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1. 发明申请

US20130255048A1 NATURAL WOOL PILE FABRIC AND METHOD FOR MAKING WOOL PILE FABRIC 有权
标题翻译：天然羊毛织物和制作羊毛织物的方法
公开(公告)号：US20130255048A1
公开(公告)日：2013-10-03
申请号：US13838551
申请日：2013-03-15
申请人： Nathan Crary , Stuart Jenkins , Stephen Martin , Zihao Dong , Jiqiu Zhang
发明人： Nathan Crary , Stuart Jenkins , Stephen Martin , Zihao Dong , Jiqiu Zhang
IPC分类号： D06C11/00 , D01G19/06 , D01G1/00 , D01G15/00 , D06C13/00 , D06B1/00
CPC分类号： D06C11/00 , A43B23/07 , B29D35/142 , D01G1/00 , D01G15/00 , D01G19/06 , D01G21/00 , D04B1/025 , D04B1/04 , D04B1/16 , D04B1/22 , D04B1/24 , D04B21/04 , D04B21/08 , D04B21/14 , D06B1/00 , D06C7/00 , D06C13/00 , D10B2501/043
摘要： A method of making a sheared wool, deep pile fabric that closely resembles natural sheepskin fleece that includes forming a length of wool pile fabric having natural wool fibers on one side and a scrim on an opposing side and finishing the wool pile fabric as natural shearling. The finishing process includes polishing the wool fiber side of the pile fabric by guiding the length of pile fabric over one or more heated first polishing rolls, applying a sheepskin conditioning solution to the wool fiber side of the pile fabric, further polishing the wool fiber side of the pile fabric by guiding the fabric a plurality of times over one or more second heated polishing rolls, and cutting the wool fibers to a designated length.
摘要翻译：一种制作剪绒羊毛，深绒面料与天然羊皮羊毛类似的方法，包括在一侧形成一定长度的具有天然羊毛纤维的羊毛绒织物，并在相对侧上形成一条稀松布，并将羊绒绒织物整理成天然的剪切。整理过程包括通过将绒头织物的长度引导到一个或多个加热的第一抛光辊上来对绒毛织物的羊毛纤维侧进行抛光，将羊皮调理溶液施加到绒头织物的羊毛纤维侧，进一步抛光羊毛纤维侧通过在一个或多个第二加热的抛光辊上引导织物多次，并将羊毛纤维切割成指定的长度。

2. 发明授权

US09212440B2 Natural wool pile fabric and method for making wool pile fabric 有权
标题翻译：天然羊毛绒面料及羊毛绒面料的制作方法
公开(公告)号：US09212440B2
公开(公告)日：2015-12-15
申请号：US13838551
申请日：2013-03-15
申请人： Nathan Crary , Stuart Jenkins , Stephen Martin , Zihao Dong
发明人： Nathan Crary , Stuart Jenkins , Stephen Martin , Zihao Dong
IPC分类号： D06C11/00 , D06C13/00 , D06C15/00 , D06B1/00 , D01G1/00 , D01G15/00 , D01G19/06 , D04B1/16 , D04B1/22 , D04B1/04 , D04B21/04 , D04B21/08 , B29D35/14 , D04B1/24 , D04B21/14 , A43B23/07 , D04B1/02 , D01G21/00
CPC分类号： D06C11/00 , A43B23/07 , B29D35/142 , D01G1/00 , D01G15/00 , D01G19/06 , D01G21/00 , D04B1/025 , D04B1/04 , D04B1/16 , D04B1/22 , D04B1/24 , D04B21/04 , D04B21/08 , D04B21/14 , D06B1/00 , D06C7/00 , D06C13/00 , D10B2501/043
摘要： A method of making a sheared wool, deep pile fabric that closely resembles natural sheepskin fleece that includes forming a length of wool pile fabric having natural wool fibers on one side and a scrim on an opposing side and finishing the wool pile fabric as natural shearling. The finishing process includes polishing the wool fiber side of the pile fabric by guiding the length of pile fabric over one or more heated first polishing rolls, applying a sheepskin conditioning solution to the wool fiber side of the pile fabric, further polishing the wool fiber side of the pile fabric by guiding the fabric a plurality of times over one or more second heated polishing rolls, and cutting the wool fibers to a designated length.
摘要翻译：一种制作剪绒羊毛，深绒面料与天然羊皮羊毛类似的方法，包括在一侧形成一定长度的具有天然羊毛纤维的羊毛绒织物，并在相对侧上形成一条稀松布，并将羊绒绒织物整理成天然的剪切。整理过程包括通过将绒头织物的长度引导到一个或多个加热的第一抛光辊上来对绒毛织物的羊毛纤维侧进行抛光，将羊皮调理溶液施加到绒头织物的羊毛纤维侧，进一步抛光羊毛纤维侧通过在一个或多个第二加热的抛光辊上引导织物多次，并将羊毛纤维切割成指定的长度。

