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1. 发明授权

US5579981A Reflow apparatus 失效
标题翻译：回流装置
公开(公告)号：US5579981A
公开(公告)日：1996-12-03
申请号：US371776
申请日：1995-01-12
申请人： Nobuya Matsumura , Kazumi Ishimoto , Yoichi Nakamura , Kurayasu Hamasaki , Kimihito Kuwabara , Masahiro Taniguchi
发明人： Nobuya Matsumura , Kazumi Ishimoto , Yoichi Nakamura , Kurayasu Hamasaki , Kimihito Kuwabara , Masahiro Taniguchi
IPC分类号： H05K3/34 , B23K1/008 , B23K1/012
CPC分类号： B23K1/008 , B23K2201/42
摘要： A reflow apparatus includes a reflow furnace. A transfer device holds and transfers printed circuit boards with to-be-reflowed electronic components thereon from an inlet to an outlet of the furnace within the furnace. A plurality of adjusting/circulating sections separate an ambient gas for heating the printed circuit boards into predetermined temperature regions in the furnace in which the ambient gas is circulated in a heated state. A feed port is formed in the furnace to feed the ambient gas into the furnace under pressure. Residence parts each provided between adjacent adjusting/circulating sections regulate the amount of the ambient gas when the ambient gas, after having been sent to and heated in the adjusting/circulating section adjacent to the feed port, is circulated and sequentially moved to the adjusting/circulating sections at the inlet or the outlet and finally flows out through the inlet or outlet into atmosphere. Suction ports are open to the furnace to suck the ambient gas from the inside of the furnace. A flux removing unit is separate from the furnace and removes components of a flux from the ambient gas sucked through the suction ports from the inside of the furnace.
摘要翻译：回流装置包括回流炉。转移装置在炉内从炉内的入口到出口保持并转移其上具有待回流电子部件的印刷电路板。多个调节/循环部分将用于将印刷电路板加热的环境气体分离成炉中的环境气体在加热状态下循环的预定温度区域。在炉中形成进料口，以在压力下将环境气体进料到炉中。每个设置在相邻的调节/循环部分之间的居间部分调节环境气体的量，当环境气体在已经被送入并在与进料口邻近的调节/循环部分中被加热并循环并顺序地移动到调节/ 在入口或出口处循环切片，最后通过入口或出口流入大气。吸入口向炉内开放以从炉内吸入环境气体。助熔剂去除单元与炉分离，并从炉内部从吸入口吸入的环境气体中除去助熔剂的组分。

2. 发明授权

US5693559A Method for printing solder paste 失效
标题翻译：焊膏印刷方法
公开(公告)号：US5693559A
公开(公告)日：1997-12-02
申请号：US631021
申请日：1996-04-12
申请人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
发明人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
IPC分类号： B41F15/08 , B41F15/16 , H05K3/12 , H01L21/48
CPC分类号： B41F15/0818 , B41F15/16 , H05K3/1233 , B41P2215/14 , H05K2201/10151 , H05K2203/0264
摘要： A method for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee, the method includes steps of moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.
摘要翻译：一种使用屏蔽掩模板和刮板将焊膏印刷到印刷电路板的方法，所述方法包括以一个方向移动印刷电路板和屏蔽掩模板之一的步骤：在印刷焊膏之后与另一个分离，并且直到印刷电路板和屏蔽掩模板上移动的一个到达屏幕掩模板和印刷电路板之前的位置的板分离位置是完全的并且当印刷电路板和屏蔽掩模板中的移动的一个到达分隔位置时，将第一移动速度改变到高于第一移动速度的第二移动速度。

3. 发明授权

US06370750B1 Component affixing method and apparatus 失效
标题翻译：组件固定方法和装置
公开(公告)号：US06370750B1
公开(公告)日：2002-04-16
申请号：US09807967
申请日：2001-06-25
申请人： Nobuya Matsumura , Shoji Sato , Akihiro Yamamoto , Yoshifumi Kitayama , Yoichi Nakamura
发明人： Nobuya Matsumura , Shoji Sato , Akihiro Yamamoto , Yoshifumi Kitayama , Yoichi Nakamura
IPC分类号： H01R4300
CPC分类号： H01L21/67132 , Y10T29/49128 , Y10T29/5193 , Y10T156/1734
摘要： The component (2) is first brought into point or line contact with the sheet (3) so as to avoid entrapment of air therebetween. The contact area between the component and the sheet is then gradually spread until the entire bottom surface of the component is adhered to the sheet.
摘要翻译：首先将部件（2）与片材（3）进行点或线接触，以避免在其间夹带空气。然后逐渐扩展部件和片材之间的接触面积，直到部件的整个底部表面粘附到片材上。

