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    • 1. 发明申请
    • Rf power amplifier
    • Rf功率放大器
    • US20050253656A1
    • 2005-11-17
    • US10514900
    • 2003-05-19
    • Niels KramerRonald KosterRob HeeresJohn Hug
    • Niels KramerRonald KosterRob HeeresJohn Hug
    • H03F3/21H03F3/68
    • H03F3/19H03F3/211
    • An RF power amplifier according to the invention comprises a plurality of parallel output transistors (HBT,1,1 to HBT,1,N) connected to a power supply. A plurality of base resistors (Rb,1,1 to Rb,1,N) for the output transistors (HBT,1,1 to HBT,1,N) and a plurality of input capacitors (Cb,1 to Cb,N), each coupled in parallel to receive an RF signal input and connected via at least one additional passive component to the inputs of each corresponding output transistor (HBT,1,1 to HBT,1,N), are provided. An output for an RF output signal is obtained from the parallelconnection of the output transistors (HBT,1,1 to HBT,1,N). The transistors (HBT,1,1 to HBT,1,N) are heterojunction bipolar transistors.
    • 根据本发明的RF功率放大器包括连接到电源的多个并联输出晶体管(HBT,1,1至HBT,1,N)。 用于输出晶体管(HBT,1,1至HBT,1,N)和多个输入电容器(Cb,1至Cb,N)的多个基本电阻器(Rb,1,1至Rb,1,N) ,每个并联耦合以接收经由至少一个附加无源部件输入并连接到每个对应的输出晶体管(HBT,1,1至HBT,1,N)的输入的RF信号。 从输出晶体管(HBT,1,1至HBT,1,N)的并联连接获得RF输出信号的输出。 晶体管(HBT,1,1至HBT,1,N)是异质结双极晶体管。
    • 2. 发明授权
    • RF power amplifier
    • 射频功率放大器
    • US07154339B2
    • 2006-12-26
    • US10514900
    • 2003-05-19
    • Niels KramerRonald KosterRob Mathijs HeeresJohn Joseph Hug
    • Niels KramerRonald KosterRob Mathijs HeeresJohn Joseph Hug
    • H03F3/68
    • H03F3/19H03F3/211
    • An RF power amplifier according to the invention comprises a plurality of parallel output transistors (HBT,1,1 to HBT,1,N) connected to a power supply. A plurality of base resistors (Rb,1,1 to Rb,1,N) for the output transistors (HBT,1,1 to HBT,1,N) and a plurality of input capacitors (Cb,1 to Cb,N), each coupled in parallel to receive an RF signal input and connected via at least one additional passive component to the inputs of each corresponding output transistor (HBT,1,1 to HBT,1,N), are provided An output for an RF output signal is obtained from the parallel connection of the output transistors (HBT,1,1 to HBT,1,N). The transistors (HBT,1,1 to HBT,1,N) are heterojunction bipolar transistors.
    • 根据本发明的RF功率放大器包括连接到电源的多个并联输出晶体管(HBT,1,1至HBT,1,N)。 用于输出晶体管(HBT,1,1至HBT,1,N)和多个输入电容器(Cb,1至Cb,N)的多个基本电阻器(Rb,1,1至Rb,1,N) ,每个并联耦合以接收经由至少一个附加无源分量输入并连接到每个对应的输出晶体管(HBT,1,1至HBT,1,N)的输入的RF信号。RF输出的输出 信号从输出晶体管(HBT,1,1至HBT,1,N)的并联连接获得。 晶体管(HBT,1,1至HBT,1,N)是异质结双极晶体管。
    • 3. 发明授权
    • Method of operating a programmable, non-volatile memory device
    • 操作可编程的非易失性存储器件的方法
    • US06291836B1
    • 2001-09-18
    • US08866649
    • 1997-05-30
    • Niels KramerMaarten J. H. NiestenWilhelmus H. M. LoddersGerrit Oversluizen
    • Niels KramerMaarten J. H. NiestenWilhelmus H. M. LoddersGerrit Oversluizen
    • H01L218246
    • G11C16/02G11C17/14H01L21/822H01L27/10
    • The invention relates to an erasable non-volatile memory in which a diode is formed at each point of intersection between the x-selection lines (Ki) and y-selection lines (Rj), of which diode the anode and cathode are conductively connected to the x- and y-selection lines. The diodes are formed in hydrogenated amorphous silicon or silicon compounds such as amorphous Si−xGex. Writing takes place by means of a current pulse through selected diodes. The current in the forward direction becomes much lower, for example a few hundred times lower, than in diodes which are not selected, probably owing to degradation in the semiconductor material. The diodes may be returned to their original state again (i.e. be erased) through heating, for example at a temperature of 200° C. during 100 minutes. Preferably, the diodes are formed by Schottky diodes because the characteristic in the reverse direction does not (substantially) change in this type of diode. The Schottky diodes may be formed in the transitional region between the amorphous intrinsic semiconductor material (6) and the selection lines (Ki).
    • 本发明涉及一种可擦除非易失性存储器,其中在x选择线(Ki)和y选择线(Rj)之间的每个交点处形成二极管,其中阳极和阴极二极管导电连接到 x和y选择行。 二极管形成在氢化非晶硅或硅化合物如非晶Si-xGex中。 通过选定二极管的电流脉冲进行写入。 正向方向上的电流比未选择的二极管低得多,例如低几百倍,可能是由于半导体材料的劣化。 二极管可以通过加热再次(即被擦除)返回到其原始状态,例如在200℃的温度下在100分钟内。 优选地,二极管由肖特基二极管形成,因为在这种类型的二极管中反向特性不会(基本上)改变。 肖特基二极管可以形成在非晶本征半导体材料(6)和选择线(Ki)之间的过渡区域中。