
申请日：2003-08-11
申请人： Norio Sakai , Isao Kato , Mitsuyoshi Nishide
发明人： Norio Sakai , Isao Kato , Mitsuyoshi Nishide
IPC分类号： H01G4/252 , H01L23/04 , H01L23/08 , H01L23/10 , H01L23/498 , H05K1/09 , H05K3/00 , H05K3/34 , H05K3/40 , H01L21/44
CPC分类号： H05K3/403 , H01L23/10 , H01L23/49805 , H01L2924/0002 , H01L2924/15174 , H05K1/092 , H05K3/0052 , H05K3/3405 , H05K3/4061 , H05K2201/09181 , H05K2201/10371 , H01L2924/00
摘要： A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside surface defining the notch. A cover that is mounted to the electronic component body has a leg, with the leg of the cover being positioned inside the notch. By joining the leg to the joining electrode, the cover is secured to the electronic component body. The multilayer ceramic electronic component includes an LGA (land grid array) type external terminal electrode. The multilayer ceramic electronic component makes it possible to mount a cover for covering a mounted component without increasing the planar dimensions of the electronic component and without decreasing an area for mounting a component to be mounted.
摘要翻译：多层陶瓷电子部件包括形成在电子部件主体的侧面的切口形成的电子部件体，在形成凹口的内侧面的部分形成有通过分割接合通孔导体而形成的接合电极。安装到电子部件主体上的盖子具有一个腿，盖的腿位于凹口内。通过将腿连接到接合电极，盖被固定到电子部件主体。多层陶瓷电子部件包括LGA（焊盘格栅阵列）型外部端子电极。多层陶瓷电子部件使得可以安装用于覆盖安装部件的盖而不增加电子部件的平面尺寸，而不会减小用于安装待安装部件的面积。

2. 发明授权

US06639311B2 Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component 有权
标题翻译：多层陶瓷电子部件，电子部件集合体以及多层陶瓷电子部件的制造方法
公开(公告)号：US06639311B2
公开(公告)日：2003-10-28
申请号：US10261452
申请日：2002-10-01
申请人： Norio Sakai , Isao Kato , Mitsuyoshi Nishide
发明人： Norio Sakai , Isao Kato , Mitsuyoshi Nishide
IPC分类号： H01L2312
CPC分类号： H05K3/403 , H01L23/10 , H01L23/49805 , H01L2924/0002 , H01L2924/15174 , H05K1/092 , H05K3/0052 , H05K3/3405 , H05K3/4061 , H05K2201/09181 , H05K2201/10371 , H01L2924/00
摘要： A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside surface defining the notch. A cover that is mounted to the electronic component body has a leg, with the leg of the cover being positioned inside the notch. By joining the leg to the joining electrode, the cover is secured to the electronic component body. The multilayer ceramic electronic component includes an LGA (land grid array) type external terminal electrode. The multilayer ceramic electronic component makes it possible to mount a cover for covering a mounted component without increasing the planar dimensions of the electronic component and without decreasing an area for mounting a component to be mounted.
摘要翻译：多层陶瓷电子部件包括形成在电子部件主体的侧面的切口形成的电子部件体，在形成凹口的内侧面的部分形成有通过分割接合通孔导体而形成的接合电极。安装到电子部件主体上的盖子具有一个腿，盖的腿位于凹口内。通过将腿连接到接合电极，盖被固定到电子部件主体。多层陶瓷电子部件包括LGA（焊盘格栅阵列）型外部端子电极。多层陶瓷电子部件使得可以安装用于覆盖安装部件的盖而不增加电子部件的平面尺寸，而不会减小用于安装待安装部件的面积。

3. 发明授权

US07009114B2 Wiring substrate, method of producing the same, and electronic device using the same 有权
公开(公告)号：US07009114B2
公开(公告)日：2006-03-07
申请号：US09789454
申请日：2001-02-21
申请人： Jun Urakawa , Mitsuyoshi Nishide , Isao Kato , Norio Yoshida , Tomonori Ito
发明人： Jun Urakawa , Mitsuyoshi Nishide , Isao Kato , Norio Yoshida , Tomonori Ito
IPC分类号： H05K1/00
CPC分类号： H01L24/16 , H01L23/49838 , H01L24/81 , H01L2224/10165 , H01L2224/10175 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/81136 , H01L2224/8114 , H01L2224/81191 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01057 , H01L2924/01061 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01084 , H01L2924/01094 , H01L2924/014 , H01L2924/09701 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H05K1/0306 , H05K3/3452 , H05K3/4629 , H05K2201/017 , H05K2201/09909 , Y10T29/49155 , H01L2924/00
摘要： A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.