3. 发明申请

US20070003987A1 Screening method for substance binding to merozoite surface protein-1/42 审中-公开
标题翻译：物质结合裂殖子表面蛋白-1 / 42的筛选方法
公开(公告)号：US20070003987A1
公开(公告)日：2007-01-04
申请号：US10561196
申请日：2004-06-18
申请人： Anton Dluzewski , Anthony Holder , Berry Birdsall , Jeff Babon , Stephen Martin , William Morgan , James Feeney , Michael Blackman , Suzanne Fleck , Barbara Saxty
发明人： Anton Dluzewski , Anthony Holder , Berry Birdsall , Jeff Babon , Stephen Martin , William Morgan , James Feeney , Michael Blackman , Suzanne Fleck , Barbara Saxty
IPC分类号： G01N33/569 , A61K31/185
CPC分类号： A61K31/185 , G01N33/56905 , Y02A50/411
摘要： Disclosed is a method of screening a test substance for possession of binding activity for possession of binding activity for MSP42 or a fragment thereof, the method comprising the steps of: combining or contacting, in any order, (i) a molecule comprising MSP142 or a fragment thereof, (ii) the test substance, and (iii) a comparison substance known to have binding activity for MSP142 or a fragment thereof; and determining the presence and/or amount, if any, of comparison substance and/or test substance bound of the MSP142 or fragment thereof.
摘要翻译：披露了一种筛选具有对MSP 42或其片段具有结合活性的结合活性的测试物质的方法，该方法包括以下步骤：以任何顺序组合或接触（ i）包含MSP1 42或其片段的分子，（ii）测试物质，和（iii）已知对MSP1 42具有结合活性的比较物质或片段并确定与MSP1 42或其片段结合的比较物质和/或测试物质的存在和/或量（如果有的话）。

4. 发明授权

US08421168B2 Microelectromechanical systems microphone packaging systems 有权
标题翻译：微机电系统麦克风包装系统
公开(公告)号：US08421168B2
公开(公告)日：2013-04-16
申请号：US12947543
申请日：2010-11-16
申请人： Howard Allen , Luke England , Douglas Alan Hawks , Yong Liu , Stephen Martin
发明人： Howard Allen , Luke England , Douglas Alan Hawks , Yong Liu , Stephen Martin
IPC分类号： H01L29/84
CPC分类号： B81B7/0041 , B81B2201/0257 , B81B2203/0127 , H01L2224/16245 , H01L2924/10155 , H04R31/00 , H04R2201/003
摘要： This document discusses, among other things, a conductive frame, a silicon die coupled to the conductive frame, the silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a silicon die port extending through the silicon die to the vibratory diaphragm, with a silicon die terminal in electrical communication with the conductive frame and an insulator affixed to the conductive frame and the silicon die, with the insulator extending through interstices in the conductive frame to a conductive frame bottom of the conductive frame, and around an exterior of the silicon die to the silicon die top, with the insulator physically affixed to the silicon die and to the conductive frame, with the silicon die port exposed and with a conductive frame terminal disposed at the conductive frame bottom in electrical communication with the silicon die terminal.
摘要翻译：本文件尤其涉及导电框架，耦合到导电框架的硅芯片，包括振动膜片的硅模具，该模具具有与硅模底部相对的硅模顶部，硅模头端口延伸穿过硅芯片连接到振动膜片，其中硅晶片端子与导电框架电连通，并且绝缘体固定到导电框架和硅模具，其中绝缘体延伸通过导电框架中的间隙到导电框架底部的导电框架，并且围绕硅晶片的外部到硅晶片顶部，其中绝缘体物理地固定到硅晶片和导电框架，硅晶片端口暴露，导电框架端子设置在导电框架底部与硅晶片端子进行电气通信。

