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1. 发明授权

US07967216B2 Wireless IC device 有权
标题翻译：无线IC设备
公开(公告)号：US07967216B2
公开(公告)日：2011-06-28
申请号：US12902174
申请日：2010-10-12
申请人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
发明人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
IPC分类号： G06K19/06
CPC分类号： H01Q1/2225 , G06K19/07749 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01Q1/38 , H01Q7/00 , H04B5/0081 , Y10T29/49124
摘要： A wireless IC device prevents deviations of the resonant frequency from the desired value. An antenna coil has an end portion positioned in a connector provided on the negative-most side in the z-axis direction and an end portion positioned in a connector provided on the positive-most side in the z-axis direction. A wireless IC is electrically connected to the end portions. A via hole conductor is provided between the end portion and the wireless IC and penetrates through a plurality of insulator layers. A via hole conductor is provided in the antenna coil such that the length of a current path thereto from the end portion is the shortest among a plurality of via hole conductors. The distance between the via hole conductor and the via hole conductor is larger than the distances between the penetrating via hole conductor and the via hole conductors.
摘要翻译：无线IC器件防止谐振频率偏离期望值。天线线圈具有位于设置在z轴方向最负侧的连接器中的端部和位于设置在z轴方向最正侧的连接器中的端部。无线IC电连接到端部。通孔导体设置在端部与无线IC之间并穿透多个绝缘体层。在天线线圈中设置有通孔导体，使得从端部到其的电流路径的长度在多个通孔导体中是最短的。通孔导体和通孔导体之间的距离大于穿透通孔导体和通孔导体之间的距离。

2. 发明授权

US09705194B2 Antenna module 有权
公开(公告)号：US09705194B2
公开(公告)日：2017-07-11
申请号：US13368358
申请日：2012-02-08
申请人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
发明人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
IPC分类号： H01Q9/04
CPC分类号： H01Q9/0407
摘要： In an antenna module, a main portion includes a plurality of insulating sheets made of a flexible material and laminated on each other. An antenna configured to transmit/receive a high-frequency signal is disposed in the main portion. A connection portion is disposed in the main portion and is connected to an electronic device that inputs/outputs the high-frequency signal. A signal transmission line is disposed in the main portion and has a strip line structure or a microstrip line structure to transmit the high-frequency signal. An impedance matching circuit is disposed in the main portion and between the antenna and end of a signal transmission line facing in a negative x direction. An impedance matching circuit is disposed in the main portion and between the connection portion and an end of the signal transmission line facing in a positive x direction.

3. 发明授权

US08592687B2 Signal line and circuit substrate 有权
公开(公告)号：US08592687B2
公开(公告)日：2013-11-26
申请号：US13343740
申请日：2012-01-05
申请人： Noboru Kato , Jun Sasaki , Satoshi Ishino
发明人： Noboru Kato , Jun Sasaki , Satoshi Ishino
IPC分类号： H05K1/02
CPC分类号： H05K1/0298 , H01P3/081 , H01P3/088 , H05K1/0219 , H05K1/0225 , H05K1/028 , H05K2201/0715 , H05K2201/09618
摘要： A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction.

4. 发明授权

US08047445B2 Wireless IC device and method of manufacturing the same 有权
标题翻译：无线IC器件及其制造方法
公开(公告)号：US08047445B2
公开(公告)日：2011-11-01
申请号：US12940103
申请日：2010-11-05
申请人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
发明人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
IPC分类号： G06K19/06
CPC分类号： H01Q1/2225 , G06K19/07749 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01Q1/38 , H01Q7/00 , H04B5/0081 , Y10T29/49124
摘要： A wireless IC device includes a plurality of insulating sheets that are stacked on top of one another. Coil electrodes are arranged so as to sandwich the insulating sheets therebetween and define an antenna coil by being connected to one another. The coil electrodes are superposed with one another and thereby define a single ring when viewed in plan from a z-axis direction.
摘要翻译：无线IC器件包括堆叠在彼此顶部的多个绝缘片。线圈电极被布置成将绝缘片夹在其间并通过彼此连接来限定天线线圈。线圈电极彼此叠置，从而在从z轴方向的平面图中观察时限定单个环。

5. 发明授权

US08692125B2 Multilayer substrate 有权
标题翻译：多层基板
公开(公告)号：US08692125B2
公开(公告)日：2014-04-08
申请号：US13369363
申请日：2012-02-09
申请人： Noboru Kato , Jun Sasaki , Satoshi Ishino
发明人： Noboru Kato , Jun Sasaki , Satoshi Ishino
IPC分类号： H05K1/00
CPC分类号： H05K1/0281 , H05K1/024 , H05K1/028 , H05K1/0298 , H05K1/032 , H05K1/09 , H05K2201/0141 , H05K2201/057 , H05K2201/0715 , H05K2201/09018 , H05K2201/09409
摘要： A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.
摘要翻译：保持弯曲状态而不引起电特性波动的多层基板包括：主体，其包括要堆叠并由柔性材料制成的多个绝缘片。信号线在主体中延伸。接地导体相对于主体中的信号线在z轴方向的正方向侧设置，并且在从z轴方向看的俯视图中与信号线重叠。接地导体相对于主体中的信号线在z轴方向的负方向侧设置，并且在从z轴方向观察的俯视图中与信号线重叠。主体弯曲的状态使得信号线定义为电弧，由接地导体的塑性变形保持。