4. 发明授权

US07701053B2 Electronic component and method for producing the same 有权
标题翻译：电子元件及其制造方法
公开(公告)号：US07701053B2
公开(公告)日：2010-04-20
申请号：US11113090
申请日：2005-04-22
申请人： Yoshihiko Nishizawa , Norio Sakai , Isao Kato
发明人： Yoshihiko Nishizawa , Norio Sakai , Isao Kato
IPC分类号： H01L23/12
CPC分类号： H01L21/56 , H01L23/04 , H01L24/97 , H01L2924/14 , H05K3/284 , H05K2203/1311 , H01L2924/00
摘要： An electronic component has a portion adjacent to a surface of a base to which elements are mounted is immersed into a liquid resin or semi-solid resin such that an element surface of the base to which the elements are mounted is not immersed and in which the resin is then hardened. This causes a gap to be disposed between the hardened resin and the element surface of the base, such that a cover supported by some of the elements is formed.
摘要翻译：电子部件具有与安装有元件的基部的表面相邻的部分浸渍在液体树脂或半固体树脂中，使得安装元件的基部的元件表面不被浸没，其中然后将树脂硬化。这导致在硬化树脂和基体的元件表面之间设置间隙，从而形成由一些元件支撑的盖。

5. 发明授权

US06760227B2 Multilayer ceramic electronic component and manufacturing method thereof 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US06760227B2
公开(公告)日：2004-07-06
申请号：US10372616
申请日：2003-02-24
申请人： Norio Sakai , Isao Kato
发明人： Norio Sakai , Isao Kato
IPC分类号： H05K100
CPC分类号： H05K3/3405 , H01L23/053 , H01L23/10 , H01L23/49805 , H01L24/97 , H01L2224/16 , H01L2224/16225 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19105 , H05K1/0306 , H05K3/0052 , H05K3/403 , H05K3/4061 , H05K3/4629 , H05K5/0091 , H05K2201/09181 , H05K2201/10371 , H01L2924/00
摘要： A multilayer ceramic electronic component includes a laminated ceramic body provided with terminal electrodes on side surfaces thereof and a cover for covering the laminated ceramic body. Ground terminal electrodes are provided in notches provided in opposed side surfaces opposing of the laminated ceramic body, a plurality of terminal electrodes is arranged in parallel in each of notches provided in the other side surfaces opposing each other. These terminal electrodes are formed by dividing terminal via hole conductors. The cover is disposed so as to cover elements mounted on the laminated ceramic body, and foot portions of the cover are disposed in the notches and are bonded to the ground terminal electrodes.
摘要翻译：多层陶瓷电子部件包括在其侧表面上设置有端子电极的层叠陶瓷体和用于覆盖层叠陶瓷体的盖。接地端子电极设置在与层叠陶瓷体相对的相对侧表面中的凹口中，多个端子电极平行设置在彼此相对的另一侧表面中的每个凹口中。这些端子电极通过分割端子通孔导体而形成。盖被设置成覆盖安装在层叠陶瓷体上的元件，并且盖的脚部设置在凹口中并且接合到接地端子电极。