4. 发明授权

US5735203A Apparatus for printing solder paste to a printed circuit board and separating a screen mask plate from the printed circuit board 失效
标题翻译：用于将焊膏印刷到印刷电路板并将屏蔽掩模板与印刷电路板分离的装置
公开(公告)号：US5735203A
公开(公告)日：1998-04-07
申请号：US762872
申请日：1996-12-12
申请人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
发明人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
IPC分类号： B41F15/08 , B41F15/16 , H05K3/12 , B41F15/26
CPC分类号： B41F15/0818 , B41F15/16 , H05K3/1233 , B41P2215/14 , H05K2201/10151 , H05K2203/0264
摘要： An apparatus for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee. The apparatus includes a device for moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and a controller for changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.
摘要翻译：一种使用屏蔽掩模板和刮板将焊膏印刷到印刷电路板的设备。该装置包括：在印刷焊膏之后，以与第一移动速度相对应的方向移动印刷电路板和屏蔽掩模板中的一个的装置，并且直到移动的印刷电路板屏幕掩模板到达位于屏幕掩模板之前的位置和印刷电路板完全分离的平板分离位置，以及控制器，用于将第一移动速度改变为高于当移动的印刷电路板和屏幕掩模板之一到达平板分离位置时的第一移动速度。

5. 发明授权

US06647616B1 Bump bonding unit with tray storage and transport apparatuses 失效
标题翻译：具有托盘存储和运输设备的凸块接合单元
公开(公告)号：US06647616B1
公开(公告)日：2003-11-18
申请号：US09446031
申请日：1999-12-15
申请人： Nobuya Matsumura , Hiroyuki Kiyomura , Kenichi Nishino , Kenji Takahashi , Shinji Kanayama
发明人： Nobuya Matsumura , Hiroyuki Kiyomura , Kenichi Nishino , Kenji Takahashi , Shinji Kanayama
IPC分类号： B23P2100
CPC分类号： H01L21/67144 , H01L21/67763 , H01L21/67769 , H05K13/021 , Y10T29/53174 , Y10T29/53313 , Y10T29/53317
摘要： A bump bonding unit is disclosed including a novel storage, transport, and feed system for allocating trays that hold IC chips to various operations of the bump bonding unit. The bump bonding unit includes fist and second tray storage and feed apparatuses that transport trays from empty stacks to full stacks and vice versa, and a transfer head for picking up an IC chip without a bump formed thereon and moving the IC chip to a bump formation location, and for picking up the IC chip with the bump formed thereon and moving the IC chip to a storage location. The bump bonding unit also includes a bump forming unit for forming the bump on the IC chip. Each tray storage apparatus includes a carrier that moves vertically to position a stack of trays, a tray receiver that cooperates with the carrier to support a lowermost tray in the respective stack of trays, and tray holder to support and release a tray supported by the tray receiver.
摘要翻译：公开了一种凸块焊接单元，其包括用于分配托盘的新颖的存储，输送和馈送系统，其将IC芯片保持在凸块接合单元的各种操作。凸块接合单元包括将托盘从空堆栈传送到全堆叠的第一和第二托盘存储和进给装置，反之亦然，以及用于拾取IC芯片而没有形成凸块的转移头，并将IC芯片移动到凸块形成位置，并且用于拾取IC芯片，其上形成有凸块并将IC芯片移动到存储位置。凸块接合单元还包括用于在IC芯片上形成凸块的凸块形成单元。每个托盘存储装置包括一个托架，该托架垂直移动以定位托盘堆叠;托盘托架，其与托架配合以支撑相应堆叠的托盘中的最下托盘;以及托盘托架，用于支撑和释放由托盘支撑的托盘接收器。

6. 发明授权

US06467158B1 Component feeder with load position alignment recognition 失效
标题翻译：组件进料器具有加载位置对准识别
公开(公告)号：US06467158B1
公开(公告)日：2002-10-22
申请号：US09122901
申请日：1998-07-27
申请人： Hiroyuki Kiyomura , Shinji Kanayama , Nobuya Matsumura , Kenji Takahashi , Hiroshi Nasu
发明人： Hiroyuki Kiyomura , Shinji Kanayama , Nobuya Matsumura , Kenji Takahashi , Hiroshi Nasu
IPC分类号： H05K330
CPC分类号： H05K13/0452 , H05K13/0409 , H05K13/041 , Y10S29/044 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A component feeder including a rotary mechanism 31 which is mounted on a turning mechanism 17 for turning the suction nozzle 3 and causes the suction nozzle 3 to rotate around its axis line A, a detector 7 for detecting an amount of displacement the component 2 in rotating direction around the axis line A of the suction nozzle 3, and a controller 32 which controls the suction nozzle 3 such as to rotate at a necessary angle around its axis line A before picking up the component 2 in accordance with displacement of the component 2 in rotating direction around the axis line A.
摘要翻译：一种部件供给器，包括旋转机构31，该旋转机构31安装在转动机构17上，用于转动吸嘴3并使吸嘴3围绕其轴线A旋转;检测器7，用于检测旋转中的部件2的位移量方向围绕吸嘴3的轴线A，以及控制器32，其控制吸嘴3，以便在根据部件2的位移拾取部件2之前围绕其轴线A旋转必要的角度旋转方向围绕轴线A.

