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1. 发明授权

US09882094B2 Light source with inner and outer bodies comprising three different encapsulants 有权
公开(公告)号：US09882094B2
公开(公告)日：2018-01-30
申请号：US13047293
申请日：2011-03-14
申请人： Keat Chuan Ng , Norfidathul Aizar Abdul Karim , Chiau Jin Lee
发明人： Keat Chuan Ng , Norfidathul Aizar Abdul Karim , Chiau Jin Lee
IPC分类号： H01L33/48 , H01L33/60 , H01L33/62 , G09F9/33 , H01L25/075
CPC分类号： H01L33/486 , G09F9/33 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48247 , H01L2933/0033 , H01L2224/48091 , H01L2924/00014
摘要： A light-emitting device having an inner reflective body and an outer non-reflective body is disclosed. The inner reflective body defines a reflector configured to reflect light. In one embodiment, the outer non-reflective body encloses the inner reflective body to minimize reflectivity of the light-emitting device. When assembled into an infotainment display system, the outer non-reflective body may be configured to reduce reflection of ambient light and hence, increase contrast ratio of the display. Reliability performance of the light-emitting device may be improved by using interlocking aperture at the lead frame, interlock structure and interlock geometries defined by the inner reflective body and the outer non-reflective body.

2. 发明申请

US20120235187A1 Light Source with Inner and Outer Bodies 有权
标题翻译：光源与内部和外部
公开(公告)号：US20120235187A1
公开(公告)日：2012-09-20
申请号：US13047293
申请日：2011-03-14
申请人： Keat Chuan Ng , Norfidathul Aizar Abdul Karim , Chiau Jin Lee
发明人： Keat Chuan Ng , Norfidathul Aizar Abdul Karim , Chiau Jin Lee
IPC分类号： H01L33/46 , H01L33/52
CPC分类号： H01L33/486 , G09F9/33 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48247 , H01L2933/0033 , H01L2224/48091 , H01L2924/00014
摘要： A light-emitting device having an inner reflective body and an outer non-reflective body is disclosed. The inner reflective body defines a reflector configured to reflect light. In one embodiment, the outer non-reflective body encloses the inner reflective body to minimize reflectivity of the light-emitting device. When assembled into an infotainment display system, the outer non-reflective body may be configured to reduce reflection of ambient light and hence, increase contrast ratio of the display. Reliability performance of the light-emitting device may be improved by using interlocking aperture at the lead frame, interlock structure and interlock geometries defined by the inner reflective body and the outer non-reflective body.
摘要翻译：公开了一种具有内部反射体和外部非反射体的发光装置。内部反射体限定了反射光的反射器。在一个实施例中，外部非反射体包围内部反射体以最小化发光器件的反射率。当组装成信息娱乐显示系统时，外部非反射体可以被配置为减少环境光的反射，并因此增加显示器的对比度。可以通过在引线框架处使用互锁孔，互锁结构和由内反射体和外部非反射体限定的互锁几何形状来改善发光器件的可靠性。

3. 发明申请

US20120056218A1 LEAD FRAME PACKAGE WITH MULTIPLE BENDS 审中-公开
标题翻译：引导框架包多个弯
公开(公告)号：US20120056218A1
公开(公告)日：2012-03-08
申请号：US12877796
申请日：2010-09-08
申请人： Norfidathul Aizar Abdul Karim , Chiau Jin Lee , Keat Chuan Ng
发明人： Norfidathul Aizar Abdul Karim , Chiau Jin Lee , Keat Chuan Ng
IPC分类号： H01L33/62 , H01L33/08 , H01L33/60
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A lead frame package with multiple bends suitable for a light-emitting device, as well as a non-optical device is disclosed. A light-emitting device incorporating the lead frame package with multiple bends may comprise a light source die, a body and a plurality of leads. A non-optical device incorporating the lead frame package may comprise a die, a body and a plurality of leads. Each of the leads has at least first, second, and third bends defining each of the leads into at least first, second, third and fourth sections. At least the second section, the third section and the second bends of each lead are encapsulated by an encapsulating material forming the body.
摘要翻译：公开了一种具有适用于发光装置的多个弯曲的引线框架封装以及非光学装置。结合具有多个弯曲的引线框架封装的发光器件可以包括光源管芯，主体和多个引线。结合引线框架封装的非光学器件可以包括管芯，主体和多个引线。每个引线具有至少第一，第二和第三弯曲，其将每个引线限定为至少第一，第二，第三和第四部分。每个引线的至少第二部分，第三部分和第二弯曲部都被形成本体的封装材料封装。