6. 发明授权

US06860006B2 Method for manufacturing a monolithic ceramic electronic component 有权
标题翻译：单片陶瓷电子部件的制造方法
公开(公告)号：US06860006B2
公开(公告)日：2005-03-01
申请号：US10242424
申请日：2002-09-13
申请人： Norio Sakai , Isao Kato , Kazuhiro Isebo
发明人： Norio Sakai , Isao Kato , Kazuhiro Isebo
IPC分类号： H05K3/46 , H01L23/12 , H01L23/498 , H05K1/03 , H05K1/11 , H05K3/40 , H01K3/10
CPC分类号： H01L23/49822 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/73204 , H01L2224/85399 , H01L2924/0102 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15192 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19106 , H05K1/0306 , H05K1/113 , H05K3/4053 , H05K3/4611 , H05K3/4629 , Y10T29/43 , Y10T29/435 , Y10T29/49126 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/20753 , H01L2924/00012
摘要： A monolithic electronic component includes a composite body having a plurality of stacked ceramic layers. The ceramic layers include interconnecting conductors provided in each of the ceramic layers, including first terminals, arranged on a first end surface in the stacking direction of the composite body, for defining connections with an interconnection substrate, and second terminals, arranged on a second end surface opposite of the first end surface of the composite, for defining connections with a mounted component. The first terminals are defined by conductor layers provided on the first end surface and the second terminals are defined by exposed end surfaces of terminal via-hole conductors which extend from the inner portion of the composite to the second end surface. The exposed end surfaces of the terminal via-hole conductors are flat and are on substantially the same plane as the second end surface.
摘要翻译：单片电子部件包括具有多个层叠陶瓷层的复合体。陶瓷层包括设置在每个陶瓷层中的互连导体，包括第一端子，其布置在复合体的层叠方向上的第一端面上，用于限定与互连衬底的连接，以及布置在第二端上的第二端子与复合材料的第一端面相对的表面，用于限定与安装部件的连接。第一端子由设置在第一端面上的导体层限定，第二端子由从复合体的内部延伸到第二端面的端子通孔导体的暴露的端面限定。端子通孔导体的露出端面是平坦的，并且与第二端面基本上在同一平面上。

7. 发明授权

US06403272B1 Circuit-forming charging powder and multilayer wiring board using the same 有权
标题翻译：电路形成充电粉末和使用其的多层布线板
公开(公告)号：US06403272B1
公开(公告)日：2002-06-11
申请号：US09716201
申请日：2000-11-17
申请人： Akihiko Kamada , Isao Kato , Norio Sakai
发明人： Akihiko Kamada , Isao Kato , Norio Sakai
IPC分类号： G03G9093
CPC分类号： H05K3/102 , Y10T428/24802 , Y10T428/24926
摘要： A circuit-forming charging powder allowing circuit patterns to resist being peeled off a printing object when the powder is used for printing a circuit pattern by an electrophotographic method on the object, wherein the circuit-forming charging powder has a conductive metal powder, a charge control agent and an adhesion reinforcing agent combined with a heat-melt resin and a method for producing the circuit-forming charging powder, as well as printed objects and multilayer wiring boards are described.
摘要翻译：一种电路形成充电粉末，其允许电路图案抵抗当通过电子照相方法在该物体上印刷电路图案时将印刷对象剥离，其中所述电路形成充电粉末具有导电金属粉末，电荷描述了与热熔树脂组合的粘合增强剂和电路形成充电粉末的制造方法以及印刷对象和多层布线板。

8. 发明授权

US06815046B2 Method of producing ceramic multilayer substrate 有权
标题翻译：陶瓷多层基板的制造方法
公开(公告)号：US06815046B2
公开(公告)日：2004-11-09
申请号：US10454481
申请日：2003-06-05
申请人： Harufumi Mandai , Norio Sakai , Isao Kato , Atsushi Kumano
发明人： Harufumi Mandai , Norio Sakai , Isao Kato , Atsushi Kumano
IPC分类号： B32B300
CPC分类号： H01L23/49822 , H01L21/4857 , H01L2224/16 , H01L2224/16235 , H01L2924/00014 , H01L2924/01012 , H01L2924/01046 , H01L2924/01078 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/19105 , H05K1/0306 , H05K3/4629 , H05K2201/0195 , Y10T29/49163 , Y10T156/1056 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/2495 , Y10T428/24959 , H01L2224/0401
摘要： There is disclosed a method of producing a ceramic multilayer substrate by laminating a plurality of glass-ceramic green sheets made of a glass-ceramic containing an organic binder and a plasticizer to form a laminate; and firing the laminate; further comprising: applying to or overlaying on the surfaces of the glass-ceramic green sheets inorganic compositions, the sintering temperature of the inorganic compositions being higher than that of the glass-ceramic green sheets; laminating a plurality of the glass-ceramic green sheets having the inorganic compositions applied to or overlaid on the surfaces of the glass-ceramic green sheets respectively, to form a part of the laminate; and laminating a plurality of the glass-ceramic green sheets to form the other part of the laminate.

