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1. 发明申请

US20150194895A1 SEMICONDUCTOR DEVICE AND AUTOMOBILE 有权
标题翻译：半导体器件和汽车
公开(公告)号：US20150194895A1
公开(公告)日：2015-07-09
申请号：US14426965
申请日：2012-09-13
申请人： Noboru Miyamoto , Fumio Wada
发明人： Noboru Miyamoto , Fumio Wada
IPC分类号： H02M3/335 , B60L11/18 , H01L29/78 , H01L29/16 , H01L29/20
CPC分类号： H02M3/335 , B60L11/18 , H01L29/1602 , H01L29/1608 , H01L29/2003 , H01L29/78 , H02M1/08 , H03K17/08
摘要： A semiconductor device of the present invention includes a transistor having a drain and a source, a voltage being applied between the drain and the source from a high-voltage power supply, a drive device that generates a source voltage and a gate voltage for the transistor from a voltage of a low-voltage power supply lower than that of the high-voltage power supply, and a voltage dividing circuit connected to the low-voltage power supply, wherein when the source voltage is lower than a certain value, an output voltage from the voltage dividing circuit is applied to the source.
摘要翻译：本发明的半导体器件包括具有漏极和源极的晶体管，从高压电源施加在漏极和源极之间的电压，产生晶体管的源极电压和栅极电压的驱动器件从低压电源的电压低于高压电源的电压，以及分压电路，连接到低压电源，其中当电源电压低于某一值时，输出电压从分压电路施加到源极。

2. 发明授权

US09742285B2 Semiconductor device and automobile 有权
公开(公告)号：US09742285B2
公开(公告)日：2017-08-22
申请号：US14426965
申请日：2012-09-13
申请人： Noboru Miyamoto , Fumio Wada
发明人： Noboru Miyamoto , Fumio Wada
IPC分类号： H02M1/08 , B60L11/18 , H01L29/78 , H03K17/08 , H02M3/335 , H01L29/16 , H01L29/20
CPC分类号： H02M3/335 , B60L11/18 , H01L29/1602 , H01L29/1608 , H01L29/2003 , H01L29/78 , H02M1/08 , H03K17/08
摘要： A semiconductor device of the present invention includes a transistor having a drain and a source, a voltage being applied between the drain and the source from a high-voltage power supply, a drive device that generates a source voltage and a gate voltage for the transistor from a voltage of a low-voltage power supply lower than that of the high-voltage power supply, and a voltage dividing circuit connected to the low-voltage power supply, wherein when the source voltage is lower than a certain value, an output voltage from the voltage dividing circuit is applied to the source.

3. 发明授权

US09190397B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US09190397B2
公开(公告)日：2015-11-17
申请号：US14359038
申请日：2012-02-14
申请人： Noboru Miyamoto , Yoshikazu Tsunoda
发明人： Noboru Miyamoto , Yoshikazu Tsunoda
IPC分类号： H01L23/34 , H01L25/16 , H01L23/433 , H01L23/552 , H01L23/31 , H01L23/367 , H01L23/482 , H01L23/495
CPC分类号： H01L25/16 , H01L23/3107 , H01L23/367 , H01L23/4334 , H01L23/4822 , H01L23/49562 , H01L23/552 , H01L2224/48091 , H01L2924/13055 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor element is sandwiched between a lower and upper surface of a cooling body. A connection circuit and a communication device are provided on the lower surface of the cooling body. A drive circuit and a communication device are provided on the upper surface of the cooling body. These components are encapsulated by a resin. The connection circuit generates a control signal in response to a signal from outside. The communication device transmits the control signal. The communication device receives the control signal and supplies the control signal to the drive circuit, which drives the semiconductor element in response to the control signal. The resin electrically insulates the connection circuit and the communication device from the communication device and the drive circuit enabling prevention of breakdown of the connection circuit caused by an application of a high voltage from the drive circuit to the connection circuit.
摘要翻译：半导体元件夹在冷却体的下表面和上表面之间。连接电路和通信装置设置在冷却体的下表面上。驱动电路和通信装置设置在冷却体的上表面上。这些组分被树脂包封。连接电路响应于来自外部的信号产生控制信号。通信装置发送控制信号。通信装置接收控制信号并将控制信号提供给驱动电路，驱动电路响应控制信号驱动半导体元件。该树脂将连接电路和通信装置与通信装置和驱动电路电绝缘，从而能够防止由驱动电路向连接电路施加高电压而引起的连接电路的击穿。

