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1. 发明申请

US20050151229A1 Electronic device having wiring substrate and lead frame 有权
标题翻译：具有布线基板和引线框架的电子设备
公开(公告)号：US20050151229A1
公开(公告)日：2005-07-14
申请号：US11034139
申请日：2005-01-13
申请人： Norihisa Imaizumi , Yuuki Sanada , Takeshi Ishikawa
发明人： Norihisa Imaizumi , Yuuki Sanada , Takeshi Ishikawa
IPC分类号： H01L25/00 , H01L23/495 , H01L23/498 , H01L25/065 , H01L25/16 , H01L29/06
CPC分类号： H01L25/0652 , H01L23/49531 , H01L23/49568 , H01L23/49575 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L25/162 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/4911 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H05K1/117 , H05K1/144 , H05K1/145 , H05K3/284 , H05K3/3405 , H05K2201/09845 , H05K2201/1034 , H05K2201/10924 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.
摘要翻译：电子设备包括：第一基板和第二基板; 布置在所述第一和第二基板之间的引线框架，用于在其间进行电连接; 以及分别设置在第一和第二基板上的第一凹槽和第二凹槽。第一和第二沟槽对应于第一和第二基板和引线框架之间的连接部分。引线框架以这样的方式连接到第一和第二基板，使得引线框架的一端通过导电接合材料接合在第一和第二槽中。

2. 发明授权

US07612434B2 Electronic device having wiring substrate and lead frame 失效
标题翻译：具有布线基板和引线框架的电子设备
公开(公告)号：US07612434B2
公开(公告)日：2009-11-03
申请号：US11976503
申请日：2007-10-25
申请人： Norihisa Imaizumi , Yuuki Sanada , Takeshi Ishikawa
发明人： Norihisa Imaizumi , Yuuki Sanada , Takeshi Ishikawa
IPC分类号： H01L23/495 , H01L23/02
CPC分类号： H01L25/0652 , H01L23/49531 , H01L23/49568 , H01L23/49575 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L25/162 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/4911 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H05K1/117 , H05K1/144 , H05K1/145 , H05K3/284 , H05K3/3405 , H05K2201/09845 , H05K2201/1034 , H05K2201/10924 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.
摘要翻译：电子设备包括：第一基板和第二基板; 布置在所述第一和第二基板之间的引线框架，用于在其间进行电连接; 以及分别设置在第一和第二基板上的第一槽和第二槽。第一和第二沟槽对应于第一和第二基板和引线框架之间的连接部分。引线框架以这样的方式连接到第一和第二基板，使得引线框架的一端通过导电接合材料接合在第一和第二槽中。

3. 发明授权

US07304370B2 Electronic device having wiring substrate and lead frame 有权
标题翻译：具有布线基板和引线框架的电子设备
公开(公告)号：US07304370B2
公开(公告)日：2007-12-04
申请号：US11034139
申请日：2005-01-13
申请人： Norihisa Imaizumi , Yuuki Sanada , Takeshi Ishikawa
发明人： Norihisa Imaizumi , Yuuki Sanada , Takeshi Ishikawa
IPC分类号： H01L23/495 , H01L23/02
CPC分类号： H01L25/0652 , H01L23/49531 , H01L23/49568 , H01L23/49575 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L25/162 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/4911 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H05K1/117 , H05K1/144 , H05K1/145 , H05K3/284 , H05K3/3405 , H05K2201/09845 , H05K2201/1034 , H05K2201/10924 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.
摘要翻译：电子设备包括：第一基板和第二基板; 布置在所述第一和第二基板之间的引线框架，用于在其间进行电连接; 以及分别设置在第一和第二基板上的第一凹槽和第二凹槽。第一和第二沟槽对应于第一和第二基板和引线框架之间的连接部分。引线框架以这样的方式连接到第一和第二基板，使得引线框架的一端通过导电接合材料接合在第一和第二槽中。

4. 发明申请

US20080061410A1 Electronic Device having wiring substrate and lead frame 失效
标题翻译：具有布线基板和引线框架的电子设备
公开(公告)号：US20080061410A1
公开(公告)日：2008-03-13
申请号：US11976503
申请日：2007-10-25
申请人： Norihisa Imaizumi , Yuuki Sanada , Takeshi Ishikawa
发明人： Norihisa Imaizumi , Yuuki Sanada , Takeshi Ishikawa
IPC分类号： H01L23/495
CPC分类号： H01L25/0652 , H01L23/49531 , H01L23/49568 , H01L23/49575 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L25/162 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/4911 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H05K1/117 , H05K1/144 , H05K1/145 , H05K3/284 , H05K3/3405 , H05K2201/09845 , H05K2201/1034 , H05K2201/10924 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.
摘要翻译：电子设备包括：第一基板和第二基板; 布置在所述第一和第二基板之间的引线框架，用于在其间进行电连接; 以及分别设置在第一和第二基板上的第一凹槽和第二凹槽。第一和第二沟槽对应于第一和第二基板和引线框架之间的连接部分。引线框架以这样的方式连接到第一和第二基板，使得引线框架的一端通过导电接合材料接合在第一和第二槽中。

