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1. 发明授权

US07369012B2 Antenna duplexer 有权
标题翻译：天线双工器
公开(公告)号：US07369012B2
公开(公告)日：2008-05-06
申请号：US10992642
申请日：2004-11-22
申请人： Masanori Hongo , Natsuyo Nagano , Takashi Ogura , Hideki Ito , Toshio Tanuma
发明人： Masanori Hongo , Natsuyo Nagano , Takashi Ogura , Hideki Ito , Toshio Tanuma
IPC分类号： H01P5/12 , H03H9/00
CPC分类号： H01P1/213
摘要： The present invention provides an antenna duplexer comprising a transmitting filter and a receiving filter which are mounted on a package, a transmitting signal input pad and a transmitting signal output pad which are connected to input and output ends of the transmitting filter, a receiving signal input pad and a receiving signal output pad which are connected to input and output ends of the receiving filter, and at least one grounding pad. The pads are arranged, on a surface of the package, along at least two sides of four sides of a quadrangle. The transmitting signal input pad and the receiving signal output pad are disposed at diagonal positions of the quadrangle and are furthest away from one another.
摘要翻译：本发明提供了一种天线双工器，其包括安装在封装上的发射滤波器和接收滤波器，发射信号输入焊盘和发射信号输出焊盘，其连接到发射滤波器的输入和输出端，接收信号输入焊盘和接收信号输出焊盘，其连接到接收滤波器的输入和输出端，以及至少一个接地焊盘。垫片在包装的表面上沿着四边形的四边的至少两侧布置。发射信号输入焊盘和接收信号输出焊盘设置在四边形的对角位置处并且彼此最远。

2. 发明授权

US07180387B2 Antenna duplexer 失效
标题翻译：天线双工器
公开(公告)号：US07180387B2
公开(公告)日：2007-02-20
申请号：US10992644
申请日：2004-11-22
申请人： Masanori Hongo , Natsuyo Nagano , Takashi Ogura , Hideki Ito , Toshio Tanuma
发明人： Masanori Hongo , Natsuyo Nagano , Takashi Ogura , Hideki Ito , Toshio Tanuma
IPC分类号： H01P1/213 , H03H9/72
CPC分类号： H03H9/0576 , H03H9/72 , H03H9/725
摘要： The present invention provides an antenna duplexer comprising a package having a plurality of ceramic layers superposed, and a transmitting filter and a receiving filter which are mounted on a surface of the package. A phase-matching strip line is formed on a surface of one ceramic layer. The package has grounding layers formed respectively on surfaces of upper and lower ceramic layers with the phase-matching strip line interposed therebetween. A plurality of via holes are formed around the phase-matching strip line for connecting the two grounding layers to each other.
摘要翻译：本发明提供了一种天线双工器，其包括叠置有多个陶瓷层的封装，以及安装在封装表面上的发射滤波器和接收滤波器。在一个陶瓷层的表面上形成相位匹配带状线。该封装具有分别形成在上部和下部陶瓷层的表面上的接地层，并且相互匹配的带状线插入其间。在相匹配带状线周围形成多个通孔，用于将两个接地层彼此连接。

3. 发明申请

US20050116790A1 Antenna duplexer 失效
标题翻译：天线双工器
公开(公告)号：US20050116790A1
公开(公告)日：2005-06-02
申请号：US10992644
申请日：2004-11-22
申请人： Masanori Hongo , Natsuyo Nagano , Takashi Ogura , Hideki Ito , Toshio Tanuma
发明人： Masanori Hongo , Natsuyo Nagano , Takashi Ogura , Hideki Ito , Toshio Tanuma
IPC分类号： H03H9/72 , H03H9/25
CPC分类号： H03H9/0576 , H03H9/72 , H03H9/725
摘要： The present invention provides an antenna duplexer comprising a package having a plurality of ceramic layers superposed, and a transmitting filter and a receiving filter which are mounted on a surface of the package. A phase-matching strip line is formed on a surface of one ceramic layer. The package has grounding layers formed respectively on surfaces of upper and lower ceramic layers with the phase-matching strip line interposed therebetween. A plurality of via holes are formed around the phase-matching strip line for connecting the two grounding layers to each other.
摘要翻译：本发明提供了一种天线双工器，其包括叠置有多个陶瓷层的封装，以及安装在封装表面上的发射滤波器和接收滤波器。在一个陶瓷层的表面上形成相位匹配带状线。该封装具有分别形成在上部和下部陶瓷层的表面上的接地层，并且相互匹配的带状线插入其间。在相匹配带状线周围形成多个通孔，用于将两个接地层彼此连接。

