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1. 发明授权

US07440256B2 Laminated ceramic substrate and manufacturing method therefor 失效
标题翻译：层压陶瓷基板及其制造方法
公开(公告)号：US07440256B2
公开(公告)日：2008-10-21
申请号：US10541494
申请日：2004-09-27
申请人： Masanori Hongo , Hiroyuki Nishikiori , Natsuyo Nagano , Takashi Ogura
发明人： Masanori Hongo , Hiroyuki Nishikiori , Natsuyo Nagano , Takashi Ogura
IPC分类号： H01G2/20 , H01G4/228
CPC分类号： H01L23/49805 , H01L2224/48091 , H01L2224/48227 , H05K1/0306 , H05K3/0052 , H05K3/403 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2201/0919 , Y10T29/4913 , Y10T428/24777 , Y10T428/24926 , H01L2924/00014
摘要： A laminated ceramic substrate includes a side electrode in which a side edge electrode layer formed on a side edge portion of a ceramic layer overlaps with and connects to a side edge electrode layer formed on a side edge portion of another ceramic layer directly above and/or directly below the former ceramic layer. The side edge electrode layer includes a parallel wall unexposed and approximately parallel to a side surface of the laminated ceramic substrate and a perpendicular wall approximately perpendicular to the side surface of the laminated ceramic substrate. A length La of the parallel wall and a depth Lb of the parallel wall from the side surface of the laminated ceramic substrate have a relationship of La>Lb.
摘要翻译：层叠陶瓷基板包括侧面电极，其中形成在陶瓷层的侧边缘部分上的侧边缘电极层与形成在另一陶瓷层的侧边缘部分上的侧边缘电极层重叠并连接到另一陶瓷层的正上方和/或直接在以前的陶瓷层下面。侧边电极层包括未曝光并且大致平行于层叠陶瓷基板的侧表面的平行壁和大致垂直于层叠陶瓷基板的侧表面的垂直壁。平行壁的长度La和层叠陶瓷基板的侧面的平行壁的深度Lb具有La> Lb的关系。

2. 发明授权

US07432783B2 Filter device substrate and filter device 失效
标题翻译：过滤装置基板和过滤装置
公开(公告)号：US07432783B2
公开(公告)日：2008-10-07
申请号：US11579137
申请日：2005-04-20
申请人： Natsuyo Nagano , Takashi Ogura
发明人： Natsuyo Nagano , Takashi Ogura
IPC分类号： H03H9/72
CPC分类号： H03H9/70 , H01L23/15 , H01L23/645 , H01L24/06 , H01L24/48 , H01L24/49 , H01L25/16 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/30107 , H03H7/463 , H03H9/0571 , H03H9/0576 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A filter device substrate 1 of the present invention is formed by stacking a plurality of ceramic layers 12, 14, and includes a filter chip mounting portion for mounting a transmission filter chip 2 and a reception filter chip 3. Arranged on a surface of one ceramic layer 12 are a signal input pad 73, a signal output pad 7, a signal input side ground pattern 44 and a signal output side ground pattern 43 for connecting a signal input terminal C, a signal output terminal D, a signal input side ground terminal G and a signal output side ground terminal G, respectively, of the reception filter chip 3. The signal input side ground pattern 44 and the signal output side ground pattern 43 are connected to each other by a connection wiring pattern 45 on the surface of the one ceramic layer 12.
摘要翻译：本发明的滤波器装置用基板1通过层叠多个陶瓷层12,14而形成，并且具有安装透射滤波器芯片2和接收滤波器芯片3的滤波器芯片安装部。布置在一个陶瓷层12的表面上的是用于连接信号输入端子C的信号输入焊盘73，信号输出焊盘7，信号输入侧接地图案44和信号输出侧接地图案43，信号输出端D ，接收滤波器芯片3的信号输入侧接地端子G和信号输出侧接地端子G. 信号输入侧接地图案44和信号输出侧接地图案43通过一个陶瓷层12的表面上的连接布线图案45彼此连接。