4. 发明申请

US20150179620A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20150179620A1
公开(公告)日：2015-06-25
申请号：US14359038
申请日：2012-02-14
申请人： Noboru Miyamoto , Yoshikazu Tsunoda
发明人： Noboru Miyamoto , Yoshikazu Tsunoda
IPC分类号： H01L25/16 , H01L23/482 , H01L23/552 , H01L23/31 , H01L23/367
CPC分类号： H01L25/16 , H01L23/3107 , H01L23/367 , H01L23/4334 , H01L23/4822 , H01L23/49562 , H01L23/552 , H01L2224/48091 , H01L2924/13055 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor element is sandwiched between a lower and upper surface of a cooling body. A connection circuit and a communication device are provided on the lower surface of the cooling body. A drive circuit and a communication device are provided on the upper surface of the cooling body. These components are encapsulated by a resin. The connection circuit generates a control signal in response to a signal from outside. The communication device transmits the control signal. The communication device receives the control signal and supplies the control signal to the drive circuit, which drives the semiconductor element in response to the control signal. The resin electrically insulates the connection circuit and the communication device from the communication device and the drive circuit enabling prevention of breakdown of the connection circuit caused by an application of a high voltage from the drive circuit to the connection circuit.
摘要翻译：半导体元件夹在冷却体的下表面和上表面之间。连接电路和通信装置设置在冷却体的下表面上。驱动电路和通信装置设置在冷却体的上表面上。这些组分被树脂包封。连接电路响应于来自外部的信号产生控制信号。通信装置发送控制信号。通信装置接收控制信号并将控制信号提供给驱动电路，驱动电路响应控制信号驱动半导体元件。该树脂将连接电路和通信装置与通信装置和驱动电路电绝缘，从而能够防止由驱动电路向连接电路施加高电压而引起的连接电路的击穿。

5. 发明申请

US20150035138A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20150035138A1
公开(公告)日：2015-02-05
申请号：US14385311
申请日：2012-07-05
申请人： Noboru Miyamoto , Naoki Yoshimatsu
发明人： Noboru Miyamoto , Naoki Yoshimatsu
IPC分类号： H01L23/31 , H01L23/34
CPC分类号： H01L23/31 , H01L23/16 , H01L23/3121 , H01L23/3142 , H01L23/34 , H01L23/3735 , H01L23/4334 , H01L23/49562 , H01L23/49575 , H01L25/072 , H01L25/18 , H01L2224/37147 , H01L2224/37599 , H01L2224/40137 , H01L2924/1305 , H01L2924/13055 , H01L2924/00 , H01L2924/00014
摘要： A circuit pattern is bonded to a top surface of a ceramic substrate. A cooling body is bonded to an undersurface of the ceramic substrate. An IGBT and a FWD are provided on the circuit pattern. A coating film covers a junction between the ceramic substrate and the circuit pattern, and a junction between the ceramic substrate and the cooling body. A mold resin seals the ceramic substrate, the circuit pattern, the IGBT, the FWD, the cooling body, and the coating film etc. The ceramic substrate has higher thermal conductivity than the coating film. The coating film has lower hardness than the mold resin and alleviates stress applied from the mold resin to the ceramic substrate. The circuit pattern and the cooling body includes a groove contacting the mold resin without being covered with the coating film.
摘要翻译：电路图案被结合到陶瓷衬底的顶表面。冷却体与陶瓷基板的下表面接合。在电路图案上提供IGBT和FWD。涂膜覆盖陶瓷基板和电路图案之间的接合部以及陶瓷基板与冷却体之间的接合部。模具树脂密封陶瓷基板，电路图案，IGBT，FWD，冷却体和涂膜等。陶瓷基板具有比涂膜更高的热导率。涂膜具有比模制树脂低的硬度，并且减轻了从模制树脂施加到陶瓷基板的应力。电路图案和冷却体包括与模制树脂接触而不被覆膜覆盖的槽。