9. 发明授权

US06432239B1 Method of producing ceramic multilayer substrate 有权
公开(公告)号：US06432239B1
公开(公告)日：2002-08-13
申请号：US09504919
申请日：2000-02-16
申请人： Harufumi Mandai , Norio Sakai , Isao Kato , Atsushi Kumano
发明人： Harufumi Mandai , Norio Sakai , Isao Kato , Atsushi Kumano
IPC分类号： B32B3126
CPC分类号： H01L23/49822 , H01L21/4857 , H01L2224/16 , H01L2224/16235 , H01L2924/00014 , H01L2924/01012 , H01L2924/01046 , H01L2924/01078 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/19105 , H05K1/0306 , H05K3/4629 , H05K2201/0195 , Y10T29/49163 , Y10T156/1056 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/2495 , Y10T428/24959 , H01L2224/0401
摘要： There is disclosed a method of producing a ceramic multilayer substrate by laminating a plurality of glass-ceramic green sheets made of a glass-ceramic containing an organic binder and a plasticizer to form a laminate; and firing the laminate; further comprising: applying to or overlaying on the surfaces of the glass-ceramic green sheets inorganic compositions, the sintering temperature of the inorganic compositions being higher than that of the glass-ceramic green sheets; laminating a plurality of the glass-ceramic green sheets having the inorganic compositions applied to or overlaid on the surfaces of the glass-ceramic green sheets respectively, to form a part of the laminate; and laminating a plurality of the glass-ceramic green sheets to form the other part of the laminate.

10. 发明授权

US6157789A Electrophotographic apparatus 有权
标题翻译：电子照相设备
公开(公告)号：US6157789A
公开(公告)日：2000-12-05
申请号：US271589
申请日：1999-03-18
申请人： Akihiko Kamada , Isao Kato , Norio Sakai
发明人： Akihiko Kamada , Isao Kato , Norio Sakai
IPC分类号： G03G21/00 , G03G15/00 , H05K3/10 , H05K3/12
CPC分类号： H05K3/102 , G03G15/6561 , G03G15/6591 , G03G2215/00523 , G03G2215/00561
摘要： An electrophotographic apparatus including a photosensitive member; a corona charger for charging a surface of the photosensitive member; a circuit-forming/chargeable powder supplying device for supplying circuit-forming/chargeable powder to a latent image pattern on the photosensitive member; a transferring device for transferring the circuit-forming/chargeable powder on the latent image pattern onto a ceramic green sheet; a flash lamp for fixing the circuit-forming/chargeable powder, transferred onto the ceramic green sheet, in order to form a circuit pattern (not shown) on the ceramic green sheet; and a circuit pattern forming position recognizing camera for detecting a circuit pattern forming position on the ceramic green sheet. In the electrophotographic apparatus, laser beams are used to form a predetermined latent image pattern (not shown) on a surface of the photosensitive member. Even when the electrophotographic apparatus is used for forming a circuit pattern on a print material by an electrophotographic method, the problem that a circuit pattern forming position shifts does not occur.
摘要翻译：一种电子照相设备，包括感光构件; 用于对感光构件的表面充电的电晕充电器; 电路形成/可充电粉末供应装置，用于向感光构件上的潜像图案供应电路形成/可充电粉末; 用于将潜像图案上的电路形成/可充电粉末转印到陶瓷生片上的转印装置; 用于固定转移到陶瓷生片上的电路形成/可充电粉末的闪光灯，以在陶瓷生片上形成电路图案（未示出）; 以及电路图案形成位置识别摄像机，用于检测陶瓷生片上的电路图案形成位置。在电子照相设备中，使用激光束在感光构件的表面上形成预定的潜像图案（未示出）。即使当通过电子照相方法将电子照相设备用于在印刷材料上形成电路图案时，也不会发生电路图案形成位置偏移的问题。

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