3. 发明授权

US07369012B2 Antenna duplexer 有权
标题翻译：天线双工器
公开(公告)号：US07369012B2
公开(公告)日：2008-05-06
申请号：US10992642
申请日：2004-11-22
申请人： Masanori Hongo , Natsuyo Nagano , Takashi Ogura , Hideki Ito , Toshio Tanuma
发明人： Masanori Hongo , Natsuyo Nagano , Takashi Ogura , Hideki Ito , Toshio Tanuma
IPC分类号： H01P5/12 , H03H9/00
CPC分类号： H01P1/213
摘要： The present invention provides an antenna duplexer comprising a transmitting filter and a receiving filter which are mounted on a package, a transmitting signal input pad and a transmitting signal output pad which are connected to input and output ends of the transmitting filter, a receiving signal input pad and a receiving signal output pad which are connected to input and output ends of the receiving filter, and at least one grounding pad. The pads are arranged, on a surface of the package, along at least two sides of four sides of a quadrangle. The transmitting signal input pad and the receiving signal output pad are disposed at diagonal positions of the quadrangle and are furthest away from one another.
摘要翻译：本发明提供了一种天线双工器，其包括安装在封装上的发射滤波器和接收滤波器，发射信号输入焊盘和发射信号输出焊盘，其连接到发射滤波器的输入和输出端，接收信号输入焊盘和接收信号输出焊盘，其连接到接收滤波器的输入和输出端，以及至少一个接地焊盘。垫片在包装的表面上沿着四边形的四边的至少两侧布置。发射信号输入焊盘和接收信号输出焊盘设置在四边形的对角位置处并且彼此最远。

4. 发明申请

US20060033200A1 Ceramic package, assembled substrate, and manufacturing method therefor 失效
标题翻译：陶瓷封装，组装衬底及其制造方法
公开(公告)号：US20060033200A1
公开(公告)日：2006-02-16
申请号：US11198135
申请日：2005-08-08
申请人： Natsuyo Nagano , Takashi Ogura , Masanori Hongo , Masami Fukuyama
发明人： Natsuyo Nagano , Takashi Ogura , Masanori Hongo , Masami Fukuyama
IPC分类号： H01L23/053
CPC分类号： H01L21/50 , H01L21/4807 , H01L23/13 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/16152 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a ceramic package including one or more ceramic layers and being capable of having an electronic component and a lid fixed to a surface thereof, a surface of a ceramic layer having a sealing electrode for joining the lid through a sealing member and a pad to be connected to input and output electrodes and/or a ground electrode of the electronic component is divided into an inner portion having the pad and an outer portion having the sealing electrode with a stepped side wall as a border for preventing the sealing member from flowing, and one of the inner portion and the outer portion projects relative to the other.
摘要翻译：在包括一个或多个陶瓷层并且能够将电子部件和固定在其表面上的盖的陶瓷封装中的陶瓷层的表面上，具有密封电极的表面，所述密封电极用于通过密封构件和垫将盖接合，连接到电子部件的输入和输出电极和/或接地电极被分成具有焊盘的内部部分和具有密封电极的外部部分，其具有阶梯状侧壁作为防止密封部件流动的边界，以及内部部分和外部部分中的一个相对于另一个突出。

5. 发明授权

US07432590B2 Ceramic package, assembled substrate, and manufacturing method therefor 失效
标题翻译：陶瓷封装，组装衬底及其制造方法
公开(公告)号：US07432590B2
公开(公告)日：2008-10-07
申请号：US11198135
申请日：2005-08-08
申请人： Natsuyo Nagano , Takashi Ogura , Masanori Hongo , Masami Fukuyama
发明人： Natsuyo Nagano , Takashi Ogura , Masanori Hongo , Masami Fukuyama
IPC分类号： H01L23/12 , H01L23/48
CPC分类号： H01L21/50 , H01L21/4807 , H01L23/13 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/16152 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a ceramic package including one or more ceramic layers and being capable of having an electronic component and a lid fixed to a surface thereof, a surface of a ceramic layer having a sealing electrode for joining the lid through a sealing member and a pad to be connected to input and output electrodes and/or a ground electrode of the electronic component is divided into an inner portion having the pad and an outer portion having the sealing electrode with a stepped side wall as a border for preventing the sealing member from flowing, and one of the inner portion and the outer portion projects relative to the other.
摘要翻译：在包括一个或多个陶瓷层并且能够将电子部件和固定在其表面上的盖的陶瓷封装中的陶瓷层的表面上，具有密封电极的表面，所述密封电极用于通过密封构件和垫将盖接合，连接到电子部件的输入和输出电极和/或接地电极被分成具有焊盘的内部部分和具有密封电极的外部部分，其具有阶梯状侧壁作为防止密封部件流动的边界，以及内部部分和外部部分中的一个相对于另一个突出。