6. 发明授权

US08754462B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08754462B2
公开(公告)日：2014-06-17
申请号：US13733723
申请日：2013-01-03
申请人： Noboru Miyamoto , Yoshikazu Tsunoda
发明人： Noboru Miyamoto , Yoshikazu Tsunoda
IPC分类号： H01L29/92
CPC分类号： H01L29/92 , H01G4/232 , H01G4/30 , H01G4/33 , H01G4/40 , H01L23/49562 , H01L23/49589 , H01L23/642 , H01L24/32 , H01L25/16 , H01L28/82 , H01L28/86 , H01L28/90 , H01L2924/13055 , H01L2924/00
摘要： A semiconductor device includes a first electrode electrically connected to an upper surface of a semiconductor element, a first internal electrode electrically connected to a lower surface of the semiconductor element and having a plurality of first comb finger portions and a first connection portion connecting the plurality of first comb finger portions together, a second electrode electrically connected to the first internal electrode, a second internal electrode electrically connected to a lower surface of the first electrode and having a plurality of second comb finger portions and a second connection portion connecting the plurality of second comb finger portions together, the plurality of second comb finger portions being interdigitated with but not in contact with the plurality of first comb finger portions, and a lower dielectric filling the space between the plurality of first comb finger portions and the plurality of second comb finger portions.
摘要翻译：半导体器件包括电连接到半导体元件的上表面的第一电极，与半导体元件的下表面电连接并具有多个第一梳状指部的第一内部电极和连接多个电连接到第一内部电极的第二电极，与第一电极的下表面电连接并具有多个第二梳形指状部分的第二内部电极和连接多个第二梳状部分的第二连接部分，梳状指部分在一起，多个第二梳状指部分与多个第一梳状指部分相互交错但不接触;以及下部电介质，其填充多个第一梳状指部分与多个第二梳状指状部分之间的空间部分。

7. 发明授权

US08171264B2 Control sub-unit and control main unit 有权
标题翻译：控制子单元和控制主机
公开(公告)号：US08171264B2
公开(公告)日：2012-05-01
申请号：US11843295
申请日：2007-08-22
申请人： Noboru Miyamoto
发明人： Noboru Miyamoto
IPC分类号： G06F9/40
CPC分类号： G05B19/0421 , G05B2219/2231
摘要： A sub-unit judges whether an instruction received from an external unit is executable. If the instruction is judged to be executable, the sub-unit executes it. If, on the other hand, the instruction is judged to be unexecutable, the sub-unit notifies the external unit of an executable plan.
摘要翻译：子单元判断从外部单元接收到的指令是否可执行。如果判断为可执行指令，则子单元执行。另一方面，如果该指令被判断为不可执行，则该子单元向外部单元通知可执行计划。