4. 发明申请

US20050116789A1 Antenna duplexer 有权
标题翻译：天线双工器
公开(公告)号：US20050116789A1
公开(公告)日：2005-06-02
申请号：US10992642
申请日：2004-11-22
申请人： Masanori Hongo , Natsuyo Nagano , Takashi Ogura , Hideki Ito , Toshio Tanuma
发明人： Masanori Hongo , Natsuyo Nagano , Takashi Ogura , Hideki Ito , Toshio Tanuma
IPC分类号： H03H9/72 , H01P1/213 , H03H9/25
CPC分类号： H01P1/213
摘要： The present invention provides an antenna duplexer comprising a transmitting filter and a receiving filter which are mounted on a package, a transmitting signal input pad and a transmitting signal output pad which are connected to input and output ends of the transmitting filter, a receiving signal input pad and a receiving signal output pad which are connected to input and output ends of the receiving filter, and at least one grounding pad. The pads are arranged, on a surface of the package, along at least two sides of four sides of a quadrangle. The transmitting signal input pad and the receiving signal output pad are disposed at diagonal positions of the quadrangle and are furthest away from one another.
摘要翻译：本发明提供了一种天线双工器，其包括安装在封装上的发射滤波器和接收滤波器，发射信号输入焊盘和发射信号输出焊盘，其连接到发射滤波器的输入和输出端，接收信号输入焊盘和接收信号输出焊盘，其连接到接收滤波器的输入和输出端，以及至少一个接地焊盘。垫片在包装的表面上沿着四边形的四边的至少两侧布置。发射信号输入焊盘和接收信号输出焊盘设置在四边形的对角位置处并且彼此最远。

5. 发明授权

US07440256B2 Laminated ceramic substrate and manufacturing method therefor 失效
标题翻译：层压陶瓷基板及其制造方法
公开(公告)号：US07440256B2
公开(公告)日：2008-10-21
申请号：US10541494
申请日：2004-09-27
申请人： Masanori Hongo , Hiroyuki Nishikiori , Natsuyo Nagano , Takashi Ogura
发明人： Masanori Hongo , Hiroyuki Nishikiori , Natsuyo Nagano , Takashi Ogura
IPC分类号： H01G2/20 , H01G4/228
CPC分类号： H01L23/49805 , H01L2224/48091 , H01L2224/48227 , H05K1/0306 , H05K3/0052 , H05K3/403 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2201/0919 , Y10T29/4913 , Y10T428/24777 , Y10T428/24926 , H01L2924/00014
摘要： A laminated ceramic substrate includes a side electrode in which a side edge electrode layer formed on a side edge portion of a ceramic layer overlaps with and connects to a side edge electrode layer formed on a side edge portion of another ceramic layer directly above and/or directly below the former ceramic layer. The side edge electrode layer includes a parallel wall unexposed and approximately parallel to a side surface of the laminated ceramic substrate and a perpendicular wall approximately perpendicular to the side surface of the laminated ceramic substrate. A length La of the parallel wall and a depth Lb of the parallel wall from the side surface of the laminated ceramic substrate have a relationship of La>Lb.
摘要翻译：层叠陶瓷基板包括侧面电极，其中形成在陶瓷层的侧边缘部分上的侧边缘电极层与形成在另一陶瓷层的侧边缘部分上的侧边缘电极层重叠并连接到另一陶瓷层的正上方和/或直接在以前的陶瓷层下面。侧边电极层包括未曝光并且大致平行于层叠陶瓷基板的侧表面的平行壁和大致垂直于层叠陶瓷基板的侧表面的垂直壁。平行壁的长度La和层叠陶瓷基板的侧面的平行壁的深度Lb具有La> Lb的关系。

