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1. 发明授权

US07967216B2 Wireless IC device 有权
标题翻译：无线IC设备
公开(公告)号：US07967216B2
公开(公告)日：2011-06-28
申请号：US12902174
申请日：2010-10-12
申请人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
发明人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
IPC分类号： G06K19/06
CPC分类号： H01Q1/2225 , G06K19/07749 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01Q1/38 , H01Q7/00 , H04B5/0081 , Y10T29/49124
摘要： A wireless IC device prevents deviations of the resonant frequency from the desired value. An antenna coil has an end portion positioned in a connector provided on the negative-most side in the z-axis direction and an end portion positioned in a connector provided on the positive-most side in the z-axis direction. A wireless IC is electrically connected to the end portions. A via hole conductor is provided between the end portion and the wireless IC and penetrates through a plurality of insulator layers. A via hole conductor is provided in the antenna coil such that the length of a current path thereto from the end portion is the shortest among a plurality of via hole conductors. The distance between the via hole conductor and the via hole conductor is larger than the distances between the penetrating via hole conductor and the via hole conductors.
摘要翻译：无线IC器件防止谐振频率偏离期望值。天线线圈具有位于设置在z轴方向最负侧的连接器中的端部和位于设置在z轴方向最正侧的连接器中的端部。无线IC电连接到端部。通孔导体设置在端部与无线IC之间并穿透多个绝缘体层。在天线线圈中设置有通孔导体，使得从端部到其的电流路径的长度在多个通孔导体中是最短的。通孔导体和通孔导体之间的距离大于穿透通孔导体和通孔导体之间的距离。

2. 发明授权

US09705194B2 Antenna module 有权
公开(公告)号：US09705194B2
公开(公告)日：2017-07-11
申请号：US13368358
申请日：2012-02-08
申请人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
发明人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
IPC分类号： H01Q9/04
CPC分类号： H01Q9/0407
摘要： In an antenna module, a main portion includes a plurality of insulating sheets made of a flexible material and laminated on each other. An antenna configured to transmit/receive a high-frequency signal is disposed in the main portion. A connection portion is disposed in the main portion and is connected to an electronic device that inputs/outputs the high-frequency signal. A signal transmission line is disposed in the main portion and has a strip line structure or a microstrip line structure to transmit the high-frequency signal. An impedance matching circuit is disposed in the main portion and between the antenna and end of a signal transmission line facing in a negative x direction. An impedance matching circuit is disposed in the main portion and between the connection portion and an end of the signal transmission line facing in a positive x direction.

3. 发明授权

US08592687B2 Signal line and circuit substrate 有权
公开(公告)号：US08592687B2
公开(公告)日：2013-11-26
申请号：US13343740
申请日：2012-01-05
申请人： Noboru Kato , Jun Sasaki , Satoshi Ishino
发明人： Noboru Kato , Jun Sasaki , Satoshi Ishino
IPC分类号： H05K1/02
CPC分类号： H05K1/0298 , H01P3/081 , H01P3/088 , H05K1/0219 , H05K1/0225 , H05K1/028 , H05K2201/0715 , H05K2201/09618
摘要： A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction.

4. 发明授权

US08047445B2 Wireless IC device and method of manufacturing the same 有权
标题翻译：无线IC器件及其制造方法
公开(公告)号：US08047445B2
公开(公告)日：2011-11-01
申请号：US12940103
申请日：2010-11-05
申请人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
发明人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
IPC分类号： G06K19/06
CPC分类号： H01Q1/2225 , G06K19/07749 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01Q1/38 , H01Q7/00 , H04B5/0081 , Y10T29/49124
摘要： A wireless IC device includes a plurality of insulating sheets that are stacked on top of one another. Coil electrodes are arranged so as to sandwich the insulating sheets therebetween and define an antenna coil by being connected to one another. The coil electrodes are superposed with one another and thereby define a single ring when viewed in plan from a z-axis direction.
摘要翻译：无线IC器件包括堆叠在彼此顶部的多个绝缘片。线圈电极被布置成将绝缘片夹在其间并通过彼此连接来限定天线线圈。线圈电极彼此叠置，从而在从z轴方向的平面图中观察时限定单个环。