8. 发明申请

US20110304037A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20110304037A1
公开(公告)日：2011-12-15
申请号：US13027648
申请日：2011-02-15
申请人： Noboru Miyamoto , Shouji Saito
发明人： Noboru Miyamoto , Shouji Saito
IPC分类号： H01L23/40 , H01L23/48
CPC分类号： H01L23/467 , H01L23/4334 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device includes an enclosure of insulating material having an introduction portion and a discharge portion for an insulating refrigerant and also having an opening, filters mounted on the introduction portion and the discharge portion, respectively, so as to prevent conductive foreign matter from entering the enclosure, a power semiconductor element provided on the outside of the enclosure, a heat sink bonded to the power semiconductor element and extending through the opening and within the enclosure, and an insulator covering the portions of the power semiconductor element and the heat sink lying outside of the enclosure.
摘要翻译：一种半导体器件，包括绝缘材料的外壳，其具有引入部分和用于绝缘制冷剂的排出部分，并且还具有开口，分别安装在引入部分和排出部分上，以防止导电异物进入壳体，设置在外壳的外部的功率半导体元件，结合到功率半导体元件并延伸穿过开口并在外壳内的散热器，以及覆盖位于外部的功率半导体元件和散热器的部分的绝缘体的外壳。

9. 发明授权

US06553297B2 Integrated vehicle control system 有权
标题翻译：综合车辆控制系统
公开(公告)号：US06553297B2
公开(公告)日：2003-04-22
申请号：US09907501
申请日：2001-07-18
申请人： Tsutomu Tashiro , Noboru Miyamoto , Takehito Fujii , Yoshifumi Kato , Toshiki Matsumoto , Tomohiro Kato
发明人： Tsutomu Tashiro , Noboru Miyamoto , Takehito Fujii , Yoshifumi Kato , Toshiki Matsumoto , Tomohiro Kato
IPC分类号： G06F700
CPC分类号： B60W50/06 , B60W10/04 , B60W10/10 , B60W10/18 , B60W30/1819 , B60W2550/308 , B60W2550/402 , B60W2710/0666 , B60W2720/10 , B60W2720/103 , B60W2720/106
摘要： In a vehicular control system, when in the engine ECU, ATECU or brake ECU there occurs important information which requires an urgent response by any of the other ECUs, the important information is transmitted directly to the corresponding ECU through an important information communication line L1 without going through a manager ECU 10. Therefore, a controller in the ECU receives the important information and immediately controls the corresponding component based on the important information.
摘要翻译：在车辆控制系统中，当在发动机ECU中，ATECU或制动ECU出现需要任何其他ECU紧急响应的重要信息时，重要信息通过重要的信息通信线路L1直接发送到对应的ECU，而没有因此，ECU中的控制器接收重要信息，并根据重要信息立即控制相应的组件。

10. 发明申请

US20150108629A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20150108629A1
公开(公告)日：2015-04-23
申请号：US14357669
申请日：2012-02-14
申请人： Noboru Miyamoto , Masao Kikuchi
发明人： Noboru Miyamoto , Masao Kikuchi
IPC分类号： H01L23/473 , H01L23/40 , H01L23/29
CPC分类号： H01L23/473 , H01L23/29 , H01L23/3107 , H01L23/36 , H01L23/40 , H01L23/4334 , H01L23/49562 , H01L2224/48091 , H01L2224/48247 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A cooling fin 9 is joined to a semiconductor element 1. A resin 10 encapsulates the semiconductor element 1. A portion of the cooling fin 9 projects from a lower surface of the resin 10. A cooler 11 has an opening 12. The cooling fin 9 projecting from the resin 10 is inserted in the opening 12 of the cooler 11. The lower surface of the resin 10 and the cooler 11 are joined to each other by a joining material 13 such as an adhesive. Therefore, a reduction in the number of component parts and a reduction in weight can be achieved, and compatibility between the heat conductivity and the strength of joining can be ensured.
摘要翻译：冷却翅片9接合到半导体元件1.树脂10封装半导体元件1.冷却翅片9的一部分从树脂10的下表面突出。冷却器11具有开口12.冷却翅片9 从树脂10突出的部分插入到冷却器11的开口12中。树脂10的下表面和冷却器11通过诸如粘合剂的接合材料13彼此接合。因此，可以实现部件数量的减少和重量的减轻，并且可以确保导热性和接合强度之间的兼容性。

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