5. 发明申请

US20050231925A1 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050231925A1
公开(公告)日：2005-10-20
申请号：US11105548
申请日：2005-04-14
申请人： Yutaka Fukuda , Mitsuhiro Saitou , Toshihiro Nagaya , Kan Kinouchi , Sadahiro Akama , Koji Numazaki , Norihisa Imaizumi , Hiromasa Hayashi , Akihiro Fukatsu , Hirokazu Kasuya , Nobumasa Ueda
发明人： Yutaka Fukuda , Mitsuhiro Saitou , Toshihiro Nagaya , Kan Kinouchi , Sadahiro Akama , Koji Numazaki , Norihisa Imaizumi , Hiromasa Hayashi , Akihiro Fukatsu , Hirokazu Kasuya , Nobumasa Ueda
IPC分类号： H01F7/18 , H01L21/56 , H01L23/36 , H01L23/433 , H01L23/488 , H01L23/495 , H01L25/04 , H05K1/02 , H05K1/03 , H05K1/14 , H05K3/28 , H05K7/02
CPC分类号： H05K1/142 , H01L21/565 , H01L23/4334 , H01L23/4952 , H01L23/49562 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/20752 , H01L2924/20753 , H01L2924/2076 , H01L2924/3011 , H01L2924/351 , H05K1/0263 , H05K1/0306 , H05K3/0061 , H05K3/284 , H05K2201/10924 , H05K2203/049 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.
摘要翻译：电气装置包括：第一电气元件; 第二电气元件，其能够流过大电流，使得在所述第二电气元件中产生热量; 散热器以及设置在散热器的一侧的第一布线板和第二布线板。第二电元件中的大电流大于第一电元件中的大电流。第一布线板和第二布线板彼此分离。第一电气元件设置在第一布线板上，第二电气元件设置在第二布线板上。

6. 发明授权

US08207607B2 Semiconductor device with resin mold 有权
标题翻译：具有树脂模具的半导体装置
公开(公告)号：US08207607B2
公开(公告)日：2012-06-26
申请号：US12314345
申请日：2008-12-09
申请人： Tetsuto Yamagishi , Tohru Nomura , Norihisa Imaizumi , Yasutomi Asai
发明人： Tetsuto Yamagishi , Tohru Nomura , Norihisa Imaizumi , Yasutomi Asai
IPC分类号： H01L23/15 , H01L21/98
CPC分类号： H01L24/83 , H01L21/4807 , H01L23/13 , H01L23/15 , H01L23/315 , H01L23/3677 , H01L23/4334 , H01L23/49506 , H01L23/49531 , H01L23/49822 , H01L23/50 , H01L23/562 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/1461 , H01L2924/15192 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/19015 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface.
摘要翻译：电子设备包括：具有第一和第二表面的基底，其中第一表面与第二表面相对; 安装在所述基板的第一表面上的第一电子元件; 安装在所述基板的第二表面上的第二电子元件; 以及密封第一电子元件和基板的第一表面的树脂模具。树脂模具进一步密封基板的第二表面上的第二电子元件。基板的第二表面具有从树脂模露出的部分。第二电子元件不设置在第二表面的部分上。

7. 发明申请

US20090152714A1 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20090152714A1
公开(公告)日：2009-06-18
申请号：US12314345
申请日：2008-12-09
申请人： Tetsuto Yamagishi , Tohru Nomura , Norihisa Imaizumi , Yasutomi Asai
发明人： Tetsuto Yamagishi , Tohru Nomura , Norihisa Imaizumi , Yasutomi Asai
IPC分类号： H01L23/15 , H01L21/98
CPC分类号： H01L24/83 , H01L21/4807 , H01L23/13 , H01L23/15 , H01L23/315 , H01L23/3677 , H01L23/4334 , H01L23/49506 , H01L23/49531 , H01L23/49822 , H01L23/50 , H01L23/562 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/1461 , H01L2924/15192 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/19015 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface.
摘要翻译：电子设备包括：具有第一和第二表面的基底，其中第一表面与第二表面相对; 安装在所述基板的第一表面上的第一电子元件; 安装在所述基板的第二表面上的第二电子元件; 以及密封第一电子元件和基板的第一表面的树脂模具。树脂模具进一步密封基板的第二表面上的第二电子元件。基板的第二表面具有从树脂模露出的部分。第二电子元件不设置在第二表面的部分上。