5. 发明申请

US20120177651A1 ANTIGEN-BINDING PROTEINS 审中-公开
标题翻译：抗原结合蛋白
公开(公告)号：US20120177651A1
公开(公告)日：2012-07-12
申请号：US13322207
申请日：2010-05-26
申请人： Neil James Clarke , Susannah Karen Ford , Paul Andrew Hamblin , Stephen Martin
发明人： Neil James Clarke , Susannah Karen Ford , Paul Andrew Hamblin , Stephen Martin
IPC分类号： A61K39/395 , C07K16/18 , C12N1/21 , C12P21/06 , C12N5/10
CPC分类号： C07K16/22 , A61K39/3955 , C07K16/468 , C07K2317/569 , C07K2317/73 , C07K2317/76
摘要： The invention relates to combinations of HGF antagonists with VEGF antagonists, and provides antigen-binding proteins which bind to HGF comprising a protein scaffold which are linked to one or more epitope-binding domains wherein the antigen-binding protein has at least two antigen binding sites at least one of which is from an epitope binding domain and at least one of which is from a paired VH/VL domain, methods of making such constructs and uses thereof.
摘要翻译：本发明涉及HGF拮抗剂与VEGF拮抗剂的组合，并提供与HGF结合的抗原结合蛋白，其包含与一个或多个表位结合结构域连接的蛋白质支架，其中所述抗原结合蛋白具有至少两个抗原结合位点其中至少一个来自表位结合结构域，并且其中至少一个来自配对的VH / VL结构域，制备此类构建体的方法及其用途。

6. 发明申请

US20110121413A1 MICROELECTROMECHANICAL SYSTEMS MICROPHONE PACKAGING SYSTEMS 有权
标题翻译：微电子系统麦克风包装系统
公开(公告)号：US20110121413A1
公开(公告)日：2011-05-26
申请号：US12947543
申请日：2010-11-16
申请人： Howard Allen , Luke England , Douglas Alan Hawks , Yong Liu , Stephen Martin
发明人： Howard Allen , Luke England , Douglas Alan Hawks , Yong Liu , Stephen Martin
IPC分类号： H01L29/84
CPC分类号： B81B7/0041 , B81B2201/0257 , B81B2203/0127 , H01L2224/16245 , H01L2924/10155 , H04R31/00 , H04R2201/003
摘要： This document discusses, among other things, a conductive frame, a silicon die coupled to the conductive frame, the silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a silicon die port extending through the silicon die to the vibratory diaphragm, with a silicon die terminal in electrical communication with the conductive frame and an insulator affixed to the conductive frame and the silicon die, with the insulator extending through interstices in the conductive frame to a conductive frame bottom of the conductive frame, and around an exterior of the silicon die to the silicon die top, with the insulator physically affixed to the silicon die and to the conductive frame, with the silicon die port exposed and with a conductive frame terminal disposed at the conductive frame bottom in electrical communication with the silicon die terminal.
摘要翻译：本文件尤其涉及导电框架，耦合到导电框架的硅芯片，包括振动膜片的硅模具，该模具具有与硅模底部相对的硅模顶部，硅模头端口延伸穿过硅芯片连接到振动膜片，其中硅晶片端子与导电框架电连通，并且绝缘体固定到导电框架和硅模具，其中绝缘体延伸通过导电框架中的间隙到导电框架底部的导电框架，并且围绕硅晶片的外部到硅晶片顶部，其中绝缘体物理地固定到硅晶片和导电框架，硅晶片端口暴露，导电框架端子设置在导电框架底部与硅晶片端子进行电气通信。