6. 发明申请

US20080048315A1 Electronic Device and Package Used for the Same 审中-公开
标题翻译：用于其的电子设备和包装
公开(公告)号：US20080048315A1
公开(公告)日：2008-02-28
申请号：US11664108
申请日：2005-09-08
申请人： Natsuyo Nagano , Takashi Ogura
发明人： Natsuyo Nagano , Takashi Ogura
IPC分类号： H03H9/05 , H01L23/15
CPC分类号： H03H9/0576 , H01L24/06 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/48091 , H01L2924/16195 , H01L2924/181 , H03H9/0571 , H03H9/706 , H03H9/72 , H03H9/725 , H01L2924/00014 , H01L2924/00
摘要： [PROBLEM ] To provide a laminate ceramic electronic device applicable to two types of design specifications by using a common package. [SOLUTION A laminate ceramic electronic device of the present invention has filter chips 2, 3 for transmission and reception mounted therein. A wiring pattern 7, which connects an input terminal A of the transmission filter chip 2 with a transmission side signal terminal Tx in a first arrangement, has two branch wiring portions 72, 73 extending from the transmission side signal terminal Tx toward the input terminal A of the transmission filter chip 2 in the first arrangement and toward an output terminal D of the reception filter chip 3 in a second arrangement. A wiring pattern 8, which connects the output terminal D of the reception filter chip 3 with a reception side signal terminal Rx in the first arrangement, has two branch wiring portions 82, 83 extending from the reception side signal terminal Rx toward the output terminal D of the reception filter chip 3 in the first arrangement and toward the input terminal A of the transmission filter chip 2 in the second arrangement.
摘要翻译： [问题]通过使用通用包装提供适用于两种设计规格的层压陶瓷电子设备。 [解决方案]本发明的层叠陶瓷电子器件具有安装在其中的用于发送和接收的滤波器芯片2,3。将发送滤波器芯片2的输入端子A与第一配置的发送侧信号端子Tx连接的布线图案7具有从发送侧信号端子Tx朝向输入端子A延伸的两个支路布线部72,73 的第一布置中的发送滤波器芯片2，并且在第二布置中朝向接收滤波器芯片3的输出端子D。将接收滤波器芯片3的输出端D与第一配置中的接收侧信号端子Rx连接的布线图案8具有从接收侧信号端子Rx朝向输出端子D延伸的两个分支布线部82,83 的第一布置中的接收滤波器芯片3，并且在第二布置中朝向发送滤波器芯片2的输入端子A.

7. 发明申请

US20060115637A1 Multilayer ceramic substrate and its manufacturing method 失效
标题翻译：多层陶瓷基板及其制造方法
公开(公告)号：US20060115637A1
公开(公告)日：2006-06-01
申请号：US10541494
申请日：2004-09-27
申请人： Masanori Hongo , Hiroyuki Nishikiori , Natsuyo Nagano , Takashi Ogura
发明人： Masanori Hongo , Hiroyuki Nishikiori , Natsuyo Nagano , Takashi Ogura
IPC分类号： B32B17/00
CPC分类号： H01L23/49805 , H01L2224/48091 , H01L2224/48227 , H05K1/0306 , H05K3/0052 , H05K3/403 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2201/0919 , Y10T29/4913 , Y10T428/24777 , Y10T428/24926 , H01L2924/00014
摘要： A laminated ceramic substrate includes a side electrode in which a side edge electrode layer formed on a side edge portion of a ceramic layer overlaps with and connects to a side edge electrode layer formed on a side edge portion of another ceramic layer directly above and/or directly below the former ceramic layer. The side edge electrode layer includes a parallel wall unexposed and approximately parallel to a side surface of the laminated ceramic substrate and a perpendicular wall approximately perpendicular to the side surface of the laminated ceramic substrate. A length La of the parallel wall and a depth Lb of the parallel wall from the side surface of the laminated ceramic substrate have a relationship of La>Lb.
摘要翻译：层叠陶瓷基板包括侧面电极，其中形成在陶瓷层的侧边缘部分上的侧边缘电极层与形成在另一陶瓷层的侧边缘部分上的侧边缘电极层重叠并连接到另一陶瓷层的正上方和/或直接在以前的陶瓷层下面。侧边电极层包括未曝光并且大致平行于层叠陶瓷基板的侧表面的平行壁和大致垂直于层叠陶瓷基板的侧表面的垂直壁。平行壁的长度La和层叠陶瓷基板的侧面的平行壁的深度Lb具有La> Lb的关系。

