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1. 发明授权

US5879568A Process for producing multilayer printed circuit board for wire bonding 失效
标题翻译：用于引线接合的多层印刷电路板的制造方法
公开(公告)号：US5879568A
公开(公告)日：1999-03-09
申请号：US870379
申请日：1997-06-06
申请人： Naoyuki Urasaki , Kouichi Tsuyama , Kazuhito Kobayashi , Norio Okano , Hiroshi Shimizu , Nobuyuki Ogawa , Akishi Nakaso , Toyoki Ito , Daisuke Fujimoto , Kazuhisa Otsuka , Shigeharu Arike , Yoshiyuki Tsuru
发明人： Naoyuki Urasaki , Kouichi Tsuyama , Kazuhito Kobayashi , Norio Okano , Hiroshi Shimizu , Nobuyuki Ogawa , Akishi Nakaso , Toyoki Ito , Daisuke Fujimoto , Kazuhisa Otsuka , Shigeharu Arike , Yoshiyuki Tsuru
IPC分类号： H05K1/00 , H05K3/00 , H05K3/02 , H05K3/46 , B44C1/22
CPC分类号： H05K3/4655 , H05K3/0035 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/01078 , H05K2201/0209 , H05K2201/0248 , H05K2201/0355 , H05K2201/0358 , H05K2203/0554 , H05K3/0094 , H05K3/025 , H05K3/4652 , H05K3/4676
摘要： A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.
摘要翻译：可以通过包括以下步骤的方法制备层间厚度小的能够精细布线，IVH和BVH直径最小化，强度高以及引线键合加工性优异的多层印刷电路板，其中包括以下步骤：涂覆电化学复合的热固性树脂清漆在铜箔的粗糙面上的绝缘晶须，通过加热半固化以形成热固性树脂层，将其整体地层压在已经形成电镀通孔和导体环形的夹层板上，并使固化的热固性树脂树脂层在通孔壁表面上用粗糙剂。

2. 发明授权

US5689879A Metal foil for printed wiring board and production thereof 失效
标题翻译：印刷电路板用金属箔及其制造
公开(公告)号：US5689879A
公开(公告)日：1997-11-25
申请号：US357734
申请日：1994-12-16
申请人： Naoyuki Urasaki , Kouichi Tsuyama , Kiyoshi Hasegawa , Shuichi Hatakeyama , Akinari Kida , Akishi Nakaso , Hiroshi Nomura
发明人： Naoyuki Urasaki , Kouichi Tsuyama , Kiyoshi Hasegawa , Shuichi Hatakeyama , Akinari Kida , Akishi Nakaso , Hiroshi Nomura
IPC分类号： H05K3/02 , H05K3/06 , H05K3/38
CPC分类号： H05K3/025 , H05K3/062 , H05K2203/0152 , H05K2203/0307 , H05K2203/0376 , H05K2203/0384 , H05K2203/0723 , H05K2203/0726 , H05K3/383 , Y10S428/935 , Y10T29/49155 , Y10T428/12438 , Y10T428/12472 , Y10T428/1291 , Y10T428/12993
摘要： A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.
摘要翻译：一种用于印刷电路板的金属箔，包括要粘附到树脂上的第一铜层，具有足够强度作为金属层的第二铜层和含有1.1重量％以上的磷的镍 - 磷合金层，第一和第二铜层适用于制造具有优异耐热性的印刷电路板，特别是在制造过程中。

3. 发明授权

US5638598A Process for producing a printed wiring board 失效
标题翻译：印刷电路板的制造方法
公开(公告)号：US5638598A
公开(公告)日：1997-06-17
申请号：US462853
申请日：1995-06-05
申请人： Akishi Nakaso , Kouichi Tsuyama , Akinari Kida , Shuichi Hatakeyama , Naoyuki Urasaki
发明人： Akishi Nakaso , Kouichi Tsuyama , Akinari Kida , Shuichi Hatakeyama , Naoyuki Urasaki
IPC分类号： H05K3/00 , H05K3/06 , H05K3/40 , H05K3/46 , H01K3/10
CPC分类号： H05K3/4069 , H05K3/0055 , H05K2201/0305 , H05K2201/0338 , H05K2201/0341 , H05K2201/0355 , H05K2201/09454 , H05K2201/09745 , H05K2203/0346 , H05K2203/0384 , H05K2203/0554 , H05K2203/1453 , H05K3/06 , H05K3/4038 , H05K3/4623 , H05K3/4652 , Y10T29/49155 , Y10T29/49165
摘要： A process for producing a wiring board involves laminating a metal foil on both sides of an insulating substrate not completely cured, followed by pressing with heating; drilling holes in the resulting laminate for connecting circuits therein; removing portions of the metal foils in narrow areas around the holes to form hollow portions in the metal foils; and filling a flowable electroconductive substance in the holes and the hollow portions.
摘要翻译：制造布线板的方法包括在未完全固化的绝缘基板的两侧层压金属箔，然后加热压制; 在所得的层压板中钻孔以在其中连接电路; 在孔周围的狭窄区域中去除金属箔的部分，以在金属箔中形成中空部分; 并在孔和中空部分填充可流动的导电物质。