7. 发明授权

US08211747B2 Wafer level stack die package 有权
标题翻译：晶圆级堆叠封装
公开(公告)号：US08211747B2
公开(公告)日：2012-07-03
申请号：US13323979
申请日：2011-12-13
申请人： Dan Kinzer , Yong Liu , Stephen Martin
发明人： Dan Kinzer , Yong Liu , Stephen Martin
IPC分类号： H01L21/00
CPC分类号： H01L25/16 , H01L21/76898 , H01L23/5389 , H01L24/16 , H01L2224/0401 , H01L2224/05025 , H01L2224/131 , H01L2224/17106 , H01L2924/01029 , H01L2924/01068 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/014 , H01L2924/00
摘要： This document discusses, among other things, apparatus and methods for an IC package including first and a second discrete components fabricated into a semiconductor substrate. The first and second discrete components can be adjacent to one another in the semiconductor substrate, and an integrated circuit die can be mounted on the semiconductor substrate and coupled to the first and second discrete components.
摘要翻译：本文件尤其涉及包括制造在半导体衬底中的第一和第二分立组件的IC封装的装置和方法。第一和第二分立组件可以在半导体衬底中彼此相邻，并且集成电路管芯可以安装在半导体衬底上并耦合到第一和第二分立组件。

8. 发明申请

US20060151861A1 Method to manufacture a universal footprint for a package with exposed chip 失效
标题翻译：制造具有裸露芯片的封装的通用尺寸的方法
公开(公告)号：US20060151861A1
公开(公告)日：2006-07-13
申请号：US11035918
申请日：2005-01-13
申请人： Jonathan Noquil , Connie Tangpuz , Romel Manatad , Stephen Martin , Rajeev Joshi , Venkat Iyer
发明人： Jonathan Noquil , Connie Tangpuz , Romel Manatad , Stephen Martin , Rajeev Joshi , Venkat Iyer
IPC分类号： H01L23/495
CPC分类号： H01L23/36 , H01L23/488 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K3/341 , H05K2201/09681 , H05K2201/10166 , H05K2201/10477 , H05K2201/10689 , H05K2201/10969 , Y02P70/613 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor die package is disclosed. It may include a semiconductor die having a first surface and a second surface, and a leadframe structure. A molding material may be formed around at least a portion of the die and at least a portion of the leadframe structure. A solderable layer may be on the exterior surface of the molding material and the first surface of the semiconductor die.
摘要翻译：公开了一种半导体管芯封装。它可以包括具有第一表面和第二表面的半导体管芯和引线框架结构。模制材料可以围绕模具的至少一部分和引线框架结构的至少一部分形成。可焊层可以在模制材料的外表面和半导体管芯的第一表面上。