4. 发明申请

US20120235287A1 HIGH BRIGHTNESS AND HIGH CONTRAST PLASTIC LEADED CHIP CARRIER LED 有权
标题翻译：高亮度和高对比度塑料引线芯片载体LED
公开(公告)号：US20120235287A1
公开(公告)日：2012-09-20
申请号：US13049643
申请日：2011-03-16
申请人： Norfidathul Aizar Abdul Karim , Chiau Jin Lee , Keat Chuan Ng
发明人： Norfidathul Aizar Abdul Karim , Chiau Jin Lee , Keat Chuan Ng
IPC分类号： H01L23/495
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00 , H01L2924/00014
摘要： A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package provides a light source that is both high contrast and high brightness. Specifically, the PLCC package includes a reflector cup whose surface area is partially inclusive of a lead frame and partially inclusive of a plastic housing that surrounds the lead frame.
摘要翻译：公开了一种塑料引线芯片载体（PLCC）封装。 PLCC封装提供了高对比度和高亮度的光源。具体地，PLCC封装包括反射杯，其表面积部分地包括引线框架并且部分地包括围绕引线框架的塑料外壳。

5. 发明授权

US08405181B2 High brightness and high contrast plastic leaded chip carrier LED 有权
标题翻译：高亮度和高对比度塑料引线芯片载体LED
公开(公告)号：US08405181B2
公开(公告)日：2013-03-26
申请号：US13049643
申请日：2011-03-16
申请人： Norfidathul Aizar Abdul Karim , Chiau Jin Lee , Keat Chuan Ng
发明人： Norfidathul Aizar Abdul Karim , Chiau Jin Lee , Keat Chuan Ng
IPC分类号： H01L31/0203 , H01L29/22
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00 , H01L2924/00014
摘要： A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package provides a light source that is both high contrast and high brightness. Specifically, the PLCC package includes a reflector cup whose surface area is partially inclusive of a lead frame and partially inclusive of a plastic housing that surrounds the lead frame.
摘要翻译：公开了一种塑料引线芯片载体（PLCC）封装。 PLCC封装提供了高对比度和高亮度的光源。具体地，PLCC封装包括反射杯，其表面积部分地包括引线框架并且部分地包括围绕引线框架的塑料外壳。

6. 发明授权

US08120055B2 Light source 有权
标题翻译：光源
公开(公告)号：US08120055B2
公开(公告)日：2012-02-21
申请号：US12426768
申请日：2009-04-20
申请人： Aizar Abdul Karim Norfidathul , Chiau Jin Lee , Keat Chuan Ng
发明人： Aizar Abdul Karim Norfidathul , Chiau Jin Lee , Keat Chuan Ng
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of a light source are disclosed herein. An embodiment of the light source comprises a first terminal and a second terminal. The first terminal comprises a first terminal first portion and a first terminal second portion, wherein at least a portion of the first terminal second portion is located on a first plane, the first terminal second portion comprising at least two contacts separated by a space. A second terminal comprises a second terminal first portion and a second terminal second portion. The second terminal first portion is located proximate the first terminal first portion. The second terminal second portion is located substantially on the first plane and in the space. A light emitter is affixed to the first terminal first portion, the light emitter is electrically connected to the first terminal first portion. A connection exists between the light emitter and the second terminal first portion.
摘要翻译：本文公开了光源的实施例。光源的实施例包括第一端子和第二端子。第一端子包括第一端子第一部分和第一端子第二部分，其中第一端子第二部分的至少一部分位于第一平面上，第一端子第二部分包括由空间分开的至少两个触点。第二端子包括第二端子第一部分和第二端子第二部分。第二端子第一部分位于第一端子第一部分附近。第二端子第二部分基本上位于第一平面上并在该空间中。光发射器固定到第一端子第一部分，光发射器电连接到第一端子第一部分。光发射器和第二端子第一部分之间存在连接。

7. 发明授权

US08115385B2 Multi-chip packaged LED light source 有权
标题翻译：多芯片封装LED光源
公开(公告)号：US08115385B2
公开(公告)日：2012-02-14
申请号：US12871704
申请日：2010-08-30
申请人： Aizar Abdul Karim Norfidathul , Chiau Jin Lee , Kheng Leng Tan , Keat Chuan Ng , Kiam Soon Ong
发明人： Aizar Abdul Karim Norfidathul , Chiau Jin Lee , Kheng Leng Tan , Keat Chuan Ng , Kiam Soon Ong
IPC分类号： H01J1/62
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2224/49113 , H01L2924/01068 , Y10S362/80
摘要： A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.
摘要翻译：公开了一种具有引线框架，主体和多个管芯的光源，每个管芯具有LED。主体包括顶表面，底表面和多个侧表面。引线框架包括第一部分，第二部分和第三部分，第一部分包括具有穿过主体并终止于底部表面上的焊盘的第一突起的管芯安装区域。第二和第三部分各自包括弯曲以形成沿着一个侧表面延伸的第一和第二引线的突起。每个模具结合到模具安装区域，使得第一触点电连接到模具安装区域，并且第二触点连接到第二和第三部分中的一个。第一部分的第一突起提供改善的热传递。