6. 发明申请

US20060033200A1 Ceramic package, assembled substrate, and manufacturing method therefor 失效
标题翻译：陶瓷封装，组装衬底及其制造方法
公开(公告)号：US20060033200A1
公开(公告)日：2006-02-16
申请号：US11198135
申请日：2005-08-08
申请人： Natsuyo Nagano , Takashi Ogura , Masanori Hongo , Masami Fukuyama
发明人： Natsuyo Nagano , Takashi Ogura , Masanori Hongo , Masami Fukuyama
IPC分类号： H01L23/053
CPC分类号： H01L21/50 , H01L21/4807 , H01L23/13 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/16152 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a ceramic package including one or more ceramic layers and being capable of having an electronic component and a lid fixed to a surface thereof, a surface of a ceramic layer having a sealing electrode for joining the lid through a sealing member and a pad to be connected to input and output electrodes and/or a ground electrode of the electronic component is divided into an inner portion having the pad and an outer portion having the sealing electrode with a stepped side wall as a border for preventing the sealing member from flowing, and one of the inner portion and the outer portion projects relative to the other.
摘要翻译：在包括一个或多个陶瓷层并且能够将电子部件和固定在其表面上的盖的陶瓷封装中的陶瓷层的表面上，具有密封电极的表面，所述密封电极用于通过密封构件和垫将盖接合，连接到电子部件的输入和输出电极和/或接地电极被分成具有焊盘的内部部分和具有密封电极的外部部分，其具有阶梯状侧壁作为防止密封部件流动的边界，以及内部部分和外部部分中的一个相对于另一个突出。

7. 发明授权

US07432590B2 Ceramic package, assembled substrate, and manufacturing method therefor 失效
标题翻译：陶瓷封装，组装衬底及其制造方法
公开(公告)号：US07432590B2
公开(公告)日：2008-10-07
申请号：US11198135
申请日：2005-08-08
申请人： Natsuyo Nagano , Takashi Ogura , Masanori Hongo , Masami Fukuyama
发明人： Natsuyo Nagano , Takashi Ogura , Masanori Hongo , Masami Fukuyama
IPC分类号： H01L23/12 , H01L23/48
CPC分类号： H01L21/50 , H01L21/4807 , H01L23/13 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/16152 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a ceramic package including one or more ceramic layers and being capable of having an electronic component and a lid fixed to a surface thereof, a surface of a ceramic layer having a sealing electrode for joining the lid through a sealing member and a pad to be connected to input and output electrodes and/or a ground electrode of the electronic component is divided into an inner portion having the pad and an outer portion having the sealing electrode with a stepped side wall as a border for preventing the sealing member from flowing, and one of the inner portion and the outer portion projects relative to the other.
摘要翻译：在包括一个或多个陶瓷层并且能够将电子部件和固定在其表面上的盖的陶瓷封装中的陶瓷层的表面上，具有密封电极的表面，所述密封电极用于通过密封构件和垫将盖接合，连接到电子部件的输入和输出电极和/或接地电极被分成具有焊盘的内部部分和具有密封电极的外部部分，其具有阶梯状侧壁作为防止密封部件流动的边界，以及内部部分和外部部分中的一个相对于另一个突出。

8. 发明申请

US20060115637A1 Multilayer ceramic substrate and its manufacturing method 失效
标题翻译：多层陶瓷基板及其制造方法
公开(公告)号：US20060115637A1
公开(公告)日：2006-06-01
申请号：US10541494
申请日：2004-09-27
申请人： Masanori Hongo , Hiroyuki Nishikiori , Natsuyo Nagano , Takashi Ogura
发明人： Masanori Hongo , Hiroyuki Nishikiori , Natsuyo Nagano , Takashi Ogura
IPC分类号： B32B17/00
CPC分类号： H01L23/49805 , H01L2224/48091 , H01L2224/48227 , H05K1/0306 , H05K3/0052 , H05K3/403 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2201/0919 , Y10T29/4913 , Y10T428/24777 , Y10T428/24926 , H01L2924/00014
摘要： A laminated ceramic substrate includes a side electrode in which a side edge electrode layer formed on a side edge portion of a ceramic layer overlaps with and connects to a side edge electrode layer formed on a side edge portion of another ceramic layer directly above and/or directly below the former ceramic layer. The side edge electrode layer includes a parallel wall unexposed and approximately parallel to a side surface of the laminated ceramic substrate and a perpendicular wall approximately perpendicular to the side surface of the laminated ceramic substrate. A length La of the parallel wall and a depth Lb of the parallel wall from the side surface of the laminated ceramic substrate have a relationship of La>Lb.
摘要翻译：层叠陶瓷基板包括侧面电极，其中形成在陶瓷层的侧边缘部分上的侧边缘电极层与形成在另一陶瓷层的侧边缘部分上的侧边缘电极层重叠并连接到另一陶瓷层的正上方和/或直接在以前的陶瓷层下面。侧边电极层包括未曝光并且大致平行于层叠陶瓷基板的侧表面的平行壁和大致垂直于层叠陶瓷基板的侧表面的垂直壁。平行壁的长度La和层叠陶瓷基板的侧面的平行壁的深度Lb具有La> Lb的关系。