4. 发明授权

US5444189A Printed wiring board and production thereof 失效
标题翻译：印刷电路板及其制造
公开(公告)号：US5444189A
公开(公告)日：1995-08-22
申请号：US77722
申请日：1993-06-17
申请人： Akishi Nakaso , Kouichi Tsuyama , Akinari Kida , Shuichi Hatakeyama , Naoyuki Urasaki
发明人： Akishi Nakaso , Kouichi Tsuyama , Akinari Kida , Shuichi Hatakeyama , Naoyuki Urasaki
IPC分类号： H05K3/46 , H05K1/09 , H05K1/11 , H05K3/00 , H05K3/06 , H05K3/40 , H05K1/00
CPC分类号： H05K1/116 , H05K3/0055 , H05K3/062 , H05K3/4069 , H05K1/095 , H05K2201/0305 , H05K2201/0338 , H05K2201/0341 , H05K2201/0355 , H05K2201/09454 , H05K2201/09745 , H05K2203/0346 , H05K2203/0369 , H05K2203/0384 , H05K2203/0554 , H05K2203/1453 , H05K3/06 , H05K3/4038 , H05K3/4623 , H05K3/4652
摘要： A wiring board comprising one or more inner layer circuit substrates and outer circuit layers formed from metal foil layers on both sides of said dinner layer circuit substrates via prepregs, said inner layer circuit substrate comprising an insulating layer and metal foil layers formed on both sides of said insulating layer, at least one inner layer circuit substrate or said outer circuit layers or both having hollow portions in the metal foil layer filled with an electroconductive substance, said wiring board having one or more through-holes at least in the hollow portions and filled with the electroconductive substance, has high reliability and a high wiring density.
摘要翻译：一种布线板，包括一个或多个内层电路基板和由所述晚餐层电路基板两侧的金属箔层经由预浸料形成的外部电路层，所述内层电路基板包括绝缘层和金属箔层，所述绝缘层，至少一个内层电路基板或所述外电路层或两者在金属箔层中具有填充有导电物质的中空部分，所述布线板至少在中空部分中具有一个或多个通孔，并填充与导电物质具有高可靠性和高布线密度。

5. 发明授权

US5403672A Metal foil for printed wiring board and production thereof 失效
标题翻译：印刷电路板用金属箔及其制造
公开(公告)号：US5403672A
公开(公告)日：1995-04-04
申请号：US59658
申请日：1993-05-12
申请人： Naoyuki Urasaki , Kouichi Tsuyama , Kiyoshi Hasegawa , Shuichi Hatakeyama , Akinari Kida , Akishi Nakaso , Hiroshi Nomura
发明人： Naoyuki Urasaki , Kouichi Tsuyama , Kiyoshi Hasegawa , Shuichi Hatakeyama , Akinari Kida , Akishi Nakaso , Hiroshi Nomura
IPC分类号： H05K3/02 , H05K3/06 , H05K3/38 , B32B15/20 , B32B3/30
CPC分类号： H05K3/025 , H05K3/062 , H05K2203/0152 , H05K2203/0307 , H05K2203/0376 , H05K2203/0384 , H05K2203/0723 , H05K2203/0726 , H05K3/383 , Y10S428/935 , Y10T29/49155 , Y10T428/12438 , Y10T428/12472 , Y10T428/1291 , Y10T428/12993
摘要： A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.
摘要翻译：一种用于印刷电路板的金属箔，包括要粘附到树脂上的第一铜层，具有足够强度作为金属层的第二铜层和含有1.1重量％以上的磷的镍 - 磷合金层，第一和第二铜层适用于制造具有优异耐热性的印刷电路板，特别是在制造过程中。

