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    • 2. 发明授权
    • Method for producing group III nitride semiconductor and template substrate
    • 制备III族氮化物半导体和模板衬底的方法
    • US08680581B2
    • 2014-03-25
    • US12654562
    • 2009-12-23
    • Naoyuki NakadaKoji OkunoYasuhisa Ushida
    • Naoyuki NakadaKoji OkunoYasuhisa Ushida
    • H01L29/20
    • H01L29/2003H01L21/0237H01L21/0242H01L21/02433H01L21/02458H01L21/0254H01L21/0262H01L21/02636H01L21/02639H01L21/02647H01L29/045
    • The present invention provides a method for producing a Group III nitride semiconductor. The method includes forming a groove in a surface of a growth substrate through etching; forming a buffer film on the groove-formed surface of the growth substrate through sputtering; heating, in an atmosphere containing hydrogen and ammonia, the substrate to a temperature at which a Group III nitride semiconductor of interest is grown; and epitaxially growing the Group III nitride semiconductor on side surfaces of the groove at the growth temperature. The thickness of the buffer film or the growth temperature is regulated so that the Group III nitride semiconductor is grown primarily on the side surfaces of the groove in a direction parallel to the main surface of the growth substrate. The thickness of the buffer film is regulated to be smaller than that of a buffer film which is employed for epitaxially growing the Group III nitride semiconductor on a planar growth substrate uniformly in a direction perpendicular to the growth substrate. The growth temperature is regulated to be lower than a temperature at which the Group III nitride semiconductor is epitaxially grown on a planar growth substrate uniformly in a direction perpendicular to the growth substrate. The growth temperature is preferably 1,020 to 1,100° C. The buffer film employed is an AlN film having a thickness of 150 Å or less.
    • 本发明提供一种III族氮化物半导体的制造方法。 该方法包括通过蚀刻在生长衬底的表面上形成凹槽; 通过溅射在生长衬底的槽形表面上形成缓冲膜; 在含有氢和氨的气氛中将衬底加热到​​生长所关注的III族氮化物半导体的温度; 并在生长温度下在槽的侧表面外延生长III族氮化物半导体。 调节缓冲膜的厚度或生长温度,使得III族氮化物半导体主要在平行于生长衬底主表面的方向上在槽的侧表面上生长。 缓冲膜的厚度被调节为小于在平面生长衬底上沿垂直于生长衬底的方向均匀地外延生长III III族氮化物半导体的缓冲膜的厚度。 生长温度被调节为低于在平面生长衬底上沿垂直于生长衬底的方向均匀地外延生长III族氮化物半导体的温度。 生长温度优选为1020〜1100℃。所使用的缓冲膜是厚度为150以下的AlN膜。
    • 3. 发明申请
    • Method for producing group III nitride semiconductor and template substrate
    • 制备III族氮化物半导体和模板衬底的方法
    • US20100102360A1
    • 2010-04-29
    • US12654562
    • 2009-12-23
    • Naoyuki NakadaKoji OkunoYasuhisa Ushida
    • Naoyuki NakadaKoji OkunoYasuhisa Ushida
    • H01L29/20H01L21/203H01L29/06
    • H01L29/2003H01L21/0237H01L21/0242H01L21/02433H01L21/02458H01L21/0254H01L21/0262H01L21/02636H01L21/02639H01L21/02647H01L29/045
    • The present invention provides a method for producing a Group III nitride semiconductor. The method includes forming a groove in a surface of a growth substrate through etching; forming a buffer film on the groove-formed surface of the growth substrate through sputtering; heating, in an atmosphere containing hydrogen and ammonia, the substrate to a temperature at which a Group III nitride semiconductor of interest is grown; and epitaxially growing the Group III nitride semiconductor on side surfaces of the groove at the growth temperature. The thickness of the buffer film or the growth temperature is regulated so that the Group III nitride semiconductor is grown primarily on the side surfaces of the groove in a direction parallel to the main surface of the growth substrate. The thickness of the buffer film is regulated to be smaller than that of a buffer film which is employed for epitaxially growing the Group III nitride semiconductor on a planar growth substrate uniformly in a direction perpendicular to the growth substrate. The growth temperature is regulated to be lower than a temperature at which the Group III nitride semiconductor is epitaxially grown on a planar growth substrate uniformly in a direction perpendicular to the growth substrate. The growth temperature is preferably 1,020 to 1,100° C. The buffer film employed is an AlN film having a thickness of 150 Å or less.
    • 本发明提供一种III族氮化物半导体的制造方法。 该方法包括通过蚀刻在生长衬底的表面上形成凹槽; 通过溅射在生长衬底的槽形表面上形成缓冲膜; 在含有氢和氨的气氛中将衬底加热到​​生长所关注的III族氮化物半导体的温度; 并且在生长温度下在槽的侧表面外延生长III族氮化物半导体。 调节缓冲膜的厚度或生长温度,使得III族氮化物半导体主要在平行于生长衬底主表面的方向上在槽的侧表面上生长。 缓冲膜的厚度被调节为小于在平面生长衬底上沿垂直于生长衬底的方向均匀地外延生长III III族氮化物半导体的缓冲膜的厚度。 生长温度被调节为低于在平面生长衬底上沿垂直于生长衬底的方向均匀地外延生长III族氮化物半导体的温度。 生长温度优选为1020〜1100℃。所使用的缓冲膜是厚度为150以下的AlN膜。