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    • 2. 发明授权
    • Method of fabricating semiconductor device including high temperature
heat treatment
    • 制造包括高温热处理的半导体器件的方法
    • US5770495A
    • 1998-06-23
    • US548913
    • 1995-10-26
    • Nolifumi SatoShinji OharaHitoshi MitaniHidetaka NatsumeTakami Hiruma
    • Nolifumi SatoShinji OharaHitoshi MitaniHidetaka NatsumeTakami Hiruma
    • H01L21/28H01L21/285H01L21/3205H01L21/768H01L21/8234H01L21/8247H01L23/52H01L23/522H01L27/088H01L29/786H01L29/788H01L29/792H01L21/283H01L21/8244
    • H01L21/28518
    • The invention provides a method of fabricating a semiconductor device, including the steps of (a) forming an impurity region at a surface of a silicon substrate, (b) depositing an insulative film over the silicon substrate, (c) forming a contact hole through the insulative film to expose the impurity region of the silicon substrate, (d) forming an electrode wiring over the contact hole, the electrode wiring comprising a refractory metal silicide film and a silicon film overlying on the metal silicide film, the metal silicide film overlying the exposed impurity region, (e) depositing a second insulative film over a resultant, (f) depositing a polysilicon film on the second insulative film, (g) patterning the polysilicon film to form an element, and (h) heat-treating a resultant at high temperature in oxidizing atmosphere. The step (h) is to be carried out at any time after the step (f) has been completed. In the method, even if a semiconductor device is heat-treated at high temperature in oxidizing atmosphere, there occurs no voids in the silicon substrate below the refractory metal silicide film. This is because silicon atoms are supplied from the silicon film overlying on the refractory metal silicide film to the metal silicide film. Thus, reliable electrical connection between the electrode wiring and the silicon substrate is ensured.
    • 本发明提供一种制造半导体器件的方法,包括以下步骤:(a)在硅衬底的表面形成杂质区,(b)在硅衬底上沉积绝缘膜,(c)形成接触孔 所述绝缘膜暴露所述硅衬底的杂质区域,(d)在所述接触孔上形成电极布线,所述电极布线包括难熔金属硅化物膜和覆盖在所述金属硅化物膜上的硅膜,所述金属硅化物膜覆盖 暴露的杂质区域,(e)在结果上沉积第二绝缘膜,(f)在第二绝缘膜上沉积多晶硅膜,(g)图案化多晶硅膜以形成元件,和(h)热处理 在高温氧化气氛中产生。 步骤(h)将在步骤(f)完成后的任何时间进行。 在该方法中,即使半导体器件在氧化气氛中在高温下进行热处理,硅基底中的难熔金属硅化物膜下面也不会发生空隙。 这是因为硅原子从覆盖在难熔金属硅化物膜上的硅膜供应到金属硅化物膜。 因此,确保电极布线和硅基板之间的可靠的电连接。
    • 6. 发明授权
    • Apparatus for receiving liquid treatment samples for disposal
    • 用于接收待处理样品的设备
    • US5287733A
    • 1994-02-22
    • US765151
    • 1991-09-23
    • Narihiro OkuHitoshi MitaniHiroaki Takahasi
    • Narihiro OkuHitoshi MitaniHiroaki Takahasi
    • G01N33/49G01N15/10G01N35/00G01N35/10G01N33/48
    • G01N15/10G01N35/00G01N35/1004G01N35/1083
    • A system collects fluid waste within a closed waste vessel where a waste disposal cycle is determined based upon the pressure level within the waste vessel. In the preferred embodiment, a closed liquid waste vessel accepts waste solutions through conduits having valves controlling conduit fluid communication with treatment vessels. A pressure sensor determines the level of pressure within the waste vessel. A pressurizing device reduces the level of pressure within the vessel. When the pressure within the vessel is lowered to a predetermined level, the valve is opened. When the pressure sensed within the liquid waste vessel then rises above an appointed value, the valve is closed, completing the waste collection of a treated sample. This corresponds to the point in time when the treatment vessel is empty, allowing a sudden rush of air into the waste vessel, raising the vessel pressure to ambient and closing the valve. When the pressure in the waste vessel does not rise to the appointed value after the lapse of a preset length of time, a warning signal is provided advising that the system is not working properly.