6. 发明授权

US08042834B2 Front structure of vehicle 失效
标题翻译：车辆前部结构
公开(公告)号：US08042834B2
公开(公告)日：2011-10-25
申请号：US12516138
申请日：2007-11-27
申请人： Noriyuki Miura , Kouichi Tsuyama
发明人： Noriyuki Miura , Kouichi Tsuyama
IPC分类号： B62D21/02 , B62D21/15
CPC分类号： B62D21/152 , B62D21/02
摘要： Provided is a front structure of a vehicle 1, and the front structure includes a pair of side frames 2 and a first cross member 31. The pair of side frames 2 are disposed respectively on both sides of the vehicle in a vehicle-width direction and extend in a front-to-rear direction. The first cross member extends in the vehicle-width direction, and connects front-end portions 25 of the pair of side frames 2. Each of the front-end portions 25 of the side frames 2 includes a protruding portion 26 that extends frontwards integrally thereof beyond the first cross member 31. In the event of a frontal collision of the vehicle 1, the protruding portions 26 absorb the produced energy, so that the amount of deformation of portions respectively of the side frames 2 located at rear sides of the front-end portions 25 can be reduced.
摘要翻译：本发明提供一种车辆1的前部结构，前部结构包括一对侧框架2和第一横梁31。一对侧框架2分别设置在车辆宽度方向的两侧，在前后方向上延伸。第一横向构件沿车宽方向延伸，并且连接一对侧框架2的前端部25.侧框架2的每个前端部25包括一体地向前延伸的突出部26 超过第一横梁31。在车辆1的正面碰撞的情况下，突出部26吸收所产生的能量，使得分别位于前侧的侧框架2的后侧的部分的变形量，可以减少端部25。

7. 发明申请

US20100066126A1 FRONT STRUCTURE OF VEHICLE 失效
标题翻译：前车结构
公开(公告)号：US20100066126A1
公开(公告)日：2010-03-18
申请号：US12516138
申请日：2007-11-27
申请人： Noriyuki Miura , Kouichi Tsuyama
发明人： Noriyuki Miura , Kouichi Tsuyama
IPC分类号： B62D21/00
CPC分类号： B62D21/152 , B62D21/02
摘要： Provided is a front structure of a vehicle 1, and the front structure includes a pair of side frames 2 and a first cross member 31. The pair of side frames 2 are disposed respectively on both sides of the vehicle in a vehicle-width direction and extend in a front-to-rear direction. The first cross member extends in the vehicle-width direction, and connects front-end portions 25 of the pair of side frames 2. Each of the front-end portions 25 of the side frames 2 includes a protruding portion 26 that extends frontwards integrally thereof beyond the first cross member 31. In the event of a frontal collision of the vehicle 1, the protruding portions 26 absorb the produced energy, so that the amount of deformation of portions respectively of the side frames 2 located at rear sides of the front-end portions 25 can be reduced.
摘要翻译：本发明提供一种车辆1的前部结构，前部结构包括一对侧框架2和第一横梁31。一对侧框架2分别设置在车辆宽度方向的两侧，在前后方向上延伸。第一横向构件沿车宽方向延伸，并且连接一对侧框架2的前端部25.侧框架2的每个前端部25包括一体地向前延伸的突出部26 超过第一横梁31。在车辆1的正面碰撞的情况下，突出部26吸收所产生的能量，使得分别位于前侧的侧框架2的后侧的部分的变形量，可以减少端部25。

8. 发明授权

US08673428B2 Engraved plate and substrate with conductor layer pattern using the same 失效
标题翻译：雕刻板和基板与导体层图案使用相同
公开(公告)号：US08673428B2
公开(公告)日：2014-03-18
申请号：US12439685
申请日：2007-12-27
申请人： Susumu Naoyuki , Hisashige Kanbara , Minoru Tosaka , Kyosuke Suzuki , Toshirou Okamura , Yoshihito Kikuhara , Masami Negishi , Tadayasu Fujieda , Kouichi Tsuyama
发明人： Susumu Naoyuki , Hisashige Kanbara , Minoru Tosaka , Kyosuke Suzuki , Toshirou Okamura , Yoshihito Kikuhara , Masami Negishi , Tadayasu Fujieda , Kouichi Tsuyama
IPC分类号： B32B3/00 , B32B3/28 , B32B3/30 , B32B19/00 , B32B9/00
CPC分类号： B41N1/06 , B41C1/00 , B41N1/12 , C25D1/00 , C25D1/006 , H05K3/205 , H05K9/0096 , H05K2201/09827 , Y10T428/2457 , Y10T428/24612 , Y10T428/2462 , Y10T428/30
摘要： An engraved plate which includes a substrate and an insulating layer on a surface of the substrate wherein a concave portion which increases in width toward an opening and to which the substrate is exposed is formed at the insulating layer, and an engraved plate, a substrate with conductor layer pattern manufactured by a transferring method using the engraved plate, and a conductor layer pattern are provided.
摘要翻译：一种雕刻板，其在基板的表面上包括基板和绝缘层，其中在绝缘层处形成有朝向开口增加并且基板暴露的宽度的凹部，以及雕刻板，具有通过使用雕刻板的转印方法制造的导体层图案和导体层图案。