6. 发明授权

US08723753B2 Antenna device and communication terminal apparatus 有权
标题翻译：天线装置和通信终端装置
公开(公告)号：US08723753B2
公开(公告)日：2014-05-13
申请号：US13286296
申请日：2011-11-01
申请人： Noboru Kato , Satoshi Ishino , Kenichi Ishizuka , Noriyuki Ueki
发明人： Noboru Kato , Satoshi Ishino , Kenichi Ishizuka , Noriyuki Ueki
IPC分类号： H01Q21/00
CPC分类号： H01Q1/243 , H01P1/20 , H01Q21/28
摘要： An antenna device includes a first antenna element that resonates with a first resonant frequency, a second antenna element that resonates with a second resonant frequency, a first frequency stabilizing circuit connected to a feeding end of the first antenna element, and a second frequency stabilizing circuit connected to a feeding end of the second antenna element. The first antenna element and the second antenna element can be arranged along two sides of a case of a communication terminal apparatus, for example.
摘要翻译：天线装置包括与第一谐振频率谐振的第一天线元件，与第二谐振频率谐振的第二天线元件，连接到第一天线元件的馈电端的第一频率稳定电路和第二频率稳定电路连接到第二天线元件的馈电端。例如，第一天线元件和第二天线元件可以布置在通信终端设备的壳体的两侧。

7. 发明授权

US08360325B2 Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device 有权
标题翻译：无线IC器件，电子设备及调整无线IC器件谐振频率的方法
公开(公告)号：US08360325B2
公开(公告)日：2013-01-29
申请号：US12861945
申请日：2010-08-24
申请人： Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura , Koji Shiroki , Yuya Dokai
发明人： Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura , Koji Shiroki , Yuya Dokai
IPC分类号： G06K19/06 , G06K19/00 , H01Q1/38 , H01Q9/28
CPC分类号： H01Q9/40 , H01L2224/16225 , H01L2224/73204 , H01Q1/2225 , H01Q1/38 , H01Q7/00 , H01Q9/285 , H05K1/16 , Y10T29/49016
摘要： A wireless IC device and an electronic apparatus are obtained, which can achieve miniaturization and improve the gain of a radiator plate (electrode) without providing a dedicated antenna. A wireless IC device is provided, in which a loop electrode is provided in a ground electrode provided on a printed wiring circuit board, and in which a wireless IC chip that processes a transmission/reception signal or an electromagnetic coupling module is coupled to the loop electrode. The ground electrode is coupled to the wireless IC chip or the electromagnetic coupling module via the loop electrode, and transmits or receives a high-frequency signal. The ground electrode is formed with a slit for adjusting a resonant frequency thereof.
摘要翻译：获得无线IC器件和电子设备，其可以在不提供专用天线的情况下实现小型化并且提高散热器板（电极）的增益。提供了一种无线IC器件，其中在设置在印刷布线电路板上的接地电极中设置环形电极，并且其中处理发送/接收信号的无线IC芯片或电磁耦合模块耦合到环路电极。接地电极通过环形电极耦合到无线IC芯片或电磁耦合模块，并且发送或接收高频信号。接地电极形成有用于调节其谐振频率的狭缝。

8. 发明授权

US08078106B2 Wireless IC device and component for wireless IC device 有权
标题翻译：无线IC器件及无线IC器件组件
公开(公告)号：US08078106B2
公开(公告)日：2011-12-13
申请号：US12543553
申请日：2009-08-19
申请人： Yuya Dokai , Noboru Kato , Satoshi Ishino
发明人： Yuya Dokai , Noboru Kato , Satoshi Ishino
IPC分类号： H04B7/00 , H04B1/16
CPC分类号： H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
摘要： A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
摘要翻译：无线IC器件包括无线IC芯片，安装有无线IC芯片的电源电路板，并且其中设置有电源电路，电源电路包括具有预定谐振频率的谐振电路，以及辐射图案，其粘附到电源电路板的下侧，用于辐射从电源电路提供的传输信号，并且用于接收接收信号以将其提供给电源电路。谐振电路是包括电感器件和电容器件的LC谐振电路。电源电路板是多层刚性板或单层刚性板，无线IC芯片和辐射图之间通过直流连接，磁耦合或电容耦合连接。

9. 发明授权

US07518558B2 Wireless IC device 有权
标题翻译：无线IC设备
公开(公告)号：US07518558B2
公开(公告)日：2009-04-14
申请号：US12042399
申请日：2008-03-05
申请人： Noboru Kato , Satoshi Ishino
发明人： Noboru Kato , Satoshi Ishino
IPC分类号： H01Q1/38 , H01Q9/28 , G08B13/14
CPC分类号： H01Q9/285 , G06K19/07749 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01Q1/2225 , H01Q1/38 , H01Q1/50
摘要： A wireless IC device includes a flexible sheet provided with a wireless IC chip and radiation plates. The wireless IC chip is connected by an Au bump to a feeder circuit which is located on the sheet and which has a predetermined resonant frequency and a predetermined impedance. The feeder circuit includes electrode patterns, and the feeder circuit and the radiation plates are capacitively coupled with each other through the flexible sheet.
摘要翻译：无线IC器件包括具有无线IC芯片和辐射板的柔性片。无线IC芯片通过Au凸块连接到位于薄片上并具有预定谐振频率和预定阻抗的馈电电路。馈线电路包括电极图案，并且馈电电路和辐射板通过柔性片彼此电容耦合。

10. 发明授权

US09064198B2 Electromagnetic-coupling-module-attached article 有权
公开(公告)号：US09064198B2
公开(公告)日：2015-06-23
申请号：US11740509
申请日：2007-04-26
申请人： Noboru Kato , Ikuhei Kimura , Kimikazu Iwasaki , Satoshi Ishino
发明人： Noboru Kato , Ikuhei Kimura , Kimikazu Iwasaki , Satoshi Ishino
IPC分类号： G08B13/14 , G06K19/077
CPC分类号： H02J50/12 , G06K19/07749 , G06K19/07771 , G06K19/07773 , H01L2224/16227 , H02J17/00
摘要： An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.

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