8. 发明申请

US20100320485A1 MULTI-CHIP PACKAGED LED LIGHT SOURCE 有权
标题翻译：多芯片包装LED光源
公开(公告)号：US20100320485A1
公开(公告)日：2010-12-23
申请号：US12871704
申请日：2010-08-30
申请人： Aizar Abdul Karim Norfidathul , Chiau Jin Lee , Kheng Leng Tan , Keat Chuan Ng , Kiam Soon Ong
发明人： Aizar Abdul Karim Norfidathul , Chiau Jin Lee , Kheng Leng Tan , Keat Chuan Ng , Kiam Soon Ong
IPC分类号： H01L33/44 , H01L33/52 , H01L33/64
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2224/49113 , H01L2924/01068 , Y10S362/80
摘要： A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.
摘要翻译：公开了一种具有引线框架，主体和多个管芯的光源，每个管芯具有LED。主体包括顶表面，底表面和多个侧表面。引线框架包括第一部分，第二部分和第三部分，第一部分包括具有穿过主体并终止于底部表面上的焊盘的第一突起的管芯安装区域。第二和第三部分各自包括弯曲以形成沿着一个侧表面延伸的第一和第二引线的突起。每个模具结合到模具安装区域，使得第一触点电连接到模具安装区域，并且第二触点连接到第二和第三部分中的一个。第一部分的第一突起提供改善的热传递。

9. 发明申请

US20070284589A1 Light emitting device having increased light output 审中-公开
标题翻译：具有增加的光输出的发光器件
公开(公告)号：US20070284589A1
公开(公告)日：2007-12-13
申请号：US11449088
申请日：2006-06-08
申请人： Keat Chuan Ng , Wei Liam Loo , Chiau Jin Lee , Yean Chon Yaw
发明人： Keat Chuan Ng , Wei Liam Loo , Chiau Jin Lee , Yean Chon Yaw
IPC分类号： H01L33/00 , H01L31/12 , H01L27/15 , H01L29/26
CPC分类号： F21K9/00 , B29C39/003 , B29C39/10 , B29K2995/0018 , B29L2011/00 , H01L33/54 , H01L33/60
摘要： The light intensity emitted from a package is increased by adjusting a portion of the package encapsulant so that light impacting the side walls of the adjusted encapsulant portion will encounter total internal reflection (TIR) with the reflected light directed toward the top surface of the package. The adjusted portion of the package is positioned so that air can be used as the second (exterior) medium with the critical TIR angle being such that light emitted from a light source (such as from an LED die) will be directed primarily so as to escape the package from the top surface as opposed to being scattered internal to the package. In one embodiment, a lower portion of the encapsulant is surrounded by a casing to inwardly direct light from the light source that impacts the side of the encapsulant with an angle less than the critical TIR angle.
摘要翻译：通过调节封装密封剂的一部分来增加从封装发射的光强度，使得影响调节的密封剂部分的侧壁的光将遇到全反射（TIR），反射光指向封装的顶表面。包装的经调节的部分定位成使得空气可以用作第二（外部）介质，其中临界TIR角度使得从光源（例如来自LED管芯）发射的光将主要被定向为将包装从顶面排出，而不是在包装内部散开。在一个实施例中，密封剂的下部被壳体包围以向内引导来自光源的光，其以小于临界TIR角的角度撞击密封剂的侧面。

10. 发明申请

US20120211785A1 HIGH POWER PLASTIC LEADED CHIP CARRIER WITH INTEGRATED METAL REFLECTOR CUP AND DIRECT HEAT SINK 有权
标题翻译：具有集成金属反射杯和直接散热器的高功率塑料引线芯片
公开(公告)号：US20120211785A1
公开(公告)日：2012-08-23
申请号：US13033520
申请日：2011-02-23
申请人： Keat Chuan Ng , Kheng Leng Tan , Chiau Jin Lee
发明人： Keat Chuan Ng , Kheng Leng Tan , Chiau Jin Lee
IPC分类号： H01L33/60 , H01L33/64
CPC分类号： H01L33/647 , H01L23/49562 , H01L33/486 , H01L33/60 , H01L33/642 , H01L2224/48465 , H01L2933/0075
摘要： A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package includes a lead frame with an integrated reflector cup. The reflector cup is directly connected to a heat sink, which improves the ability of the PLCC package to distribute heat away from the light source that is provided in the reflector cup.
摘要翻译：公开了一种塑料引线芯片载体（PLCC）封装。 PLCC包装包括带有集成反射杯的引线框架。反射杯直接连接到散热器，这提高了PLCC封装将热量从设置在反射杯中的光源分散的能力。

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