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    • 2. 发明授权
    • Alignment process for integrated circuit structures on semiconductor substrate using scatterometry measurements of latent images in spaced apart test fields on substrate
    • 使用半导体衬底上的集成电路结构的对准过程,使用在衬底上的间隔开的测试场中的潜像的散射测量
    • US06809824B1
    • 2004-10-26
    • US10006398
    • 2001-11-30
    • Colin D. YatesNicholas F. PaschNicholas K. Eib
    • Colin D. YatesNicholas F. PaschNicholas K. Eib
    • G01B1100
    • G03F7/70633G03F7/70675H01L22/34
    • A process for measuring alignment of latent images in a photoresist layer of an integrated circuit structure on a semiconductor substrate with a test pattern formed in a lower layer on the substrate comprises the steps of forming a test pattern in selected fields of a first layer on a semiconductor substrate, forming a layer of photoresist over the first layer, forming latent images in portions of the photoresist layer lying in the selected fields overlying the test pattern of the first layer; and measuring the alignment of the test pattern in the selected fields of the first layer with the overlying latent images in the photoresist layer using scatterometry. In a preferred embodiment, the test pattern formed in each of the selected fields in the first layer comprises a pattern of parallel spaced apart lines, and the latent images formed in the portions of the photoresist layer in the selected fields above the test pattern in the first layer also comprises a pattern of parallel spaced part lines, with the two sets of lines interspaced between one another and generally parallel to one another to form a diffraction pattern.
    • 用于测量在半导体衬底上的集成电路结构的光致抗蚀剂层中的潜像与衬底上的下层中形成的测试图案的潜像的对准的方法包括以下步骤:在第一层的选定区域中形成测试图案 半导体衬底,在第一层上形成光致抗蚀剂层,在位于第一层的测试图案上的所选场域中的光致抗蚀剂层的部分中形成潜像; 并且使用散射测量在第一层的所选场域中的测试图案与光致抗蚀剂层中的上覆潜像的对准。 在优选实施例中,形成在第一层中的每个选定场中的测试图案包括平行间隔开的​​线的图案,并且在该测试图案上方的选定区域的光致抗蚀剂层的部分中形成的潜像 第一层还包括平行间隔的部分线的图案,其中两组线彼此间隔并且大体上彼此平行以形成衍射图案。
    • 6. 发明授权
    • Reticle overlay correction
    • 标线重叠校正
    • US07016041B2
    • 2006-03-21
    • US10236226
    • 2002-09-06
    • Colin D. YatesJames R. B. Elmer
    • Colin D. YatesJames R. B. Elmer
    • G01B11/00
    • G03F7/70633
    • A method for characterizing overlay errors between at least a first and a second mask layer for an integrated circuit. A first primary alignment structure is formed in a first position of the inter-layer region around the first mask layer, and a first secondary alignment structure is formed in a second position of the inter-layer region around the first mask layer. Similarly, a second primary alignment structure is formed in a first position of an inter-layer region around the second mask layer, and a second secondary alignment structure is formed in a second position of the inter-layer region around the second mask layer. The first mask layer and the second mask layer are exposed onto a photoresist coated substrate with a first exposure and a second exposure, where the first position of the first primary alignment structure during the first exposure generally aligns with the second position of the second secondary alignment structure, and the second position of the first secondary alignment structure during the second exposure generally aligns with the first position of the second primary alignment structure. The photoresist on the substrate is developed, and offsets between the first primary alignment structure and the second secondary alignment structure are measured, and offsets between the second primary alignment structure and the first secondary alignment structure are also measured, to determine the overlay errors.
    • 一种用于表征用于集成电路的至少第一和第二掩模层之间的覆盖误差的方法。 第一主对准结构形成在第一掩模层周围的层间区域的第一位置,第一次取向结构形成在第一掩模层周围的层间区域的第二位置。 类似地,第二主对准结构形成在第二掩模层周围的层间区域的第一位置,并且第二次取向结构形成在第二掩模层周围的层间区域的第二位置。 第一掩模层和第二掩模层在第一曝光和第二曝光下暴露在光致抗蚀剂涂覆的基板上,其中在第一曝光期间第一主对准结构的第一位置通常与第二次对准的第二位置对齐 并且在第二曝光期间第一次对准结构的第二位置通常与第二主对准结构的第一位置对准。 显影衬底上的光致抗蚀剂,并且测量第一主对准结构和第二次对准结构之间的偏移,并且还测量第二主对准结构和第一次对准结构之间的偏移,以确定重叠误差。