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1. 发明申请

US20040250839A1 Dual outlet nozzle for the combined edge bead removal and backside wash of spin coated wafers 有权
标题翻译：用于组合边缘珠去除和旋转涂层晶片背面清洗的双出口喷嘴
公开(公告)号：US20040250839A1
公开(公告)日：2004-12-16
申请号：US10461068
申请日：2003-06-12
申请人： National Semiconductor Corporation
发明人： Gary Robertson , Robert Boyd Finlay
IPC分类号： B08B007/00
CPC分类号： H01L21/6708 , B08B3/02 , G03F7/162 , G03F7/168 , H01L21/67051 , Y10S134/902
摘要： An apparatus and method for the improved combined edge bead removal and backside wash of spin coated semiconductor wafers is disclosed. This is preferably accomplished by providing a nozzle having a plurality of outlets adapted for the ejection of a cleaning fluid onto the backside of a semiconductor wafer. This cleaning fluid can be EEP or a similar EBR type of solvent. This dual outlet nozzle can be mounted to a stationary EBR arm, and preferably comprises two outlets located on a beveled top surface that are separated at a predetermined angle. The angle of this beveled top surface with respect to a horizontal plane of the processed wafer is preferably about 45 degrees, while the angle of each nozzle outlet with respect to a primary axis of the stationary EBR arm is also preferably about 45 degrees. Other angles are also possible in order to maximize solvent jet efficiency.
摘要翻译：公开了一种用于改进旋涂半导体晶片的组合边缘珠去除和背面清洗的装置和方法。这优选通过提供具有多个出口的喷嘴来实现，所述喷嘴适于将清洗流体喷射到半导体晶片的背面上。该清洗液可以是EEP或类似的EBR型溶剂。该双出口喷嘴可以安装到固定的EBR臂上，并且优选地包括位于以预定角度分离的倾斜顶表面上的两个出口。相对于经处理的晶片的水平面，该倾斜的顶表面的角度优选为约45度，而每个喷嘴出口相对于固定EBR臂的主轴线的角度也优选为约45度。为了使溶剂喷射效率最大化，其他角度也是可能的。

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