9. 发明授权

US06891257B2 Packaging system for die-up connection of a die-down oriented integrated circuit 有权
标题翻译：一种面向芯片的集成电路的裸芯片连接的封装系统
公开(公告)号：US06891257B2
公开(公告)日：2005-05-10
申请号：US09823600
申请日：2001-03-30
申请人： David Chong , Hun Kwang Lee , Howard Allen , Stephen Martin
发明人： David Chong , Hun Kwang Lee , Howard Allen , Stephen Martin
IPC分类号： H01L21/60 , H01L23/495 , H01L23/498 , H01L23/02
CPC分类号： H01L24/49 , H01L23/4951 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/32245 , H01L2224/451 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/49 , H01L2224/73265 , H01L2224/85051 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2224/45099 , H01L2224/48227 , H01L2924/00 , H01L2924/00012
摘要： A die attach package for connecting a die or chip of die-down orientation to a printed circuit board in a die-up orientation. The package includes a substrate with leads that may be traces terminating in vias or that may be the leads of a lead frame. The traces or the leads of the lead frame are modified such that they pass under the die when the die is attached. The traces or leads are routed under the die such that proper connections are established from the topside of the die to the appropriate mount locations of the printed circuit board. The die is attached to the substrate using a non-electrically-conductive material. This packaging enables a fabricator to make die of one orientation type, die down, and use that die in a die-up package, thereby saving on fabrication costs.
摘要翻译：一种芯片连接封装，用于将裸片或裸片取向的芯片连接到印刷电路板上，该芯片将芯片或芯片与裸片方向连接。封装包括具有引线的基板，引线可以是终止于通孔中的迹线，或者可以是引线框架的引线。引线框架的迹线或引线被修改，使得它们在管芯附接时通过管芯下方。迹线或引线在管芯下方布线，从而从管芯的顶侧到印刷电路板的适当安装位置建立适当的连接。使用非导电材料将管芯附着到衬底上。这种包装使得制造商能够将一个取向型的模具倒模，并将其在裸片封装中使用，从而节省制造成本。

10. 发明授权

US4283726A Dual frequency distance measuring system 失效
标题翻译：双频测距系统
公开(公告)号：US4283726A
公开(公告)日：1981-08-11
申请号：US939810
申请日：1978-09-05
申请人： Lewis C. Spence , Stephen Martin
发明人： Lewis C. Spence , Stephen Martin
IPC分类号： G01S5/14 , G01S11/08 , G01S19/48 , G01S5/06
CPC分类号： G01S5/14 , G01S11/08
摘要： A radio frequency distance measuring system and method where two continuous wave carrier signals, derived from a stable frequency source, are radiated from a known reference point. The frequency of the first continuous wave carrier signal is displaced from the frequency of the second continuous wave carrier signal by a selected difference frequency. When received at the unknown point, the two continuous wave carrier signals are mixed to provide a difference or beat frequency marker signal, delayed in arrival at the unknown point from the known point by the speed of light. A locally generated marker signal is derived from a stable frequency source at the unknown point, and has the same frequency as the difference frequency signal. The leading or trailing edge of the difference frequency signal can be compared with the locally generated marker signal, and the time difference or phase difference between them can be displayed using a phase meter or time interval indicator and corresponds to determine directly the distance between the known transmitter reference point and the unknown receiver point. Multiple known reference point transmitters, each transmitting two continuous wave carrier signals displaced in frequency by a selected difference frequency, can be used to obtain two or more distance measurements at the unknown point to determine the position of the unknown receive point with respect to the known transmitter points. A chart shows the relationship of the selected difference frequency to the distance that can be measured without ambiguity.
摘要翻译：一种射频距离测量系统和方法，其中从稳定频率源导出的两个连续波载波信号从已知参考点辐射。第一连续波载波信号的频率从第二连续波载波信号的频率偏移选定的差频。当在未知点被接收时，将两个连续的波载波信号混合以提供差分或拍频信号，从已知点以光速延迟到达未知点。本地产生的标记信号从未知点的稳定频率源导出，并且具有与差分频率信号相同的频率。可以将差频信号的前沿或后沿与本地产生的标记信号进行比较，并且可以使用相位计或时间间隔指示器显示它们之间的时间差或相位差，并且对应于直接确定已知的发射机参考点和未知接收点。可以使用多个已知的参考点发射机，每个发射机在频率上以选定的差频率发射两个连续波载波信号，以在未知点获得两个或更多的距离测量值，以确定未知接收点相对于已知的位置发射点。图表显示所选择的差异频率与可以测量的距离之间的关系，不明确。

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