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1. 发明授权

US6103401A Window for an optical use and a process for the production of the same 失效
标题翻译：用于光学用途的窗口和用于生产光学用途的工艺
公开(公告)号：US6103401A
公开(公告)日：2000-08-15
申请号：US793982
申请日：1997-06-16
申请人： Norio Okada , Shuji Asaka , Tsuneo Urisu , Yoshiyuki Yamamoto , Keiichiro Tanabe , Yoshiaki Kumazawa
发明人： Norio Okada , Shuji Asaka , Tsuneo Urisu , Yoshiyuki Yamamoto , Keiichiro Tanabe , Yoshiaki Kumazawa
IPC分类号： G02B5/00 , B01J3/00 , B32B9/00 , C30B29/04 , G02B1/00 , G02B1/02 , G02B7/00 , B32B3/10 , B05D3/02 , B32B15/04 , C23C16/26
CPC分类号： G02B1/02 , G02B7/007 , Y10T428/12361 , Y10T428/12625 , Y10T428/12993 , Y10T428/24355 , Y10T428/24777
摘要： An object of the invention is to provide a window for an optical use having excellent transmission property over a wide range of from infra-red to vacuum ultraviolet as well as excellent baking resistance and capable of being fitted to an ultra-high vacuum apparatus and a process for the production of the same.This object can be attained by a window for an optical use comprising a diamond as a window material, a flange for a vacuum apparatus, a frame for bonding the diamond to the flange and the specified adhesive material for bonding the frame and diamond, and a process for the production of the window for an optical use comprising a step of preparing a diamond plate, a step of fitting a frame to a flange and bonding the diamond plate to the frame through an adhesive material. The benefits can be enlarged by suitably selecting the shape, material, etc. of the frame.
摘要翻译：本发明的一个目的是提供一种在从红外线到真空紫外线的广泛范围内具有优异的透射性的光学用窗口以及优异的耐烤性，并且能够适用于超高真空装置和生产过程相同。该目的可以通过包括金刚石作为窗口材料的光学用窗口，用于真空装置的凸缘，用于将金刚石结合到凸缘的框架和用于粘结框架和金刚石的指定粘合剂材料，以及用于生产用于光学用途的窗户的方法，包括制备金刚石板的步骤，将框架装配到凸缘并通过粘合材料将金刚石板结合到框架的步骤。可以通过适当地选择框架的形状，材料等来增加效果。

2. 发明授权

US08463089B2 Semiconductor optical modulation device 有权
公开(公告)号：US08463089B2
公开(公告)日：2013-06-11
申请号：US13318638
申请日：2010-05-19
申请人： Norio Okada
发明人： Norio Okada
IPC分类号： G02B6/12
摘要： A temperature control module and a support block are mounted on a metal stem. A dielectric substrate is mounted on a side surface of the support block. A support block is mounted on a cooling surface of the temperature control module. A dielectric substrate is mounted on a side surface of the support block. A semiconductor optical modulation element is mounted on the dielectric substrate. A lead pin and a signal line are connected through a bonding wire. The signal line and a signal conductor are connected through a bonding wire. The signal conductor and the semiconductor optical modulation element are connected through a bonding wire.

3. 外观设计

USD622245S1 Mobile phone 有权
公开(公告)号：USD622245S1
公开(公告)日：2010-08-24
申请号：US29346744
申请日：2009-11-05
申请人： Norio Okada , Jong-Seong Lee , Yusuru Masuda
设计人： Norio Okada , Jong-Seong Lee , Yusuru Masuda

4. 发明授权

US07301244B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07301244B2
公开(公告)日：2007-11-27
申请号：US11153619
申请日：2005-06-16
申请人： Yutaka Tsutsui , Norio Okada
发明人： Yutaka Tsutsui , Norio Okada
IPC分类号： H01L23/48
CPC分类号： H01L24/05 , H01L24/03 , H01L2224/02166 , H01L2224/05082 , H01L2224/05093 , H01L2224/05095 , H01L2224/05096 , H01L2224/05181 , H01L2224/05187 , H01L2224/05567 , H01L2224/05624 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01078 , H01L2924/01082 , H01L2924/04953 , H01L2924/05042 , H01L2924/04941 , H01L2924/00014 , H01L2224/05552
摘要： A semiconductor device should have a structure that allows locating electronic components in a region under a bonding pad. The semiconductor device includes a bonding pad constituting the external connection terminal; a region under the bonding pad including at least two copper layers and a connection via plug, under said bonding pad, disposed so as to connect copper layers that form a pair out of the at least two copper layers; a seal ring constituted of an annular conductor, disposed so as to surround the region under the bonding pad, and to connect a lower one of the copper layers that form said pair to copper layer to form a pair with the lower copper layer; and an interconnect connected to the bonding pad outside the seal ring.
摘要翻译：半导体器件应当具有允许将电子部件定位在焊盘下方的区域中的结构。半导体器件包括构成外部连接端子的接合焊盘; 在所述接合焊盘下方具有包括至少两个铜层和至少两个铜层的接合焊盘下方的区域，所述接合焊盘设置成将形成所述至少两个铜层的铜层连接; 由环状导体构成的密封环，其设置为围绕接合焊盘下方的区域，并且将形成所述一对的铜层的下部一个铜层与铜层连接，与下部铜层形成一对; 以及连接到密封环外的接合焊盘的互连。