9. 发明授权

US07218002B2 Electronic device and intermediate product of electronic device 失效
标题翻译：电子设备和电子设备的中间产品
公开(公告)号：US07218002B2
公开(公告)日：2007-05-15
申请号：US11030288
申请日：2005-01-07
申请人： Natsuyo Nagano , Masanori Hongo , Masami Fukuyama , Takashi Ogura
发明人： Natsuyo Nagano , Masanori Hongo , Masami Fukuyama , Takashi Ogura
IPC分类号： H01L23/04
CPC分类号： H01L23/49805 , H01L2224/48091 , H01L2224/48227 , H01L2924/09701 , H05K1/0306 , H05K3/0052 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09154 , H05K2201/10727 , Y02P70/613 , H01L2924/00014
摘要： The present invention provides an electronic device comprising a base substrate to be surface-mounted on a circuit board, one or more electronic component elements mounted on a surface of the base substrate and/or therein, an external electrode provided on an end portion of the base substrate and in the form of a post perpendicular to a rear surface of the base substrate for connecting the one or more electronic component elements to the circuit board. Furthermore, the base substrate is provided on its end portion with a slope crossing a side surface and a rear surface of the base substrate. A surface of the external electrode is exposed on the slope.
摘要翻译：本发明提供一种电子装置，其特征在于，具备：表面安装在电路基板上的基底基板，安装在所述基板的表面上的一个或多个电子元件元件和/或其内部设置在所述基板的端部的外部电极并且以垂直于基底基板的后表面的柱的形式，用于将一个或多个电子元件连接到电路板。此外，基底在其端部设置有与基底的侧面和背面交叉的斜面。外部电极的表面暴露在斜面上。

10. 发明申请

US20050151247A1 Electronic device and intermediate product of electronic device 失效
标题翻译：电子设备和电子设备的中间产品
公开(公告)号：US20050151247A1
公开(公告)日：2005-07-14
申请号：US11030288
申请日：2005-01-07
申请人： Natsuyo Nagano , Masanori Hongo , Masami Fukuyama , Takashi Ogura
发明人： Natsuyo Nagano , Masanori Hongo , Masami Fukuyama , Takashi Ogura
IPC分类号： H01L23/12 , H01L23/498 , H05K1/03 , H05K3/00 , H05K3/34 , H05K3/36 , H05K3/40 , H01L23/34
CPC分类号： H01L23/49805 , H01L2224/48091 , H01L2224/48227 , H01L2924/09701 , H05K1/0306 , H05K3/0052 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09154 , H05K2201/10727 , Y02P70/613 , H01L2924/00014
摘要： The present invention provides an electronic device comprising a base substrate to be surface-mounted on a circuit board, one or more electronic component elements mounted on a surface of the base substrate and/or therein, an external electrode provided on an end portion of the base substrate and in the form of a post perpendicular to a rear surface of the base substrate for connecting the one or more electronic component elements to the circuit board. Furthermore, the base substrate is provided on its end portion with a slope crossing a side surface and a rear surface of the base substrate. A surface of the external electrode is exposed on the slope.
摘要翻译：本发明提供一种电子装置，其特征在于，具备：表面安装在电路基板上的基底基板，安装在所述基板的表面上的一个或多个电子元件元件和/或其内部设置在所述基板的端部的外部电极并且以垂直于基底基板的后表面的柱的形式，用于将一个或多个电子元件连接到电路板。此外，基底在其端部设置有与基底的侧面和背面交叉的斜面。外部电极的表面暴露在斜面上。

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