8. 外观设计

USD714737S1 Rotary solenoid 有权
标题翻译：旋转电磁铁
公开(公告)号：USD714737S1
公开(公告)日：2014-10-07
申请号：US29423099
申请日：2012-05-29
申请人： Norihisa Imaizumi , Takeshi Kirihara , Osamu Sekiguchi , Takaya Kato , Shoji Oiwa
设计人： Norihisa Imaizumi , Takeshi Kirihara , Osamu Sekiguchi , Takaya Kato , Shoji Oiwa

9. 发明申请

US20130249326A1 ROTARY SOLENOID 有权
标题翻译：旋转电磁阀
公开(公告)号：US20130249326A1
公开(公告)日：2013-09-26
申请号：US13988921
申请日：2012-02-14
申请人： Takeshi Kirihara , Takaya Kato , Osamu Sekiguchi , Norihisa Imaizumi , Shoji Oiwa
发明人： Takeshi Kirihara , Takaya Kato , Osamu Sekiguchi , Norihisa Imaizumi , Shoji Oiwa
IPC分类号： H02K33/16
CPC分类号： H02K33/16 , H01F7/14 , H02K33/00
摘要： A magnetic circuit suitable for a self-held type rotary solenoid while maintaining properties, reducing cost, e.g., a material cost, and making the rotary solenoid smaller in size is provided. The rotary solenoid includes a swing yoke to which two magnets are fixed and a fixed yoke including projection portions at opposite sides thereof. An electromagnetic coil including a major magnetic pole is arranged at a center of the fixed yoke. The rotary solenoid is arranged to define a magnetic circuit extending through one of the magnets, the major magnetic pole, the fixed yoke, the projection portion, and the other magnet at a shortest distance. Therefore, even if a magnet made of a material having a low grade is used, it is possible to maintain sufficient magnetic properties.
摘要翻译：提供一种适用于自保持型旋转螺线管的磁路，同时保持性能，降低成本，例如材料成本，并使旋转螺线管尺寸更小。旋转螺线管包括固定有两个磁体的摆动轭和在其相对侧具有突出部的固定轭。包括主磁极的电磁线圈布置在固定磁轭的中心。旋转螺线管被配置成以最短的距离限定延伸穿过磁体之一，主磁极，固定磁轭，突出部分和另一个磁体的磁路。因此，即使使用由低等级的材料制成的磁体，也可以保持足够的磁特性。

10. 发明授权

US5919317A Soldering flux, soldering paste and soldering method using the same 失效
标题翻译：焊剂，焊膏和焊接方法使用
公开(公告)号：US5919317A
公开(公告)日：1999-07-06
申请号：US568236
申请日：1995-12-06
申请人： Akira Tanahashi , Norihisa Imaizumi , Yuzi Otani , Takashi Nagasaka
发明人： Akira Tanahashi , Norihisa Imaizumi , Yuzi Otani , Takashi Nagasaka
IPC分类号： B23K35/02 , B23K35/36 , B23K35/363
CPC分类号： B23K35/3612 , B23K35/025 , H01L2224/16 , H01L2924/01019 , H01L2924/01046 , H01L2924/01067 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/19105
摘要： Provided are a soldering flux or paste containing an organic substance which has at least two hydroxyl (--OH) groups in a molecule and of which the temperature at which the mass % becomes approximately 0% is not lower than approximately 170.degree. C. and not lower than the solid phase linear temperature of the solder, as measured by thermal gravimetry in which a flow rate of an air or nitrogen (N.sub.2) gas atmosphere is 200 ml/min and a rate of temperature rise is 10.degree. C./min, and a soldering method using the same. The soldering flux or paste of the present invention gives good wettability to a matrix to be bonded in a normal temperature profile and in a non-reductive atmosphere without leaving any residue.
摘要翻译：提供了含有分子中具有至少两个羟基（-OH）基团并且质量％变为约0％的温度不低于约170℃的有机物质的焊剂或糊剂，而不是低于焊料的固相线性温度，通过热重量法测定，其中空气或氮气（N 2）气体气体的流量为200ml / min，升温速率为10℃/ min，和使用其的焊接方法。本发明的助焊剂或糊剂对在正常温度曲线和非还原性气氛中键合的基质赋予良好的润湿性，而不留下任何残留物。

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