5. 发明授权

US08692125B2 Multilayer substrate 有权
标题翻译：多层基板
公开(公告)号：US08692125B2
公开(公告)日：2014-04-08
申请号：US13369363
申请日：2012-02-09
申请人： Noboru Kato , Jun Sasaki , Satoshi Ishino
发明人： Noboru Kato , Jun Sasaki , Satoshi Ishino
IPC分类号： H05K1/00
CPC分类号： H05K1/0281 , H05K1/024 , H05K1/028 , H05K1/0298 , H05K1/032 , H05K1/09 , H05K2201/0141 , H05K2201/057 , H05K2201/0715 , H05K2201/09018 , H05K2201/09409
摘要： A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.
摘要翻译：保持弯曲状态而不引起电特性波动的多层基板包括：主体，其包括要堆叠并由柔性材料制成的多个绝缘片。信号线在主体中延伸。接地导体相对于主体中的信号线在z轴方向的正方向侧设置，并且在从z轴方向看的俯视图中与信号线重叠。接地导体相对于主体中的信号线在z轴方向的负方向侧设置，并且在从z轴方向观察的俯视图中与信号线重叠。主体弯曲的状态使得信号线定义为电弧，由接地导体的塑性变形保持。

6. 发明授权

US09374886B2 Signal line path and manufacturing method therefor 有权
标题翻译：信号线路径及其制造方法
公开(公告)号：US09374886B2
公开(公告)日：2016-06-21
申请号：US13343738
申请日：2012-01-05
申请人： Noboru Kato , Jun Sasaki
发明人： Noboru Kato , Jun Sasaki
IPC分类号： H05K1/00 , H05K1/03 , H05K3/02 , H05K3/10 , H05K1/02 , H05K3/28 , H05K3/46
CPC分类号： H05K1/0218 , H05K1/028 , H05K3/28 , H05K3/4635 , H05K2201/0715 , Y10T29/49155
摘要： A signal line that is easily inflected includes a laminated body including at least insulator layers that include flexible material and are laminated from a positive direction side in a z axis direction to a negative direction side therein in this order. A ground conductor is securely fixed to a main surface on the positive direction side of the insulation sheet in the z axis direction. A signal line is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. A ground conductor is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. The ground conductors and the signal line define a stripline structure. The laminated body is inflected so that the insulator layer is located on an inner periphery side, compared with a location of the insulator layer.
摘要翻译：容易弯曲的信号线包括至少包括绝缘体层的层叠体，该绝缘体层包括柔性材料，并且从Z轴方向的正方向侧到其负向侧层叠。接地导体牢固地固定在绝缘片的正方向侧的主面上，在z轴方向上。信号线在z轴方向上牢固地固定在绝缘体层的正极侧的主表面上。接地导体牢固地固定在绝缘体层的正方向侧的主面上，在z轴方向。接地导体和信号线定义了带状线结构。与绝缘体层的位置相比，层叠体弯曲，使得绝缘体层位于内周侧。

7. 发明授权

US09104950B2 Antenna and wireless IC device 有权
标题翻译：天线和无线IC器件
公开(公告)号：US09104950B2
公开(公告)日：2015-08-11
申请号：US13190670
申请日：2011-07-26
申请人： Noboru Kato , Jun Sasaki , Teppei Miura , Naoki Gouchi
发明人： Noboru Kato , Jun Sasaki , Teppei Miura , Naoki Gouchi
IPC分类号： G06K19/07 , H01Q1/22 , H01Q7/00 , H01Q9/16 , G06K19/077 , H01Q1/36 , H01Q9/28
CPC分类号： G06K19/07749 , G06K19/07756 , H01Q1/2208 , H01Q1/2283 , H01Q1/36 , H01Q7/00 , H01Q9/285
摘要： An antenna for a wireless IC device having improved energy transfer efficiency with a wireless IC, and a wireless IC device equipped with the antenna are constructed such that the antenna includes a coil pattern and spiral coupling patterns provided at the ends of the coil pattern and disposed so as to face each other. A coupling module including a wireless IC chip and a feeder circuit substrate including a feeder circuit arranged to be coupled to the wireless IC chip is mounted on the coupling pattern so as to define a wireless IC device. The coil pattern is an open type coil pattern. The coupling patterns are arranged close to each other to define a single LC resonator. Thus, energy is concentrated in the coupling patterns, thereby improving the energy transfer efficiency between the antenna and the wireless IC chip.
摘要翻译：利用无线IC提高能量传递效率的无线IC器件的天线以及配备有天线的无线IC器件，其构成为：天线包括设置在线圈图案的端部的线圈图案和螺旋形耦合图案，以便相互面对。包括无线IC芯片和馈线电路基板的耦合模块安装在耦合模式上，以便限定无线IC器件。线圈图案是开放式线圈图案。耦合图案彼此靠近地布置以限定单个LC谐振器。因此，能量集中在耦合图案中，从而提高天线和无线IC芯片之间的能量传递效率。