5. 外观设计

USD542286S1 Panel for a mobile phone 有权
标题翻译：面板手机
公开(公告)号：USD542286S1
公开(公告)日：2007-05-08
申请号：US29222940
申请日：2005-02-04
申请人： Satoru Taniyama , Norio Okada , Yoshito Ishikawa
设计人： Satoru Taniyama , Norio Okada , Yoshito Ishikawa

6. 外观设计

USD539277S1 Panel for a mobile phone 有权
公开(公告)号：USD539277S1
公开(公告)日：2007-03-27
申请号：US29222939
申请日：2005-02-04
申请人： Norio Okada , Satoru Taniyama , Yoshito Ishikawa
设计人： Norio Okada , Satoru Taniyama , Yoshito Ishikawa

7. 外观设计

USD520980S1 Mobile phone 有权
公开(公告)号：USD520980S1
公开(公告)日：2006-05-16
申请号：US29224251
申请日：2005-02-25
申请人： Satoru Taniyama , Norio Okada , Yoshito Ishikawa
设计人： Satoru Taniyama , Norio Okada , Yoshito Ishikawa

8. 发明授权

US06268279B1 Trench and via formation in insulating films utilizing a patterned etching stopper film 失效
标题翻译：利用图案化蚀刻阻挡膜的绝缘膜中的沟槽和通孔形成
公开(公告)号：US06268279B1
公开(公告)日：2001-07-31
申请号：US09320466
申请日：1999-05-27
申请人： Norio Okada
发明人： Norio Okada
IPC分类号： H01L214763
CPC分类号： H01L21/76829 , H01L21/7681
摘要： A first interlayer insulating film and an etching stopper film are sequentially formed on a semiconductor substrate with a surface area on which first wiring is formed. The etching stopper film is patterned so as to correspond to a pattern of via hole formed on the first interlayer insulating film and a pattern of forming a second wiring. A second interlayer insulating film is formed on the etching stopped film for forming the second wiring, a wiring trench is formed by etching the second interlayer insulating film. Continuously, the via hole is formed by etching the first interlayer insulating film while having the etching stopper film as a photomask. Conductive materials are laid in the via hole and the wiring trench so that the second wiring connected to the first wiring is formed.
摘要翻译：第一层间绝缘膜和蚀刻阻挡膜依次形成在其上形成有第一布线的表面积的半导体基板上。蚀刻停止膜被图案化以对应于形成在第一层间绝缘膜上的通孔的图案和形成第二布线的图案。在用于形成第二布线的蚀刻停止膜上形成第二层间绝缘膜，通过蚀刻第二层间绝缘膜形成布线沟槽。连续地，通过蚀刻第一层间绝缘膜同时具有蚀刻停止膜作为光掩模来形成通孔。导电材料铺设在通孔和布线沟槽中，从而形成连接到第一布线的第二布线。

9. 发明授权

US08859946B2 Light detecting device including a peaking circuit 有权
标题翻译：光检测装置，包括峰值电路
公开(公告)号：US08859946B2
公开(公告)日：2014-10-14
申请号：US13434925
申请日：2012-03-30
申请人： Hiromitsu Itamoto , Norio Okada
发明人： Hiromitsu Itamoto , Norio Okada
IPC分类号： H03F3/08 , H04B10/69
CPC分类号： H04B10/691 , H04B10/693
摘要： An optical detecting device includes a light-detecting element for outputting an electrical signal, a pre-amplifier for amplifying the electrical signal, a signal line connected to an output of the pre-amplifier, and a resistor and a capacitor connected in series between the signal line and GND.
摘要翻译：光检测装置包括用于输出电信号的光检测元件，用于放大电信号的前置放大器，连接到前置放大器的输出的信号线以及串联连接在前置放大器之间的电阻器和电容器信号线和GND。

10. 发明授权

US08547620B2 Light modulation device 有权
标题翻译：调光装置
公开(公告)号：US08547620B2
公开(公告)日：2013-10-01
申请号：US13090290
申请日：2011-04-20
申请人： Norio Okada
发明人： Norio Okada
IPC分类号： G02B26/00 , G02F1/01
CPC分类号： G02F1/0121
摘要： A light modulation device includes: an input terminal into which a modulation signal is input; a light modulation element including an anode connected to the input terminal and a cathode that is grounded; a matching resistor connected in parallel with the light modulation element; a matching capacitor connected to the light modulation element and connected in series to the matching resistor; and a protective resistor connected in parallel with the light modulation element, the matching resistor, and the matching capacitor.
摘要翻译：光调制装置包括：输入端子，输入调制信号; 光调制元件，包括连接到输入端子的阳极和接地的阴极; 与光调制元件并联连接的匹配电阻器; 连接到光调制元件并与匹配电阻器串联连接的匹配电容器; 以及与光调制元件，匹配电阻器和匹配电容器并联连接的保护电阻器。

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