9. 发明授权

US5714794A Electrostatic protective device 失效
标题翻译：静电保护装置
公开(公告)号：US5714794A
公开(公告)日：1998-02-03
申请号：US632158
申请日：1996-04-15
申请人： Kouichi Tsuyama , Atsushi Suzunaga , Atsushi Nishimura , Tadashi Isono
发明人： Kouichi Tsuyama , Atsushi Suzunaga , Atsushi Nishimura , Tadashi Isono
IPC分类号： H01T4/08 , H05K1/02 , H05K3/00 , H05K3/34 , H05K3/40 , H05K3/42 , H01L29/00 , H01L23/34 , H01L23/48
CPC分类号： H05K1/026 , H01T4/08 , H05K3/403 , H05K1/0259 , H05K1/0272 , H05K2201/09181 , H05K3/0052 , H05K3/3442 , H05K3/429 , Y10T29/49126 , Y10T29/49165
摘要： Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating an electrostatic protective device which can simplify the structure as compared with the conventional devices sealed in a glass container, and can reduce the size and cost of the device. The chip type electrostatic protective device comprises an inner insulating layer made of organic resin material and provided with a plurality of holes for defining air gaps, a pair of outer insulating layers placed on both sides of the inner insulating layer, and circuit segments defining a discharge gap in each of the air gaps. Holes for interconnection are formed in the laminated assembly, and the interior of each of the holes is turned electroconductive. The assembly is then cut apart into individual chip type electrostatic protective device by cutting through each of the holes for interconnection so as to define terminals for interconnection.
摘要翻译：提供了一种静电保护装置，其高度有效地保护诸如IC和LSI的相对脆弱的装置免受静电损坏，以及与密封在玻璃容器中的传统装置相比可以简化结构的静电保护装置的制造方法，并可以减小设备的尺寸和成本。片式静电保护装置包括由有机树脂材料制成的内绝缘层，并且设置有用于限定气隙的多个孔，设置在内绝缘层两侧的一对外绝缘层，以及限定放电每个气隙的差距。用于互连的孔形成在层叠组件中，并且每个孔的内部都被导电。然后将组件切割成单独的芯片型静电保护装置，通过切割每个孔进行互连，以便限定用于互连的端子。

10. 发明授权

US6105698A Structure for maintaining passenger space in cab 失效
标题翻译：维持驾驶室乘客空间的结构
公开(公告)号：US6105698A
公开(公告)日：2000-08-22
申请号：US256098
申请日：1999-02-24
申请人： Kouichi Tsuyama , Toshihiro Murakami , Kazuyoshi Kano , Tetsuya Yamaguchi
发明人： Kouichi Tsuyama , Toshihiro Murakami , Kazuyoshi Kano , Tetsuya Yamaguchi
IPC分类号： B62D25/20 , B62D21/02 , B62D21/09 , B62D21/15 , B62D33/06 , B62D23/00 , B60K5/00
CPC分类号： B62D33/06 , B62D21/152
摘要： When an external force acts on a front side of a cab 10 at the time of a car collision or the like, the front side of the cab is deformed, so that a passenger space 15 is reduced from a value C to a value d. On the other hand, a power plant 3 advances because of an inertia force, and an oil pan 2 of the power plant 3 is brought into striking engagement with a suspension cross member 1, and therefore is prevented from further advancing. The value of the distance b between the power plant 3 and a rising portion 16 of a floor panel 14, as well as the value of the distance a between the suspension cross member 1 and the oil pan 2, is suitably determined, and also deforming properties of deformable members of the oil pan 2 are suitably determined. By doing so, the reduction or deformation of the passenger space 15 from the power plant side is prevented, thereby securing the safety of the passengers.
摘要翻译：当在汽车碰撞等时外力作用在驾驶室10的前侧时，驾驶室的前侧变形，乘客空间15从值C减小到值d。另一方面，发电厂3由于惯性力而前进，并且发电厂3的油盘2与悬挂横梁1撞击接合，因此被阻止进一步前进。适当确定发电厂3与地板14的上升部16之间的距离b的值以及悬挂横梁1与油盘2之间的距离a的值，并且也变形适当地确定油底壳2的可变形构件的特性。通过这样做，可防止乘客空间15从发电厂侧的减少或变形，从而确保乘客的安全。

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