7. 发明授权

US6129203A IC discarding apparatus for flip chip mounting facility 失效
标题翻译：用于倒装芯片安装设备的IC废弃设备
公开(公告)号：US6129203A
公开(公告)日：2000-10-10
申请号：US29391
申请日：1998-02-27
申请人： Hiroyuki Kiyomura , Shinji Kanayama , Nobuya Matsumura , Kenichi Nishino , Kenji Takahashi , Naomi Kainou
发明人： Hiroyuki Kiyomura , Shinji Kanayama , Nobuya Matsumura , Kenichi Nishino , Kenji Takahashi , Naomi Kainou
IPC分类号： H01L21/60 , H05K13/04 , H05K13/08 , B65G23/00
CPC分类号： H05K13/0486
摘要： In a flip-chip mounting equipment, there is provided an IC removal device by which ICs (4) which have been recognized to be removed in error in spite of their faultlessness can be removed in a manner such that they are lined up in a row without being scratched on the surface and without incurring electrostatic destruction. Also the device allows an easy visual checking of the ICs with the objective of reuse. The device comprises a glass plate (2) for carrying ICs (4) and a mechanism for rotating this glass plate (2) at fixed angles, whereby if a recognition error occurs, a bonding head (1) with an IC (4) sucked thereby is moved to an IC removal position on the glass plate (2) and is then lowered until the IC (4) contacts the glass plate (2), thereby removing the IC (4). As a result, the ICs (4) can be lined up in a row without being scratched on the surface and without incurring electrostatic destruction, allowing an easy visual checking of the ICs with the objective of reuse.
摘要翻译： PCT No.PCT / JP97 / 02296 Sec。 371日期1998年2月27日 102（e）1998年2月27日PCT 1997年7月2日PCT公布。公开号WO98 / 01901 日期1998年1月15日在一种倒装芯片安装设备中，提供了一种IC去除装置，通过该IC去除装置，尽管它们的无缺陷已被识别出被错误地去除的IC（4）可以以这样的方式被去除连续排列而不会在表面上划伤而不会导致静电破坏。此外，该器件允许容易地目视检查IC的目的是重新使用。该装置包括用于承载IC（4）的玻璃板（2）和用于以固定角度旋转该玻璃板（2）的机构，由此如果发生识别错误，则吸入IC（4）的接合头（1）从而移动到玻璃板（2）上的IC去除位置，然后降低直到IC（4）接触玻璃板（2），从而去除IC（4）。结果，IC（4）可以排成一行而不会在表面上划伤而不会引起静电破坏，从而允许容易地目视检查IC以便重新使用。

8. 发明授权

US5314175A Wire clamping device and wire clamping method 失效
标题翻译：线夹紧装置和线夹紧方法
公开(公告)号：US5314175A
公开(公告)日：1994-05-24
申请号：US869193
申请日：1992-04-13
申请人： Yasuo Izumi , Nobuya Matsumura , Akihiro Yamamoto , Yutaka Makino
发明人： Yasuo Izumi , Nobuya Matsumura , Akihiro Yamamoto , Yutaka Makino
IPC分类号： B25B5/06 , H01L21/00 , H01L41/09 , B25B1/06
CPC分类号： H01L21/67138 , B25B5/06 , H02N2/043
摘要： A wire clamping device which is used to clamp bonding wire in the wire bonding of electronic components comprising: a fixed arm; a movable arm that is positioned so that the end of the fixed arm faces the and of the movable arm with a suitable gap, the movable arm being capable of bending so that the end of the movable arm approaches the end of the fixed arm; and a piezoelectric element that is attached to the movable arm which bends the movable arm by mechanical deformation of the piezoelectric device in order to clamp wire between the end of the movable arm and the end of the fixed arm. A wire clamping method for clamping bonding wire comprising bending a movable arm toward a fixed arm during wire bonding of electronic components by means of mechanical deformation of a piezoelectric element, the deformation being generated by applying a voltage to the piezoelectric element.
摘要翻译：一种用于在电子部件的引线接合中夹紧接合线的线夹装置，包括：固定臂; 可移动臂被定位成使得固定臂的端部具有适当的间隙面向可动臂和可动臂，可动臂能够弯曲，使得可动臂的端部接近固定臂的端部; 以及压电元件，其附接到可动臂，其通过压电装置的机械变形来弯曲可动臂，以便将可动臂的端部与固定臂的端部之间夹紧线。一种用于夹紧接合线的线夹紧方法，包括通过压电元件的机械变形在电子部件的引线接合期间将可动臂朝向固定臂弯曲，所述变形通过向压电元件施加电压而产生。

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