8. 发明申请

US20050116789A1 Antenna duplexer 有权
标题翻译：天线双工器
公开(公告)号：US20050116789A1
公开(公告)日：2005-06-02
申请号：US10992642
申请日：2004-11-22
申请人： Masanori Hongo , Natsuyo Nagano , Takashi Ogura , Hideki Ito , Toshio Tanuma
发明人： Masanori Hongo , Natsuyo Nagano , Takashi Ogura , Hideki Ito , Toshio Tanuma
IPC分类号： H03H9/72 , H01P1/213 , H03H9/25
CPC分类号： H01P1/213
摘要： The present invention provides an antenna duplexer comprising a transmitting filter and a receiving filter which are mounted on a package, a transmitting signal input pad and a transmitting signal output pad which are connected to input and output ends of the transmitting filter, a receiving signal input pad and a receiving signal output pad which are connected to input and output ends of the receiving filter, and at least one grounding pad. The pads are arranged, on a surface of the package, along at least two sides of four sides of a quadrangle. The transmitting signal input pad and the receiving signal output pad are disposed at diagonal positions of the quadrangle and are furthest away from one another.
摘要翻译：本发明提供了一种天线双工器，其包括安装在封装上的发射滤波器和接收滤波器，发射信号输入焊盘和发射信号输出焊盘，其连接到发射滤波器的输入和输出端，接收信号输入焊盘和接收信号输出焊盘，其连接到接收滤波器的输入和输出端，以及至少一个接地焊盘。垫片在包装的表面上沿着四边形的四边的至少两侧布置。发射信号输入焊盘和接收信号输出焊盘设置在四边形的对角位置处并且彼此最远。

9. 发明申请

US20070247258A1 Filter Device Substrate and Filter Device 失效
标题翻译：过滤设备基板和过滤设备
公开(公告)号：US20070247258A1
公开(公告)日：2007-10-25
申请号：US11579137
申请日：2005-04-20
申请人： Natsuyo Nagano , Takashi Ogura
发明人： Natsuyo Nagano , Takashi Ogura
IPC分类号： H03H9/70 , H03H9/25
CPC分类号： H03H9/70 , H01L23/15 , H01L23/645 , H01L24/06 , H01L24/48 , H01L24/49 , H01L25/16 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/30107 , H03H7/463 , H03H9/0571 , H03H9/0576 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A filter device substrate 1 of the present invention is formed by stacking a plurality of ceramic layers 12, 14, and includes a filter chip mounting portion for mounting a transmission filter chip 2 and a reception filter chip 3. Arranged on a surface of one ceramic layer 12 are a signal input pad 73, a signal output pad 7, a signal input side ground pattern 44 and a signal output side ground pattern 43 for connecting a signal input terminal C, a signal output terminal D, a signal input side ground terminal G and a signal output side ground terminal G, respectively, of the reception filter chip 3. The signal input side ground pattern 44 and the signal output side ground pattern 43 are connected to each other by a connection wiring pattern 45 on the surface of the one ceramic layer 12.
摘要翻译：本发明的滤波器装置用基板1通过层叠多个陶瓷层12,14而形成，并且具有安装透射滤波器芯片2和接收滤波器芯片3的滤波器芯片安装部。布置在一个陶瓷层12的表面上的是用于连接信号输入端子C的信号输入焊盘73，信号输出焊盘7，信号输入侧接地图案44和信号输出侧接地图案43，信号输出端D ，接收滤波器芯片3的信号输入侧接地端子G和信号输出侧接地端子G. 信号输入侧接地图案44和信号输出侧接地图案43通过一个陶瓷层12的表面上的连接布线图案45彼此连接。

10. 发明授权

US07218002B2 Electronic device and intermediate product of electronic device 失效
标题翻译：电子设备和电子设备的中间产品
公开(公告)号：US07218002B2
公开(公告)日：2007-05-15
申请号：US11030288
申请日：2005-01-07
申请人： Natsuyo Nagano , Masanori Hongo , Masami Fukuyama , Takashi Ogura
发明人： Natsuyo Nagano , Masanori Hongo , Masami Fukuyama , Takashi Ogura
IPC分类号： H01L23/04
CPC分类号： H01L23/49805 , H01L2224/48091 , H01L2224/48227 , H01L2924/09701 , H05K1/0306 , H05K3/0052 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09154 , H05K2201/10727 , Y02P70/613 , H01L2924/00014
摘要： The present invention provides an electronic device comprising a base substrate to be surface-mounted on a circuit board, one or more electronic component elements mounted on a surface of the base substrate and/or therein, an external electrode provided on an end portion of the base substrate and in the form of a post perpendicular to a rear surface of the base substrate for connecting the one or more electronic component elements to the circuit board. Furthermore, the base substrate is provided on its end portion with a slope crossing a side surface and a rear surface of the base substrate. A surface of the external electrode is exposed on the slope.
摘要翻译：本发明提供一种电子装置，其特征在于，具备：表面安装在电路基板上的基底基板，安装在所述基板的表面上的一个或多个电子元件元件和/或其内部设置在所述基板的端部的外部电极并且以垂直于基底基板的后表面的柱的形式，用于将一个或多个电子元件连接到电路板。此外，基底在其端部设置有与基底的侧面和背面交叉的斜面。外部电极的表面暴露在斜面上。

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