8. 发明授权

US08915448B2 Antenna device and radio frequency IC device 有权
标题翻译：天线装置和射频IC装置
公开(公告)号：US08915448B2
公开(公告)日：2014-12-23
申请号：US13232102
申请日：2011-09-14
申请人： Katsumi Taniguchi , Jun Sasaki , Noboru Kato
发明人： Katsumi Taniguchi , Jun Sasaki , Noboru Kato
IPC分类号： G06K19/06 , G06K19/07 , H01Q1/22 , H01Q1/52 , H01Q7/00
CPC分类号： G06K19/0723 , G06K19/0726 , H01Q1/2208 , H01Q1/52 , H01Q7/00
摘要： An antenna device is arranged to transmit or receive a radio frequency communication signal to or from an external device such as a reader/writer, and is arranged such that an antenna resonance circuit including an antenna coil and a capacitor is connected to an additional resonance circuit including an inductor and a capacitor. A radio frequency IC device preferably includes the antenna device and a radio frequency IC. The antenna device is constructed such that a change in characteristics thereof caused by a change in the distance between a radio frequency IC device and a reader/writer is minimized, and the radio frequency IC device performs communication with high reliability.
摘要翻译：天线装置被布置为向诸如读取器/写入器的外部设备发送或接收射频通信信号，并且被布置为使得包括天线线圈和电容器的天线谐振电路连接到附加谐振电路包括电感和电容。射频IC装置优选地包括天线装置和射频IC。天线装置被构造为使得由射频IC器件和读取器/写入器之间的距离的变化引起的特性变化最小化，并且射频IC器件以高可靠性进行通信。

9. 发明授权

US08610636B2 Radio frequency IC device 有权
标题翻译：射频IC器件
公开(公告)号：US08610636B2
公开(公告)日：2013-12-17
申请号：US13163803
申请日：2011-06-20
申请人： Noboru Kato , Jun Sasaki , Kosuke Yamada
发明人： Noboru Kato , Jun Sasaki , Kosuke Yamada
IPC分类号： H01Q1/50
CPC分类号： H01Q1/2225 , G06K19/07749 , H01F2017/002
摘要： A radio frequency IC device includes a radio frequency IC chip, a feeder circuit substrate, and a radiating plate. The feeder circuit substrate includes a feeder circuit that electrically connects to the radio IC chip and that includes a resonance circuit and/or a matching circuit including inductance elements. The feeder circuit substrate is bonded to the radiating plate, which radiates a transmission signal supplied from the feeder circuit and supplies a received signal to the feeder circuit. The inductance elements are arranged in spiral patterns wound in opposite directions and couple to each other in opposite phases. The radio frequency IC device is able to obtain a radio frequency IC device that is not susceptible to being affected by a usage environment, minimizes variations in radiation characteristics, and can be used in a wide frequency band.
摘要翻译：射频IC器件包括射频IC芯片，馈电电路基板和散热板。供电电路基板包括电连接到无线电IC芯片并且包括谐振电路和/或包括电感元件的匹配电路的馈电电路。供电电路基板被接合到辐射板，辐射从馈电电路提供的传输信号，并将接收到的信号提供给馈电电路。电感元件以相反方向缠绕的螺旋图案布置，并以相反的方式相互耦合。无线射频IC器件能够获得不易受到使用环境影响的射频IC器件，使辐射特性的变化最小化，可以在宽频带中使用。

10. 发明授权

US08596545B2 Component of wireless IC device and wireless IC device 有权
标题翻译：无线IC器件和无线IC器件的组成部分
公开(公告)号：US08596545B2
公开(公告)日：2013-12-03
申请号：US12944099
申请日：2010-11-11
申请人： Noboru Kato , Jun Sasaki
发明人： Noboru Kato , Jun Sasaki
IPC分类号： G06K19/06 , H01L23/02
CPC分类号： G06K19/07749 , H01Q1/2225 , H01Q7/00
摘要： A component of a wireless IC device includes a wireless IC chip and a feeding circuit substrate including a plurality of laminated resin layers. The wireless IC chip is included inside the feeding circuit substrate, and an annular electrode is arranged inside the feeding circuit substrate. The component of a wireless IC device and the radiation plate define the wireless IC device.
摘要翻译：无线IC器件的组件包括无线IC芯片和包括多个层叠树脂层的馈电电路基板。无线IC芯片包括在供电电路基板的内部，环状电极配置在供电电路基板的内部。无线IC器件的组件和辐射板限定无线IC器件。

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