    • 系统在封闭的废物容器内收集流体废物,其中基于废物容器内的压力水平来确定废物处理循环。 在优选实施例中,封闭的液体废物容器通过具有控制导管与流体与处理容器连通的阀的管道接收废液。 压力传感器确定废液容器内的压力水平。 加压装置降低了容器内的压力水平。 当容器内的压力降低至预定水平时,阀打开。 当在液体废物容器内感测到的压力升高到高于指定值时,阀门关闭,完成处理过的样品的废物收集。 这对应于处理容器为空的时间点,允许空气急剧地进入废物容器,将容器压力升高到环境并关闭阀门。 当经过预设时间后废物容器中的压力不会上升到指定值时,提供警告信号,建议系统不能正常工作。
    • 8. 发明申请
    • Imaging apparatus and imaging method
    • 成像设备及成像方法
    • US20080193047A1
    • 2008-08-14
    • US12012887
    • 2008-02-06
    • Hitoshi Mitani
    • Hitoshi Mitani
    • G06K9/20
    • H04N5/23293H04N5/23296H04N7/0122
    • An imaging apparatus includes imaging means for imaging an image at a first aspect ratio, and image processing means for converting an original image at the first aspect ratio, which is imaged by the imaging means, to a converted image at a second aspect ratio, which is different from the first aspect ratio, by discarding a section of the original image as a discard section, and creating the converted image by, if the selected magnification of the converted image is lower than that of the original image, reducing the size of the original image according to the magnification and then adding a margin to the reduced original image and discarding the discard section according to the magnification as necessary.
    • 一种成像装置包括:成像装置,用于以第一纵横比对图像进行成像;以及图像处理装置,用于将由成像装置成像的第一纵横比的原始图像以第二纵横比转换为转换图像, 通过将原始图像的一部分丢弃为丢弃部分,并且通过转换图像的所选倍率低于原始图像的大小来创建转换后的图像,与第一宽高比不同, 根据放大率原始图像,然后向缩小的原始图像添加余量,并根据需要根据放大倍数丢弃丢弃部分。
    • 9. 发明申请
    • Semiconductor chip
    • 半导体芯片
    • US20080142922A1
    • 2008-06-19
    • US12000514
    • 2007-12-13
    • Hitoshi Mitani
    • Hitoshi Mitani
    • H01L25/00
    • H01L23/5258H01L23/62H01L2924/0002H01L2924/3011H01L2924/00
    • Provided is a semiconductor chip (1) including: at least one fuse element (21); a fuse opening (17) formed above the fuse element (21); and a discharge electrode (31) that is formed below a bottom portion (17a) of the fuse opening (17), and is formed in one of the same layer with the fuse element (21) and the above layer of the fuse element (21). Accordingly, the current caused to flow due to the electrostatic discharge generated at the time of assembling the semiconductor chip can be discharged through the discharge electrode (31). As a result, the current caused to flow due to the electrostatic discharge generated at the time of assembling the semiconductor chip can be prevented from being discharged through the fuse element, whereby a problem in that a functional failure occurs in the semiconductor chip can be solved.
    • 提供一种半导体芯片(1),包括:至少一个熔丝元件(21); 形成在熔丝元件(21)上方的保险丝开口(17); 以及形成在熔断器开口(17)的底部(17a)下方的放电电极(31),并且与熔丝元件(21)和熔丝元件的上述层形成在同一层中的一个层 (21)。 因此,由于在组装半导体芯片时产生的静电放电引起的流过的电流可以通过放电电极(31)放电。 结果,可以防止由于在组装半导体芯片时产生的静电放电而流过的电流通过熔丝元件放电,从而可以解决在半导体芯片中发生功能故障的问题 。